CN106328623B - 具有稳定的延伸引线的引线框封装体 - Google Patents

具有稳定的延伸引线的引线框封装体 Download PDF

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Publication number
CN106328623B
CN106328623B CN201511021522.0A CN201511021522A CN106328623B CN 106328623 B CN106328623 B CN 106328623B CN 201511021522 A CN201511021522 A CN 201511021522A CN 106328623 B CN106328623 B CN 106328623B
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leads
cavity
die
die pad
semiconductor package
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CN106328623A (zh
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J·塔利多
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STMicroelectronics International NV
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STMicroelectronics Inc Philippines
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
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Abstract

本申请涉及具有稳定的延伸引线的引线框封装体。本披露的实施例涉及具有悬臂式延伸部的引线框，该悬臂式延伸部包括在引线的最接近裸片焊盘的端部上的整体支撑件。与引线框为一体的支撑件允许该支撑件被构建为合适的高度以在每个封装体中支撑悬臂式引线并且减少或消除由内置到制造设备的工艺装备中的支撑件而造成或允许的向上、向下和侧对侧偏离。而且，通过将支撑件构建到引线框中，引线框可以在制造工艺的裸片附接和接线键合步骤之前被预先施加胶带。

Description

具有稳定的延伸引线的引线框封装体
技术领域
本披露的实施例涉及引线框封装体以及制造和装配无引线封装体的方法。
背景技术
在期望小尺寸封装体的应用中经常使用无引线或没有引线的封装体。通常，扁平无引线封装体提供包括平坦引线框的芯片级或接近芯片级包封的封装体。位于封装体的底表面上的焊区提供到基板(例如印刷电路板(PCB))的电连接。可以使用表面安装技术(SMT)将无引线封装体直接安装在PCB的表面上。
在引线框封装体和尤其四方扁平无引线封装体中的裸片在封装体中被接线键合到引线的各端。接线键合工艺包括用力和热来施加焊料并且将导电线附接至引线和半导体裸片。四方扁平无引线封装体中的引线可以是悬臂式的并且导电线被键合至悬臂式引线的自由端。在接线键合工艺过程中施加到引线的自由端的力使引线弯曲且变形。这种弯曲和变形可能造成在导电线与引线之间的连接中的缺陷并且可能导致引线框封装体的过早失效。
用于制造引线框封装体的工艺装备可以包括在接线键合工艺过程中支撑悬臂式引线的自由端的延伸部，但是由于制造中的变化，该延伸部可能不能适当地支撑引线的悬臂式端。例如，如果支撑件过高，引线在接线键合步骤过程中可能会朝上偏置，而如果支撑件过低，引线在接线键合步骤过程中可能会朝下偏置。工艺装备上的延伸部同样不提供对侧对侧的力的抵抗，从而允许悬臂式引线侧对侧变形，潜在地造成引线和导电线的未对准和额外的缺陷。
由与系杆连接的单元阵列组成的引线框条带可以在制造和装配工艺过程中预先施加胶带，以便于处理和有助于防止封料泄漏。在出带时，引线框条带的底表面被附接到带上，但是当工艺装备包括将悬臂式引线支撑在引线框上的延伸部时，引线框条带不能预先施加胶带，因为带干扰了延伸部支撑引线的能力。因此，当延伸部被构建到工艺装备中时，直到接线键合步骤之后才用带处理引线框条带。
