CN106316089B - 基板分割装置及基板分割方法 - Google Patents

基板分割装置及基板分割方法 Download PDF

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Publication number
CN106316089B
CN106316089B CN201610329130.9A CN201610329130A CN106316089B CN 106316089 B CN106316089 B CN 106316089B CN 201610329130 A CN201610329130 A CN 201610329130A CN 106316089 B CN106316089 B CN 106316089B
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China
Prior art keywords
substrate
bonded
pressing
end portion
stage
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CN201610329130.9A
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English (en)
Chinese (zh)
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CN106316089A (zh
Inventor
西尾仁孝
高松生芳
上野勉
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN106316089A publication Critical patent/CN106316089A/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN201610329130.9A 2015-07-03 2016-05-18 基板分割装置及基板分割方法 Active CN106316089B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-134087 2015-07-03
JP2015134087A JP6582630B2 (ja) 2015-07-03 2015-07-03 基板分断装置及び基板分断方法

Publications (2)

Publication Number Publication Date
CN106316089A CN106316089A (zh) 2017-01-11
CN106316089B true CN106316089B (zh) 2021-04-02

Family

ID=57726358

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610329130.9A Active CN106316089B (zh) 2015-07-03 2016-05-18 基板分割装置及基板分割方法

Country Status (4)

Country Link
JP (1) JP6582630B2 (ko)
KR (1) KR20170004841A (ko)
CN (1) CN106316089B (ko)
TW (1) TWI698319B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017095294A (ja) * 2015-11-20 2017-06-01 三星ダイヤモンド工業株式会社 基板分断装置
JP2019107779A (ja) * 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 ピックアップユニット
JP2019109292A (ja) * 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 端材除去装置、及び、端材除去方法
KR102023453B1 (ko) * 2018-03-28 2019-09-20 주식회사 카이테크 기판 분할 장치 및 기판 분할 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06205757A (ja) * 1993-01-07 1994-07-26 Hitachi Ltd 核磁気共鳴検査装置
JPH06305757A (ja) * 1993-04-16 1994-11-01 Citizen Watch Co Ltd 表示パネル用基板ガラス分割装置
JP3088327B2 (ja) * 1997-03-24 2000-09-18 鹿児島日本電気株式会社 ガラス基板分断方法
JP2001163642A (ja) * 1999-12-09 2001-06-19 Toyota Autom Loom Works Ltd 貼り合わせガラスパネルの取り出し装置
JP2007156310A (ja) * 2005-12-08 2007-06-21 Nec Lcd Technologies Ltd 液晶パネルの製造方法
KR100959104B1 (ko) * 2008-07-16 2010-05-25 삼성모바일디스플레이주식회사 평판 디스플레이 패널 절단 장치
JP6205757B2 (ja) 2013-03-07 2017-10-04 オムロン株式会社 制御システム、制御装置、画像処理装置、および、制御方法
JP6163341B2 (ja) 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP2014214054A (ja) * 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置
JP6105414B2 (ja) * 2013-07-08 2017-03-29 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置

Also Published As

Publication number Publication date
TW201714721A (zh) 2017-05-01
TWI698319B (zh) 2020-07-11
KR20170004841A (ko) 2017-01-11
JP2017013418A (ja) 2017-01-19
JP6582630B2 (ja) 2019-10-02
CN106316089A (zh) 2017-01-11

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