CN106133183B - 用于有机材料的蒸发源 - Google Patents

用于有机材料的蒸发源 Download PDF

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Publication number
CN106133183B
CN106133183B CN201480077377.5A CN201480077377A CN106133183B CN 106133183 B CN106133183 B CN 106133183B CN 201480077377 A CN201480077377 A CN 201480077377A CN 106133183 B CN106133183 B CN 106133183B
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China
Prior art keywords
evaporation source
evaporation
distribution
source array
array according
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CN201480077377.5A
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English (en)
Chinese (zh)
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CN106133183A (zh
Inventor
S·邦格特
J·M·迭戈兹-坎波
U·舒斯勒
A·鲁普
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201480077377.5A 2014-03-21 2014-03-21 用于有机材料的蒸发源 Active CN106133183B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/055741 WO2015139776A1 (en) 2014-03-21 2014-03-21 Evaporation source for organic material

Publications (2)

Publication Number Publication Date
CN106133183A CN106133183A (zh) 2016-11-16
CN106133183B true CN106133183B (zh) 2020-03-03

Family

ID=50382442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480077377.5A Active CN106133183B (zh) 2014-03-21 2014-03-21 用于有机材料的蒸发源

Country Status (7)

Country Link
US (1) US20170092899A1 (enExample)
EP (1) EP3119919A1 (enExample)
JP (1) JP6466469B2 (enExample)
KR (1) KR101983213B1 (enExample)
CN (1) CN106133183B (enExample)
TW (1) TWI653350B (enExample)
WO (1) WO2015139776A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6937549B2 (ja) * 2016-06-10 2021-09-22 株式会社ジャパンディスプレイ 発光素子の製造装置
KR102188702B1 (ko) * 2016-12-14 2020-12-08 어플라이드 머티어리얼스, 인코포레이티드 증착 시스템
CN108456855B (zh) * 2017-02-17 2024-09-03 京东方科技集团股份有限公司 坩埚、蒸镀准备装置、蒸镀设备及蒸镀方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
CN109154063A (zh) * 2017-04-28 2019-01-04 应用材料公司 真空系统和用于在基板上沉积多个材料的方法
CN106987809A (zh) * 2017-05-17 2017-07-28 大连交通大学 一种有机真空蒸发源
CN107299322A (zh) * 2017-08-07 2017-10-27 旭科新能源股份有限公司 一种立式低温蒸发束源炉
CN111344433A (zh) * 2017-11-16 2020-06-26 应用材料公司 冷却沉积源的方法、用于冷却沉积源的腔室和沉积系统
CN111902563A (zh) * 2018-03-28 2020-11-06 应用材料公司 真空处理设备以及用于处理基板的方法
CN110691861A (zh) * 2018-05-04 2020-01-14 应用材料公司 用于沉积蒸发材料的蒸发源、真空沉积系统和用于沉积蒸发材料的方法
TWI719388B (zh) * 2019-01-16 2021-02-21 臺灣永光化學工業股份有限公司 負型感光性樹脂組成物及其用途
CN109817842B (zh) * 2019-01-16 2021-10-01 京东方科技集团股份有限公司 一种真空干燥装置、显示用基板的制备方法
KR102709259B1 (ko) * 2019-07-25 2024-09-23 어플라이드 머티어리얼스, 인코포레이티드 수직 배향으로 oled 층 스택을 증발시키기 위한 시스템 및 방법
JP7409799B2 (ja) * 2019-07-29 2024-01-09 キヤノントッキ株式会社 ノズルユニット，坩堝，蒸発源及び蒸着装置
US11732345B2 (en) * 2020-06-04 2023-08-22 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber
CN111945116A (zh) * 2020-08-14 2020-11-17 云谷（固安）科技有限公司 一种蒸镀设备和蒸镀方法
WO2025088368A1 (en) * 2023-10-27 2025-05-01 Applied Materials, Inc. Method of coating a substrate and evaporation source arrangement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2204467A1 (en) * 2008-12-23 2010-07-07 Applied Materials, Inc. Method and apparatus for depositing mixed layers
DE102010041376A1 (de) * 2009-09-25 2011-04-07 Von Ardenne Anlagentechnik Gmbh Verdampfereinrichtung für eine Beschichtungsanlage und Verfahren zur Koverdampfung von mindestens zwei Substanzen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904958A (en) * 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
EP1505167B1 (en) * 2003-08-04 2014-09-17 LG Display Co., Ltd. Evaporation source
KR20090130559A (ko) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 이송 장치 및 이를 구비하는 유기물 증착 장치
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
KR101288307B1 (ko) * 2011-05-31 2013-07-22 주성엔지니어링(주) 증발 증착 장치 및 증발 증착 방법
KR20130068926A (ko) * 2011-12-16 2013-06-26 주식회사 원익아이피에스 증발원 및 이를 구비한 진공 증착 장치
JP2013211137A (ja) * 2012-03-30 2013-10-10 Samsung Display Co Ltd 真空蒸着方法及びその装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2204467A1 (en) * 2008-12-23 2010-07-07 Applied Materials, Inc. Method and apparatus for depositing mixed layers
DE102010041376A1 (de) * 2009-09-25 2011-04-07 Von Ardenne Anlagentechnik Gmbh Verdampfereinrichtung für eine Beschichtungsanlage und Verfahren zur Koverdampfung von mindestens zwei Substanzen

Also Published As

Publication number Publication date
US20170092899A1 (en) 2017-03-30
CN106133183A (zh) 2016-11-16
KR101983213B1 (ko) 2019-05-28
JP6466469B2 (ja) 2019-02-06
JP2017509796A (ja) 2017-04-06
KR20160135353A (ko) 2016-11-25
TW201602373A (zh) 2016-01-16
WO2015139776A1 (en) 2015-09-24
TWI653350B (zh) 2019-03-11
EP3119919A1 (en) 2017-01-25

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