发明内容
本披露的实施例涉及具有悬臂式引线的引线框，这些悬臂式引线包括在引线最接近裸片焊盘的端上的整体支撑件。与引线框一体的支撑件允许支撑件被构建为恰当的高度以在每个封装体中支撑悬臂式引线并且减少或消除由内置到制造设备的工艺装备的支撑件而造成或允许的向上、向下和侧对侧偏离。而且，通过将支撑件构建到引线框中，这些引线框可以在制造工艺的裸片附接和接线键合步骤之前预先施加胶带。
在引线框封装体制造工艺中的接线键合和包封步骤之后，可以将支撑结构蚀刻掉以在引线的悬臂式端下方产生空腔。这个空腔可以保持打开，或者，在一些实施例中，该空腔可以被再填充或密封。通过蚀刻掉或以其他方式去除支撑件，在封装体的制造过程中引线被支撑，但是去除了可能在最终器件中导致短路和其他问题的多余导电材料，从而减少或消除了在最终封装体中的潜在的短路电连接。
在本文所披露的一个实施例中，半导体封装体包括具有裸片附接表面的裸片焊盘和耦接至该裸片焊盘的该裸片附接表面的半导体裸片。半导体封装体还可以包括与该裸片焊盘的至少一侧间隔开的多条引线。该多条引线中的每一条引线都具有第一端和第二端，每一条引线带有在该多条引线中的每一条引线的第二端处的多个焊区。这些第一端比这些第二端更接近该裸片焊盘。这些引线包括从这些焊区延伸并且形成这些引线的这些第一端的悬臂梁，该悬臂梁具有第一表面和与该第一表面相反的第二表面。该半导体封装体还包括位于该半导体裸片与这些引线中的一部分引线之上的包封材料以及在该包封材料中形成的空腔，该空腔暴露这些引线的该第二表面的一部分。
附图说明
图1是根据一个实施例的半导体封装体的横截面视图的示意图。
图2是根据一个实施例的半导体封装体的横截面视图的示意图。
图3是根据一个实施例的半导体封装体的横截面视图的示意图。
图4A是根据一个实施例的引线框的横截面视图的示意图。
图4B是根据一个实施例的引线框的引线的等距视图。
图5A至图5G是横截面视图，展示了根据一个实施例在制造的不同阶段进行装配的图1至图3的封装体。
具体实施方式
图1示出了根据本披露的一个实施例制成的引线框封装体100a的横截面视图。引线框封装体100a示出了裸片焊盘102和位于裸片焊盘102的相反两侧上的两条引线107。裸片焊盘102具有上表面103和相反的下表面105并且引线107具有上表面112和下表面108。这些引线107的下表面108还可以被称为封装体100a的焊区。裸片焊盘102和这些引线107是由导电材料(例如铜或铜合金)制成的。
该封装体包括在裸片焊盘102的每一侧上的多条引线107。应理解的是，在该封装体中可以包括任何数量的引线，包括在裸片焊盘102的仅一侧上的一条引线。在一些实施例中，这些引线被提供在该裸片焊盘的两侧或四侧上。例如，这些引线可以在该封装体的两个平行侧上或在正方形或矩形封装体的四个侧上。
封装体100a进一步包括由粘合材料106耦接至裸片焊盘102的上表面103的半导体裸片104。半导体裸片104是被配置为用于发送和/或接收电信号的任何半导体裸片。例如，该半导体裸片可以是集成电路、微机电传感器(MEMS)和任何其他电子芯片。粘合材料106可以是被配置为用于在装配工艺过程中将半导体裸片104保持在位的任何材料。粘合材料106可以是双面胶带、环氧化物、胶水或用于将裸片104粘合到裸片焊盘102的上表面103的任何合适的材料。
半导体裸片104包括多个导电焊盘116，这些导电焊盘被电连接至在半导体裸片102中形成的一个或多个电路，如在本领域中公知的。多条导电线114将半导体裸片104电耦接至引线107。例如，导电线114的第一端被耦接至裸片104的导电焊盘116并且导电线114的第二端被耦接至在引线107的第一端的上表面112上的导电焊盘116。
包封材料118位于裸片104、裸片焊盘102和引线107之上，包围裸片104和导电线114。包封材料118还位于引线107和裸片焊盘102的下方并且形成封装体100a的底表面111的一部分。包封材料118可以是被配置为用于提供保护不受环境损坏源(例如腐蚀、物理损坏、水分损坏或损坏电气装置的其他原因)的任何材料。包封材料118可以是包括聚合物、聚氨酯、丙烯酸、环氧化物、硅酮或任何其他合适的材料中的一种或多种材料的模制化合物。
