KR20170028888A - 비-원형 레이저 빔들을 이용한 재료의 프로세싱 - Google Patents
비-원형 레이저 빔들을 이용한 재료의 프로세싱 Download PDFInfo
- Publication number
- KR20170028888A KR20170028888A KR1020167035653A KR20167035653A KR20170028888A KR 20170028888 A KR20170028888 A KR 20170028888A KR 1020167035653 A KR1020167035653 A KR 1020167035653A KR 20167035653 A KR20167035653 A KR 20167035653A KR 20170028888 A KR20170028888 A KR 20170028888A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- pulse
- pulses
- processing
- orientation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B23K26/0057—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B23K2203/50—
-
- B23K2203/56—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14176292.2A EP2965853B2 (en) | 2014-07-09 | 2014-07-09 | Processing of material using elongated laser beams |
| EP14176292.2 | 2014-07-09 | ||
| PCT/EP2015/065615 WO2016005455A1 (en) | 2014-07-09 | 2015-07-08 | Processing of material using non-circular laser beams |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20170028888A true KR20170028888A (ko) | 2017-03-14 |
Family
ID=51176164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167035653A Withdrawn KR20170028888A (ko) | 2014-07-09 | 2015-07-08 | 비-원형 레이저 빔들을 이용한 재료의 프로세싱 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10589384B2 (enExample) |
| EP (1) | EP2965853B2 (enExample) |
| JP (1) | JP2017528322A (enExample) |
| KR (1) | KR20170028888A (enExample) |
| CN (1) | CN106536119A (enExample) |
| LT (1) | LT2965853T (enExample) |
| WO (1) | WO2016005455A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210113558A (ko) * | 2020-03-06 | 2021-09-16 | 쇼오트 아게 | 기판 엘리먼트의 분리를 준비 및/또는 수행하기 위한 방법 및 기판 서브엘리먼트 |
| KR20220016988A (ko) * | 2019-06-21 | 2022-02-10 | 트룸프 레이저-운트 시스템테크닉 게엠베하 | 적어도 하나의 공작물을 프로세싱하기 위한 방법 |
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| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| TWI659793B (zh) | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
| DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
| KR102138964B1 (ko) | 2014-11-19 | 2020-07-28 | 트룸프 레이저-운트 시스템테크닉 게엠베하 | 비대칭 광학 빔 정형을 위한 시스템 |
| DE102014116957A1 (de) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung |
| EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| EP3848334A1 (en) | 2015-03-24 | 2021-07-14 | Corning Incorporated | Alkaline earth boro-aluminosilicate glass article with laser cut edge |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| CN120350015A (zh) * | 2016-05-05 | 2025-07-22 | 宾夕法尼亚大学理事会 | 靶向检查点分子的dna单克隆抗体 |
| MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| FR3054151B1 (fr) * | 2016-07-25 | 2018-07-13 | Amplitude Systemes | Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde |
| CN109803934A (zh) | 2016-07-29 | 2019-05-24 | 康宁股份有限公司 | 用于激光处理的装置和方法 |
| WO2018044843A1 (en) | 2016-08-30 | 2018-03-08 | Corning Incorporated | Laser processing of transparent materials |
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| KR100984727B1 (ko) * | 2010-04-30 | 2010-10-01 | 유병소 | 대상물 가공 방법 및 대상물 가공 장치 |
| KR102088722B1 (ko) | 2010-07-12 | 2020-03-17 | 로핀-시나르 테크놀로지스 엘엘씨 | 레이저 필라멘테이션에 의한 재료 가공 방법 |
| JP5860228B2 (ja) | 2011-06-13 | 2016-02-16 | 株式会社ディスコ | レーザー加工装置 |
| US9029242B2 (en) * | 2011-06-15 | 2015-05-12 | Applied Materials, Inc. | Damage isolation by shaped beam delivery in laser scribing process |
| JP2013082589A (ja) * | 2011-10-11 | 2013-05-09 | V Technology Co Ltd | ガラス基板のレーザ加工装置 |
| DE102012110971B4 (de) * | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| JP2014104484A (ja) * | 2012-11-27 | 2014-06-09 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| KR101547806B1 (ko) * | 2013-07-29 | 2015-08-27 | 에이피시스템 주식회사 | 멀티 초점을 가지는 비구면 렌즈를 이용한 취성 기판 가공 장치 |
-
2014
- 2014-07-09 LT LTEP14176292.2T patent/LT2965853T/lt unknown
- 2014-07-09 EP EP14176292.2A patent/EP2965853B2/en active Active
-
2015
- 2015-07-08 CN CN201580037272.1A patent/CN106536119A/zh active Pending
- 2015-07-08 JP JP2017500887A patent/JP2017528322A/ja active Pending
- 2015-07-08 US US15/317,220 patent/US10589384B2/en active Active
- 2015-07-08 KR KR1020167035653A patent/KR20170028888A/ko not_active Withdrawn
- 2015-07-08 WO PCT/EP2015/065615 patent/WO2016005455A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220016988A (ko) * | 2019-06-21 | 2022-02-10 | 트룸프 레이저-운트 시스템테크닉 게엠베하 | 적어도 하나의 공작물을 프로세싱하기 위한 방법 |
| KR20210113558A (ko) * | 2020-03-06 | 2021-09-16 | 쇼오트 아게 | 기판 엘리먼트의 분리를 준비 및/또는 수행하기 위한 방법 및 기판 서브엘리먼트 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170120374A1 (en) | 2017-05-04 |
| JP2017528322A (ja) | 2017-09-28 |
| CN106536119A (zh) | 2017-03-22 |
| EP2965853B1 (en) | 2016-09-21 |
| WO2016005455A1 (en) | 2016-01-14 |
| LT2965853T (lt) | 2016-11-25 |
| EP2965853A1 (en) | 2016-01-13 |
| EP2965853B2 (en) | 2020-03-25 |
| US10589384B2 (en) | 2020-03-17 |
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