CN106373927A - Plug-in package piece - Google Patents

Plug-in package piece Download PDF

Info

Publication number
CN106373927A
CN106373927A CN201610729812.9A CN201610729812A CN106373927A CN 106373927 A CN106373927 A CN 106373927A CN 201610729812 A CN201610729812 A CN 201610729812A CN 106373927 A CN106373927 A CN 106373927A
Authority
CN
China
Prior art keywords
plug
pin
boss
plastic shell
packaging part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610729812.9A
Other languages
Chinese (zh)
Inventor
罗义
黄乐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XI'AN SEMIPOWER ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
XI'AN SEMIPOWER ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XI'AN SEMIPOWER ELECTRONIC TECHNOLOGY Co Ltd filed Critical XI'AN SEMIPOWER ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201610729812.9A priority Critical patent/CN106373927A/en
Publication of CN106373927A publication Critical patent/CN106373927A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

The invention discloses a plug-in package piece. Bosses are arranged at a lower end of a plastic shell, pins are directly inserted into bonding pad holes of a PCB (Printed Circuit Board) during welding, so that the bosses are in contact with surfaces of bonding pads for welding. By the structure, the insertion depths of the pins of the package piece can be effectively ensured, and the package piece is enabled to be prevented from being damaged during the welding process.

Description

A kind of plug-in unit packaging part
Technical field
The invention belongs to plug-in unit encapsulating structure is and in particular to a kind of plug-in unit packaging part.
Background technology
During existing plug-in unit encapsulating structure, need plug-in unit to be encapsulated the metal of (to-220, to-251, to-247, to-3p etc.) Pin is fully inserted in the pad hole of pcb, and metal step at plug-in unit metal pin can only be relied on to control height.For example, if When the step width of metal pin is less than pcb pad hole, the pin of device will be fully inserted in pad hole, plastic packaging material directly with Pcb plate contacts, and easily causes weld failure;If the step width of metal pin is more than pcb pad hole, the pin of that device Insertion pcb pad hole is arrived and is ended at metal pin step, can not meet requirement for height.
Content of the invention
It is an object of the invention to provide a kind of plug-in unit packaging part, to overcome the deficiencies in the prior art, the present invention can have Effect solves welding and height problem.
For reaching above-mentioned purpose, the present invention adopts the following technical scheme that
A kind of plug-in unit packaging part, including plastic shell, plastic shell lower end is provided with pin, and plastic shell lower end is provided with convex Platform.
Further, wherein plastic shell lower end is provided with multiple pins.
Further, boss is plastic packaging boss.
Further, wherein boss is arranged on outside pin and plastic shell junction.
Compared with prior art, the present invention has a following beneficial technique effect:
Pin, by being provided with boss in plastic shell lower end, in welding, is directly inserted by a kind of present invention plug-in unit packaging part Enter in the pad hole of pcb, so that boss is contacted with bond pad surface, welded.This structure can effectively ensure that the pin of packaging part Insertion depth it is ensured that not damaging packaging part in welding process, meanwhile, plastic shell lower end setting boss can increase metal Creep age distance between pin.
Further, boss is plastic packaging boss, is easy to boss and fixes with plastic shell, pin is protected.
Brief description
Fig. 1 is present configuration schematic diagram.
Wherein, 1, plastic shell;2nd, pin;3rd, boss.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention is described in further detail:
As shown in figure 1, a kind of plug-in unit packaging part, including plastic shell 1, plastic shell 1 lower end is provided with pin 2, outside plastic packaging Setting control device in shell 1, pin 2 is connected with the control device in plastic shell 1;Wherein plastic shell 1 lower end be provided with multiple Pin 2, plastic shell 1 lower end is provided with boss 3, and boss 3 is plastic packaging boss, and wherein boss 3 is arranged on pin 2 and plastic shell 1 Outside junction.By arranging plastic packaging boss in plastic shell 1 lower end, in welding, directly pin 2 is inserted the pad of pcb Kong Li, is made boss 3 be contacted with bond pad surface, is welded.This structure can effectively ensure that the insertion of the pin 2 of packaging part is deep Degree is not it is ensured that damage packaging part in welding process.

Claims (4)

1. a kind of plug-in unit packaging part is it is characterised in that include plastic shell (1), plastic shell (1) lower end is provided with pin (2), moulds Envelope shell (1) lower end is provided with boss (3).
2. a kind of plug-in unit packaging part according to claim 1 it is characterised in that wherein plastic shell (1) lower end be provided with many Individual pin (2).
3. a kind of plug-in unit packaging part according to claim 1 is it is characterised in that boss (3) is plastic packaging boss.
4. a kind of plug-in unit packaging part according to claim 1 it is characterised in that wherein boss (3) be arranged on pin (2) with Outside plastic shell (1) junction.
CN201610729812.9A 2016-08-25 2016-08-25 Plug-in package piece Pending CN106373927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610729812.9A CN106373927A (en) 2016-08-25 2016-08-25 Plug-in package piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610729812.9A CN106373927A (en) 2016-08-25 2016-08-25 Plug-in package piece

Publications (1)

Publication Number Publication Date
CN106373927A true CN106373927A (en) 2017-02-01

Family

ID=57902646

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610729812.9A Pending CN106373927A (en) 2016-08-25 2016-08-25 Plug-in package piece

Country Status (1)

Country Link
CN (1) CN106373927A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1973210A (en) * 2004-06-23 2007-05-30 捷时雅株式会社 Inspection device for circuit board and inspection method for circuit board
CN101136517A (en) * 2007-08-29 2008-03-05 伊博电源(杭州)有限公司 Module power supply base pin structure
CN201263268Y (en) * 2008-07-08 2009-06-24 广州市天马电讯科技有限公司 Constant temperature crystal oscillator suitable for surface installation
CN201562779U (en) * 2009-12-04 2010-08-25 深圳创维数字技术股份有限公司 Inverse inserting-preventing socket

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1973210A (en) * 2004-06-23 2007-05-30 捷时雅株式会社 Inspection device for circuit board and inspection method for circuit board
CN101136517A (en) * 2007-08-29 2008-03-05 伊博电源(杭州)有限公司 Module power supply base pin structure
CN201263268Y (en) * 2008-07-08 2009-06-24 广州市天马电讯科技有限公司 Constant temperature crystal oscillator suitable for surface installation
CN201562779U (en) * 2009-12-04 2010-08-25 深圳创维数字技术股份有限公司 Inverse inserting-preventing socket

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170201

RJ01 Rejection of invention patent application after publication