在一些实施例中，封装体100a包括在包封材料118中在引线107的悬臂式部分的一端下方形成的空腔120。空腔120可以经由蚀刻工艺或其他材料去除工艺来形成，其中从引线107延伸的支撑件113被蚀刻掉。该支撑件在图4A和图4B中以更多细节示出。在一些实施例中，支撑件113被完全蚀刻掉，使得引线107的悬臂式部分110的底表面109处于单个的平面中。在一些实施例中，通过仅蚀刻掉支撑件113的一部分来形成空腔120，使得支撑件113从引线107的悬臂式部分110的下表面109的平面延伸，但是支撑件113不延伸至封装体100a的底表面111。
图2示出了根据本披露的一个实施例制成的引线框封装体100b的横截面视图。引线框封装体100b类似于引线框封装体100a并且示出了裸片焊盘102和位于裸片焊盘102的相反两侧上的两条引线107。裸片焊盘102具有上表面103和相反的下表面105并且引线107具有上表面112和下表面108。
该封装体包括在裸片焊盘102的每一侧上的多条引线107。应理解的是，类似于引线框封装体100a，可以在该封装体中包括任何数量的引线，包括在裸片焊盘102的仅一侧上的一条引线107，并且在一些实施例中，这些引线107被提供在该裸片焊盘的两侧、该裸片焊盘的四侧或裸片焊盘102的任何数量的侧上。
封装体100b进一步包括由粘合材料106耦接至裸片焊盘102的上表面103的半导体裸片104。半导体裸片104包括多个导电焊盘116，这些导电焊盘被电连接至在半导体裸片102中形成的一个或多个电路，如在本领域中公知的。多条导电线114将半导体裸片104电耦接至引线107。
包封材料118位于裸片104、裸片焊盘102和引线107之上，包围裸片104和导电线114。包封材料118还位于引线107与裸片焊盘102之间并且形成封装体100b的底表面111。
封装体100b包括在包封材料118中在引线107的悬臂式部分的一端下方形成的空腔120。空腔120可以经由蚀刻工艺或其他材料去除工艺来形成，其中从引线107延伸的支撑件113被蚀刻掉。在一些实施例中，支撑件113被完全蚀刻掉，使得引线107的悬臂式部分110的底表面处于单个的平面中。在一些实施例中，通过仅蚀刻掉支撑件113的一部分来形成空腔120，使得支撑件113从引线107的悬臂式部分110的下表面的平面延伸，但是支撑件113不延伸至封装体100b的底表面111。
与在图1中所示的实施例相反，在图2中所示的实施例中，空腔120被回填以产生密封件122a。被用于填充空腔120和产生密封件122a的材料可以与包封材料118相同并且可以包括模制化合物，该模式化合物包括聚合物、聚氨酯、丙烯酸、环氧化物、硅酮或任何其他合适的材料中的一种或多种。
例如在图1中所示，对于许多应用来说，具体地，在对于外来物碎片、腐蚀和其他不利环境的影响最小化的应用中，保留空腔120未填充是合适的。在一些应用中，尤其是那些碎片、腐蚀和其他环境效果可能损害引线的暴露表面的应用中，密封该空腔可以是令人期望的，该密封可以包括回填。例如，通过用密封件122a填充空腔120，密封了引线107的先前暴露的部分，由此有助于减少腐蚀并且有助于防止由可能以其他方式进入未密封的空腔120的碎片或其他污染物可能造成的短路。
在一些实施例中，例如在图2中所示的，密封件122a的底表面123可以与封装体100b的底表面111齐平。密封件122a的底表面123还可以与这些焊区的底表面(这些引线的底表面108)齐平。以此方式，封装体的底表面111、密封件122a的底表面123和引线107的底表面108可以形成单个的平坦表面。
图3示出了根据本披露的一个实施例制成的引线框封装体100c的横截面视图。引线框封装体100c类似于引线框封装体100a和引线框封装体100b并且示出了裸片焊盘102和位于裸片焊盘102的相反两侧上的两条引线107。裸片焊盘102具有上表面103和相反的下表面105并且引线107具有上表面112和下表面108。
引线框封装体100c包括在裸片焊盘102的每一侧上的多条引线107。应理解的是，类似于引线框封装体100a，可以在该封装体中包括任何数量的引线，包括在裸片焊盘102的仅一侧上的一条引线，并且在一些实施例中，这些引线被提供在该裸片焊盘的两侧、该裸片焊盘的四侧或裸片焊盘的任何数量的侧上。
封装体100c进一步包括由粘合材料106耦接至裸片焊盘102的上表面103的半导体裸片104。半导体裸片104包括多个导电焊盘116，这些导电焊盘被电连接至在半导体裸片102中形成的一个或多个电路，如在本领域中公知的。多条导电线114将半导体裸片104电耦接至引线107。
