CN106102189B - 加热器单元和热处理装置 - Google Patents

加热器单元和热处理装置 Download PDF

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Publication number
CN106102189B
CN106102189B CN201610423627.7A CN201610423627A CN106102189B CN 106102189 B CN106102189 B CN 106102189B CN 201610423627 A CN201610423627 A CN 201610423627A CN 106102189 B CN106102189 B CN 106102189B
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CN
China
Prior art keywords
heat
gas
insulating material
main part
heat source
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CN201610423627.7A
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English (en)
Chinese (zh)
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CN106102189A (zh
Inventor
中西识
藤田翁堂
福田洋人
巽智彦
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JTEKT Thermo Systems Corp
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Koyo Thermo Systems Co Ltd
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Publication date
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Publication of CN106102189A publication Critical patent/CN106102189A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Furnace Details (AREA)
  • Drying Of Solid Materials (AREA)
  • Resistance Heating (AREA)
CN201610423627.7A 2012-07-12 2013-07-09 加热器单元和热处理装置 Active CN106102189B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012156142A JP6076631B2 (ja) 2012-07-12 2012-07-12 ヒータユニットおよび熱処理装置
JP2012-156142 2012-07-12
CN201310286664.4A CN103546996B (zh) 2012-07-12 2013-07-09 加热器单元和热处理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201310286664.4A Division CN103546996B (zh) 2012-07-12 2013-07-09 加热器单元和热处理装置

Publications (2)

Publication Number Publication Date
CN106102189A CN106102189A (zh) 2016-11-09
CN106102189B true CN106102189B (zh) 2019-09-03

Family

ID=49969948

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610423627.7A Active CN106102189B (zh) 2012-07-12 2013-07-09 加热器单元和热处理装置
CN201310286664.4A Active CN103546996B (zh) 2012-07-12 2013-07-09 加热器单元和热处理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201310286664.4A Active CN103546996B (zh) 2012-07-12 2013-07-09 加热器单元和热处理装置

Country Status (3)

Country Link
JP (1) JP6076631B2 (ko)
KR (1) KR101969044B1 (ko)
CN (2) CN106102189B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105202890A (zh) * 2015-10-27 2015-12-30 无锡太湖阳山水蜜桃科技有限公司 一种花粉颗粒烘干机
DE102017011312A1 (de) * 2017-12-08 2019-06-13 Broetje-Automation Gmbh Vorrichtung zum Herstellen von Vorformlingen
CN108225024B (zh) * 2018-03-15 2023-09-19 重庆科技学院 废弃物连续处理旋转实验炉
KR102030927B1 (ko) * 2018-05-10 2019-10-10 경북대학교 산학협력단 필름 어닐링장치
JP7105656B2 (ja) * 2018-09-10 2022-07-25 株式会社ジェイテクトサーモシステム 熱処理装置、および、熱処理方法
KR102174429B1 (ko) 2020-01-09 2020-11-04 조성희 부단수터닝 차단밸브
KR102559562B1 (ko) * 2021-03-11 2023-07-27 주식회사 한국제이텍트써모시스템 열처리 오븐의 배기 덕트 일체형 히터 유닛
KR102551053B1 (ko) * 2021-05-12 2023-07-05 주식회사 한국제이텍트써모시스템 열처리 오븐의 히터 유닛

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01296617A (ja) * 1988-05-25 1989-11-30 Fujitsu Ltd 石英ランプ加熱装置
CN101311659A (zh) * 2007-05-22 2008-11-26 爱斯佩克株式会社 热处理装置
CN102031567A (zh) * 2009-09-26 2011-04-27 东京毅力科创株式会社 热处理装置和冷却方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210648A (ja) * 1988-06-27 1990-01-16 Matsushita Electric Works Ltd 赤外線照射装置
JP3380988B2 (ja) * 1993-04-21 2003-02-24 東京エレクトロン株式会社 熱処理装置
JPH07270091A (ja) * 1994-03-29 1995-10-20 Tetsudo Kizai Kogyo Kk 冷却板表面での結露を防止した放射熱交換式冷却装置
JP3088250B2 (ja) 1994-10-28 2000-09-18 日本電気株式会社 乾燥装置
KR20000003799U (ko) * 1998-07-29 2000-02-25 구자홍 할로겐램프를 구비한 전자레인지의 냉각구조.
WO2002052062A1 (fr) * 2000-12-27 2002-07-04 Tokyo Electron Limited Dispositif de traitement
JP4042592B2 (ja) * 2003-03-05 2008-02-06 ウシオ電機株式会社 加熱装置
JP4696736B2 (ja) * 2005-07-12 2011-06-08 ウシオ電機株式会社 光加熱装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01296617A (ja) * 1988-05-25 1989-11-30 Fujitsu Ltd 石英ランプ加熱装置
CN101311659A (zh) * 2007-05-22 2008-11-26 爱斯佩克株式会社 热处理装置
CN102031567A (zh) * 2009-09-26 2011-04-27 东京毅力科创株式会社 热处理装置和冷却方法

Also Published As

Publication number Publication date
CN106102189A (zh) 2016-11-09
CN103546996A (zh) 2014-01-29
KR101969044B1 (ko) 2019-04-15
KR20140009017A (ko) 2014-01-22
JP6076631B2 (ja) 2017-02-08
CN103546996B (zh) 2016-08-10
JP2014022042A (ja) 2014-02-03

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