CN106332435B - 柔性电路板及其制作方法 - Google Patents
柔性电路板及其制作方法 Download PDFInfo
- Publication number
- CN106332435B CN106332435B CN201510357587.6A CN201510357587A CN106332435B CN 106332435 B CN106332435 B CN 106332435B CN 201510357587 A CN201510357587 A CN 201510357587A CN 106332435 B CN106332435 B CN 106332435B
- Authority
- CN
- China
- Prior art keywords
- layer
- groove
- line
- flexible circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510357587.6A CN106332435B (zh) | 2015-06-24 | 2015-06-24 | 柔性电路板及其制作方法 |
TW104123793A TWI608769B (zh) | 2015-06-24 | 2015-07-22 | 柔性電路板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510357587.6A CN106332435B (zh) | 2015-06-24 | 2015-06-24 | 柔性电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106332435A CN106332435A (zh) | 2017-01-11 |
CN106332435B true CN106332435B (zh) | 2019-01-25 |
Family
ID=57729723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510357587.6A Active CN106332435B (zh) | 2015-06-24 | 2015-06-24 | 柔性电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106332435B (zh) |
TW (1) | TWI608769B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113597084B (zh) * | 2020-04-30 | 2022-08-19 | 鹏鼎控股(深圳)股份有限公司 | 挠折线路板及其制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5426399A (en) * | 1993-02-04 | 1995-06-20 | Mitsubishi Electric Corp | Film carrier signal transmission line having separating grooves |
US7202758B2 (en) * | 2004-10-04 | 2007-04-10 | Via Technologies, Inc. | Signal transmission structure having plural reference planes with non-overlapping openings |
CN101160017A (zh) * | 2006-10-02 | 2008-04-09 | 日东电工株式会社 | 布线电路基板以及电子设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007305756A (ja) * | 2006-05-11 | 2007-11-22 | Sumitomo Bakelite Co Ltd | 回路基板 |
-
2015
- 2015-06-24 CN CN201510357587.6A patent/CN106332435B/zh active Active
- 2015-07-22 TW TW104123793A patent/TWI608769B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5426399A (en) * | 1993-02-04 | 1995-06-20 | Mitsubishi Electric Corp | Film carrier signal transmission line having separating grooves |
US7202758B2 (en) * | 2004-10-04 | 2007-04-10 | Via Technologies, Inc. | Signal transmission structure having plural reference planes with non-overlapping openings |
CN101160017A (zh) * | 2006-10-02 | 2008-04-09 | 日东电工株式会社 | 布线电路基板以及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
CN106332435A (zh) | 2017-01-11 |
TW201703591A (zh) | 2017-01-16 |
TWI608769B (zh) | 2017-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170301 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
GR01 | Patent grant | ||
GR01 | Patent grant |