包封材料118位于裸片104、裸片焊盘102和引线107之上，包围裸片104和导电线114。包封材料118还位于引线107与裸片焊盘102之间并且形成封装体100c的底表面111。
封装体100c包括在包封材料118中在引线107的悬臂式部分的一端下方形成的空腔120。可以经由蚀刻工艺或其他材料去除工艺来形成空腔120，其中蚀刻掉了从引线107延伸的支撑件113。在一些实施例中，完全蚀刻掉支撑件113，使得引线107的悬臂式部分110的底表面处于单个的平面中。在一些实施例中，通过仅蚀刻掉支撑件113的一部分来形成空腔120，使得支撑件113从引线107的悬臂式部分110的下表面的平面延伸，但是支撑件113不延伸至封装体100c的底表面111。
与在图1和图2中所述的实施例相反，在图3中所示的实施例中，空腔120被回填以产生具体有延伸部124的密封件122b，该延伸部延伸超出封装体100c的底表面111的平面。密封件122b的延伸部124延伸超出底表面111的平面一段距离D。
例如当封装体100c被集成到电子装置中时，延伸部124有助于将封装体100c的底表面111与封装体100c可以附接到其上的基板(例如印刷电路板)的表面分离。
电子装置的键合线厚度是填充物材料(例如焊料)的厚度，该键合线将封装体的导电元件(例如焊区)与该封装体附接到其上的基板的导电元件(例如键合焊盘)键合在一起。键合线的厚度影响在封装体与基板之间的接合的质量和成本。如果焊料或其他填充物材料的键合线厚度太厚，则浪费了填充物材料并且增加了制造成本，但是如果键合线厚度太薄，则该接合可能太弱并且容易出故障。例如，由于在这两个部分之间的热膨胀系数不同，该接合可能由于在封装体与基板之间的热膨胀大小不同所造成的疲劳而失效。因此，延伸部124将键合线的厚度D设定在可预测并可重复的高度，这提供了足够的可靠性和抗疲劳强度。延伸部124也减少了在不同的部分之间的键合线厚度的变化性并且还有助于产生可靠的接合。在图5G中示出了形成在封装体100c与基板50之间的这种接合的实例。
现将参照图4A和图4B来描述空引线框101的实施例。图4A示出了空引线框101的横截面并且图4B示出了引线框101的引线110的等距视图。
图4A示出了根据本披露的一个实施例制成的引线框101的横截面视图。引线框101包括裸片焊盘102和位于裸片焊盘102的相反两侧上的两条引线107。裸片焊盘102具有上表面103和相反的下表面105并且引线107具有上表面112和下表面108。
引线107包括悬臂式部分110，该悬臂式部分从该引线的离裸片焊盘102最远的一端延伸并且在最接近裸片焊盘102的一端处由支撑结构113支撑。悬臂式部分110还包括下表面109，该下表面处于与包括该焊区的下表面108的平面不同的平面。
图4B示出了可以与裸片焊盘102间隔开的多条引线107的细节等距视图。在图4B中所示的实施例中，支撑结构113是沿引线框101的长度延伸的连续杆。支撑结构113从该多条引线107中的每一条引线的悬臂式部分110的端部延伸，并且连接这些端部。
通过将多条引线107的端部连接在一起，支撑结构113有助于防止引线107的悬臂式部分110在上和下方向(在图4A中的上和下)中以及侧对侧方向(在图4A中进入和离开页面的方向)中的偏离。
在一些实施例中，引线框101可以具有多个支撑结构113。该多个支撑结构113中的每个支撑结构都可以从多条引线107延伸并且连接至该多条引线。
在一些实施例中，单个的支撑结构113可以从引线107的单个的、对应的、悬臂式部分110延伸，使得每个支撑结构113都是其他每个支撑结构113相互独立的。独立的支撑结构不以与所连接的支撑结构113将抵抗的相同的方式来抵抗引线107的悬臂式部分110的侧对侧移动，但是在以下关于图5D描述的去除工艺过程中，这种支撑结构可以需要比所连接的支撑结构113更少的材料蚀刻。
图5A到图5G根据本文所披露的一个或多个实施例展示了制造图1到图3的封装体100a、100b、100c的不同阶段。
图5A示出了引线框101和生产引线框封装体的方法的实施例的一部分。引线框101是导电材料，例如金属，并且在一些实施例中是由铜或铜合金制成的。引线框101被形成为具有裸片焊盘102和多条引线107。如在图5A中所示出的，带130被施加到引线框101的底表面103、115、108。在一些实施例中，引线框101可以是在带130被施加到其上的条带中被连接在一起的多个引线框之一。
