CN106433552B - 用于光固化液体硅橡胶的铂催化剂和led封装胶组合物 - Google Patents
用于光固化液体硅橡胶的铂催化剂和led封装胶组合物 Download PDFInfo
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- CN106433552B CN106433552B CN201610854238.XA CN201610854238A CN106433552B CN 106433552 B CN106433552 B CN 106433552B CN 201610854238 A CN201610854238 A CN 201610854238A CN 106433552 B CN106433552 B CN 106433552B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
| 波长/nm | 相对强度 | 波长/nm | 相对强度 |
| 222.4 | 14.0 | 296.7 | 16.6 |
| 232.0 | 8.0 | 302.2~302.8 | 23.9 |
| 236.0 | 6.0 | 312.6~313.2 | 49.9 |
| 238.0 | 8.6 | 334.1 | 9.3 |
| 240.0 | 7.3 | 365.0~366.3 | 100.0 |
| 248.2 | 8.6 | 404.5~407.8 | 42.2 |
| 253.7 | 16.6 | 435.8 | 77.5 |
| 257.1 | 6.0 | 546.0 | 93.0 |
| 265.2~265.5 | 15.3 | 577.0~579.0 | 76.5 |
| 270.0 | 4.0 | 1014.0 | 40.6 |
| 275.3 | 2.7 | 1128.7 | 12.6 |
| 280.4 | 9.3 | 1357.3 | 15.3 |
| 289.4 | 6.0 |
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610854238.XA CN106433552B (zh) | 2016-09-27 | 2016-09-27 | 用于光固化液体硅橡胶的铂催化剂和led封装胶组合物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610854238.XA CN106433552B (zh) | 2016-09-27 | 2016-09-27 | 用于光固化液体硅橡胶的铂催化剂和led封装胶组合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106433552A CN106433552A (zh) | 2017-02-22 |
| CN106433552B true CN106433552B (zh) | 2019-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610854238.XA Expired - Fee Related CN106433552B (zh) | 2016-09-27 | 2016-09-27 | 用于光固化液体硅橡胶的铂催化剂和led封装胶组合物 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106433552B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119529752B (zh) * | 2025-01-07 | 2026-01-23 | 广州布鲁奥申新材料科技有限公司 | 一种光热双固化长效密封硅橡胶、制备方法及其应用 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1709974A (zh) * | 2005-06-30 | 2005-12-21 | 北京航空航天大学 | 一种抗氧化的银杂化聚酰亚胺反射膜及其制备方法 |
| CN1785509A (zh) * | 2005-11-11 | 2006-06-14 | 中山大学 | 载铂泡沫镍催化材料及其制备方法和应用 |
| CN101608115A (zh) * | 2009-04-29 | 2009-12-23 | 河北工业大学 | 一种稀土/离子液体发光软材料及其制备方法 |
| CN101851431A (zh) * | 2009-03-31 | 2010-10-06 | 比亚迪股份有限公司 | 一种塑料组合物及塑料表面金属化方法 |
| CN105295387A (zh) * | 2015-11-20 | 2016-02-03 | 福建师范大学 | 一类兼具发光和封装功能的有机/无机复合发光硅胶制备方法及其在led光源上应用 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101038750B1 (ko) * | 2009-05-20 | 2011-06-03 | 한국에너지기술연구원 | 탄소나노튜브의 내부 채널에 금속촉매 나노입자가 담지된 탄소나노튜브 촉매 및 이의 제조방법 |
| KR101106272B1 (ko) * | 2009-11-10 | 2012-01-18 | 한국에너지기술연구원 | 셀룰로오스 섬유를 원료로 사용한 높은 비표면적의 촉매지지체 제조 방법 및 지지체의 표면처리 방법, 금속나노촉매가 담지된 셀룰로오스지지체 담지 촉매 |
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2016
- 2016-09-27 CN CN201610854238.XA patent/CN106433552B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1709974A (zh) * | 2005-06-30 | 2005-12-21 | 北京航空航天大学 | 一种抗氧化的银杂化聚酰亚胺反射膜及其制备方法 |
| CN1785509A (zh) * | 2005-11-11 | 2006-06-14 | 中山大学 | 载铂泡沫镍催化材料及其制备方法和应用 |
| CN101851431A (zh) * | 2009-03-31 | 2010-10-06 | 比亚迪股份有限公司 | 一种塑料组合物及塑料表面金属化方法 |
| CN101608115A (zh) * | 2009-04-29 | 2009-12-23 | 河北工业大学 | 一种稀土/离子液体发光软材料及其制备方法 |
| CN105295387A (zh) * | 2015-11-20 | 2016-02-03 | 福建师范大学 | 一类兼具发光和封装功能的有机/无机复合发光硅胶制备方法及其在led光源上应用 |
Non-Patent Citations (3)
| Title |
|---|
| Demeric complexes of trimethylplatinum(Ⅳ) with ethylacetoacetate,methylacetoacetate,dimethylmalonate and diethylmalonate,and their pyridine and 2,2’-bipyridyl adducts;Kenneth Kite,等;《Journal of Organometallic Chemistry》;19921231;第441卷;第160页图1第161页表1 * |
| Extraction and Spectrophotometric Determination of PlatinumⅣ and PalladiumⅡ with 2-thenoyltrifluoroacetone;Anil K De,等;《The Analyst》;19641231;第89卷(第1065期);第795-799页 * |
| Synthesis of Trimethylplatinum(Ⅳ) Complexes with N,N-and N,O-Heterocyclic carbene Ligands and their reductive C-C Elimination Reaction;Lindner R,等;《Journal of the American Chemical Society》;20091231;第131卷(第25期);第8861-8874页 * |
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| CN106433552A (zh) | 2017-02-22 |
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Effective date of registration: 20211231 Address after: 572000 room 2912, 29 / F, building B (Building 2), international health resort hotel, Sanya Bay Road international passenger port area, Tianya District, Sanya City, Hainan Province Patentee after: Sanya Guangyuan new material Co.,Ltd. Address before: 621000 No. 20, horticultural street, kechuangyuan, Mianyang City, Sichuan Province Patentee before: SICHUAN RESEARCH CENTER OF NEW MATERIALS Patentee before: INSTITUTE OF CHEMICAL MATERIALS OF CHINA ACADEMY OF ENGINEERING AND PHYSICS |
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