CN106486447B - 铜合金接合线 - Google Patents
铜合金接合线 Download PDFInfo
- Publication number
- CN106486447B CN106486447B CN201610390155.XA CN201610390155A CN106486447B CN 106486447 B CN106486447 B CN 106486447B CN 201610390155 A CN201610390155 A CN 201610390155A CN 106486447 B CN106486447 B CN 106486447B
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- CN
- China
- Prior art keywords
- copper alloy
- bonding wire
- wire
- bonding
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/85439—Silver (Ag) as principal constituent
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015168713A JP6410692B2 (ja) | 2015-08-28 | 2015-08-28 | 銅合金ボンディングワイヤ |
JP2015-168713 | 2015-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106486447A CN106486447A (zh) | 2017-03-08 |
CN106486447B true CN106486447B (zh) | 2020-03-03 |
Family
ID=58212229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610390155.XA Expired - Fee Related CN106486447B (zh) | 2015-08-28 | 2016-06-03 | 铜合金接合线 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6410692B2 (ja) |
CN (1) | CN106486447B (ja) |
SG (1) | SG10201603986XA (ja) |
TW (1) | TWI714562B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3667709A4 (en) * | 2017-08-09 | 2021-06-09 | NIPPON STEEL Chemical & Material Co., Ltd. | CU ALLOY BOND WIRE FOR SEMICONDUCTOR COMPONENTS |
KR102167478B1 (ko) * | 2017-08-09 | 2020-10-19 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 반도체 장치용 Cu 합금 본딩 와이어 |
JP7014003B2 (ja) * | 2018-03-28 | 2022-02-01 | 住友金属鉱山株式会社 | はんだ接合電極およびはんだ接合電極の被膜形成用銅合金ターゲット |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4904252B2 (ja) * | 2007-12-03 | 2012-03-28 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
WO2009072525A1 (ja) * | 2007-12-03 | 2009-06-11 | Nippon Steel Materials Co., Ltd. | 半導体装置用ボンディングワイヤ |
JP4617375B2 (ja) * | 2007-12-03 | 2011-01-26 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
JP4349641B1 (ja) * | 2009-03-23 | 2009-10-21 | 田中電子工業株式会社 | ボールボンディング用被覆銅ワイヤ |
KR101707244B1 (ko) * | 2009-07-30 | 2017-02-15 | 신닛테츠스미킹 마테리알즈 가부시키가이샤 | 반도체용 본딩 와이어 |
CN104411845B (zh) * | 2012-07-31 | 2017-03-08 | 三菱综合材料株式会社 | 铜合金线及铜合金线的制造方法 |
JP5546670B1 (ja) * | 2013-06-13 | 2014-07-09 | 田中電子工業株式会社 | 超音波接合用コーティング銅ワイヤの構造 |
-
2015
- 2015-08-28 JP JP2015168713A patent/JP6410692B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-21 TW TW105108645A patent/TWI714562B/zh not_active IP Right Cessation
- 2016-05-19 SG SG10201603986XA patent/SG10201603986XA/en unknown
- 2016-06-03 CN CN201610390155.XA patent/CN106486447B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI714562B (zh) | 2021-01-01 |
JP2017045924A (ja) | 2017-03-02 |
CN106486447A (zh) | 2017-03-08 |
TW201709363A (zh) | 2017-03-01 |
JP6410692B2 (ja) | 2018-10-24 |
SG10201603986XA (en) | 2017-03-30 |
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