图5B是生产引线框封装体的方法的实施例的另一部分。如在图5B中所示出的，粘合材料106被施加至裸片焊盘102的顶表面103。在施加粘合材料106之后，裸片104被附接至引线框101的裸片焊盘102。
在安装裸片104之后，导电线114被附接在该裸片与引线107之间。导电线114的第一端被附接至在裸片104上的导电焊盘116并且导电线114的第二端被附接至在相邻引线107的一端处的导电焊盘116。在这个工艺的过程中，支撑结构113支撑引线107的悬臂式部分110并且有助于减少或防止引线107的悬臂式部分110的偏离。
如在图5C中所示出的，在安装导电线114之后，包封材料118被形成在引线框101之上，使得包封材料118包围裸片102、导电线114以及引线107的上表面112和下表面109。可以通过常规技术例如通过模制工艺将包封材料118形成在引线框101上，并且在一些实施例中，该包封材料在凝固步骤的过程中硬化。
如在图5D中所示，在引线框101之上形成包封材料118之后，可以从引线框101的底表面去除带130。支撑结构113的去除和空腔120的形成也在图5D中示出。使用标准半导体工艺技术来形成空腔120，包括以光敏材料和蚀刻技术进行图案化。在一些实施例中，例如在支撑结构113从多条引线107的悬臂式部分110延伸并且对其进行连接的实施例中，该空腔可以是狭长的沟槽。在每条引线107都具有独立的支撑结构113的实施例中，可以形成多个独立的空腔120，该多个独立的空腔中的每一个空腔都在引线107的下方。在一些实施例中，引线框封装体100a可以在形成空腔120之后完成并且可以被后续地耦接至基板(例如印刷电路板)。
在图5E中，用密封件122a来密封空腔120，该密封件具有在与引线框封装体100b的底表面111相同的平面中并且还在与引线107的底表面108(焊区)相同的平面中的底表面。在一些实施例中，引线框封装体100b可以在形成空腔120之后完成并且可以被后续地耦接至基板(例如印刷电路板)。
在图5F中，用包括延伸部124的密封件122b来密封空腔120，该延伸部延伸超出引线框封装体100c的底表面111的平面一段距离并且还超出引线107底表面108(焊区)的平面一段距离。在一些实施例中，例如在图5G中所示，引线框封装体100c可以在形成空腔120之后完成并且可以被后续地耦接至基板(如印刷电路板)。
在图5G中，经由填充物材料54将引线框封装体100c耦接至基板50，该填充物材料可以是焊料。可以经由焊料将引线框封装体100c的焊区108耦接至基板50的导电焊盘52。以此方式，来自裸片104的电子信号可以经过导电线114、然后经过引线107、填充物材料54并且进入基板50。
填充物材料的键合线厚度可以大致等于代表该距离的距离D。延伸部124延伸超出引线框封装体100c的底表面111的平面。
上面所描述的各个实施例可以被组合以提供进一步的实施例。在本说明书中所提及的和/或在申请资料表中所列出的所有美国专利、美国专利申请公开、美国专利申请、外国专利、外国专利申请和非专利公开都以其全文通过引用结合在此。如有必要，可以对实施例的各方面进行修改，以利用各专利、申请和公开的概念来提供更进一步的实施例。
鉴于以上的详细说明，可以对实施例做出这些和其他改变。总之，在以下权利要求书中，所使用的术语不应当被解释为将权利要求书局限于本说明书和权利要求书中所披露的特定实施例，而是应当被解释为包括所有可能的实施例、连同这些权利要求有权获得的等效物的整个范围。相应地，权利要求书并不受到本披露的限制。

Claims (20)

1.一种半导体封装体，包括：
具有裸片附接表面的裸片焊盘；
半导体裸片，所述半导体裸片耦接至所述裸片焊盘的所述裸片附接表面；
与所述裸片焊盘的至少一侧间隔开的多条引线，所述多条引线具有多个第一端和多个第二端，所述第一端比所述第二端离所述裸片焊盘更近，
在所述多条引线中的每一条引线的所述第二端处的多个焊区；
从所述焊区延伸并且形成所述引线的所述第一端的悬臂梁，所述悬臂梁具有第一表面和与所述第一表面相反的第二表面；
位于所述半导体裸片和所述引线的一部分之上的包封材料，所述包封材料包封所述第一表面和所述第二表面；以及
在所述包封材料中的单个连续空腔，所述空腔暴露所述悬臂梁的所述第二表面处的所述多条引线的所述第一端，并且将所述包封材料的表面暴露于所述半导体封装体外部的环境，所述单个连续空腔是通过去除位于所述引线的相邻的第一端之间的整体延伸部以及在所述悬臂梁的所述第二表面下方的所述引线的所述第一端的部分而形成的。
2.如权利要求1所述半导体封装体，进一步包括将所述半导体裸片耦接到所述悬臂梁的所述第一表面上的导电线，所述空腔被形成在所述引线的所述第一端处。
3.如权利要求1所述的半导体封装体，其中，所述空腔是暴露所述多条引线的所述第二表面的所述一部分的沟槽。
4.如权利要求1所述的半导体封装体，其中，所述空腔是多个空腔中的第一空腔，所述多个空腔中的每一个空腔暴露对应的引线的所述第二表面的一部分。
5.如权利要求1所述的半导体封装体，其中，所述空腔以填充物材料来填充。
6.如权利要求5所述的半导体封装体，其中，所述填充物材料与所述包封材料相同。
7.如权利要求6所述的半导体封装体，其中，以填充物材料填充的所述空腔与所述包封材料的表面齐平。
8.如权利要求6所述的半导体封装体，其中，以填充物材料填充的所述空腔从所述包封材料的表面凸出，从而形成被配置为用于设定焊接点的键合线厚度的间隔物。
9.一种电子装置，包括：
半导体封装体，所述半导体封装体包括：
具有裸片附接表面的裸片焊盘；
半导体裸片，所述半导体裸片耦接至所述裸片焊盘的所述裸片附接表面；
位于所述裸片焊盘的至少一侧附近并且与其间隔开的多条引线，所述多条引线具有多个第一端和多个第二端，所述第一端比所述第二端离所述裸片焊盘更近，
在所述多条引线中的每一条引线的所述第二端处的多个焊区；
从所述焊区延伸并且形成所述引线的所述第一端的悬臂梁，所述悬臂梁具有第一表面和与所述第一表面相反的第二表面
位于所述半导体裸片和所述引线的一部分之上的包封材料，所述包封材料包封所述第一表面和所述第二表面；以及
在所述包封材料中形成的单个连续空腔，所述空腔暴露所述悬臂梁的所述第二表面处的所述多条引线的所述第一端，并且将所述包封材料的表面暴露于所述半导体封装体外部的环境，所述单个连续空腔是通过去除位于所述引线的相邻的第一端之间的整体延伸部以及在所述悬臂梁的所述第二表面下方的所述引线的所述第一端的部分而形成的；
具有多个导电焊盘的基板；以及
多个导电凸块，所述导电凸块将所述半导体封装体的所述焊区耦接到所述基板的多个焊盘上。
10.如权利要求9所述的电子装置，其中，以填充物材料填充的所述空腔与所述包封材料的表面齐平。
11.根据权利要求9所述的电子装置，进一步包括：
间隔物，所述间隔物填充所述空腔并且延伸超出所述半导体封装体的下表面第一距离。
12.如权利要求11所述的电子装置，其中，将所述半导体封装体的所述焊区耦接至所述基板的多个焊盘的所述导电凸块的键合线厚度大致等于所述第一距离。
13.一种形成半导体封装体的方法，所述方法包括：
将半导体裸片附接到裸片焊盘的表面上；
将所述半导体裸片电耦接至多条引线，所述多条引线位于所述裸片焊盘的至少一侧附近并且与其间隔开，所述多条引线具有第一端和第二端，其中多个焊区位于所述引线的所述第二端处，并且接线键合表面位于所述引线的所述第一端处，其中悬臂梁从所述焊区延伸并且形成所述引线的所述第一端，其中多个整体延伸部位于所述引线的相邻的第一端之间并且与所述裸片焊盘间隔开，其中所述整体延伸部支撑所述引线的所述相邻的第一端，所述第一端比所述第二端更接近所述裸片焊盘；
包封所述半导体裸片；并且
去除所述整体延伸部以及在所述接线键合表面之下的所述引线的所述第一端的部分，以形成在所述引线的所述第一端下方的空腔。
14.如权利要求13所述的方法，进一步包括将所述第一端下方的所述空腔密封。
15.如权利要求13所述的方法，进一步包括用环氧化物密封所述第一端下方的所述空腔。
16.如权利要求13所述的方法，进一步包括用硅酮密封所述第一端下方的所述空腔。
17.如权利要求13所述的方法，进一步包括用密封结构密封所述第一端下方的所述空腔，所述密封结构从所述焊区的底表面延伸第一距离。
18.如权利要求17所述的方法，进一步包括用焊料将印刷电路板耦接至所述焊区。
19.如权利要求18所述的方法，其中，密封结构接触所述印刷电路板。
20.如权利要求18所述的方法，其中，所述焊料具有大致等于所述第一距离的键合线厚度。
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