JP2014022042A - ヒータユニットおよび熱処理装置 - Google Patents
ヒータユニットおよび熱処理装置 Download PDFInfo
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- JP2014022042A JP2014022042A JP2012156142A JP2012156142A JP2014022042A JP 2014022042 A JP2014022042 A JP 2014022042A JP 2012156142 A JP2012156142 A JP 2012156142A JP 2012156142 A JP2012156142 A JP 2012156142A JP 2014022042 A JP2014022042 A JP 2014022042A
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- gas
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- 239000007789 gas Substances 0.000 claims abstract description 74
- 239000000112 cooling gas Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims description 54
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 10
- 239000011810 insulating material Substances 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Furnace Details (AREA)
- Drying Of Solid Materials (AREA)
- Resistance Heating (AREA)
Abstract
【解決手段】本発明の熱処理装置10は、熱処理炉1、熱源21、透光部材3、およびガス流通機構4を備える。熱処理炉1は被処理品を収容するものである。熱源21は、赤外線を放射するものが用いられる。透光部材3は、熱源21に対向して配設され、熱源21を雰囲気から分離するものである。透光部材3は、熱源21から放射される赤外線の少なくとも一部を透過させる材料で形成される。ガス流通機構4は、熱源21と透光部材3との間に形成される空間300に冷却ガスを流通させるように構成される。
【選択図】 図1
Description
1…熱処理炉
2…ヒータ
21…熱源
22…断熱材
3…透光部材
4…ガス流通機構
41…ガス導入管
41’…ガス導入口
41…ガス排出管
42…ガス排出管
42’…ガス排出口
43…送風機
44…送気管
5…支持部材
22A…胴体部
22B…フランジ部
100…被処理品
200…ヒータユニット
300…熱源と透光部材との間に形成される空間
Claims (10)
- 赤外線を放射する熱源と、
前記熱源に対向配置され、前記熱源を雰囲気から分離するとともに、前記赤外線の少なくとも一部を透過させる透光部材と、
前記熱源と前記透光部材との間に形成される空間に冷却ガスを流通させるように構成されるガス流通機構と、
を備えるヒータユニット。 - 前記ガス流通機構は、前記空間に接続されるガス導入口およびガス排出口を備え、前記ガス流入口から前記冷却ガスを導入し、前記空間に流通させ、前記ガス排出口から排出させる、請求項1に記載のヒータユニット。
- 前記透光部材が石英ガラス製である、請求項1または2に記載のヒータユニット。
- 被処理品を収容する熱処理炉と、
赤外線を放射する熱源と、
前記熱源に対向配置され、前記熱源を前記熱処理炉内の雰囲気から分離するとともに、前記赤外線の少なくとも一部を透過させる透光部材と、
前記熱源と前記透光部材との間に形成される空間に冷却ガスを流通させるように構成されるガス流通機構と、
を有する熱処理装置。 - 前記ガス流通機構は、前記空間に接続されるガス導入管およびガス排出管を備え、前記ガス導入管から前記冷却ガスを導入し、前記空間に流通させ、前記ガス排出管から排出させる、請求項4に記載の熱処理装置。
- 前記ガス導入管および前記ガス排出管が前記熱処理炉に埋設される、請求項5に記載の熱処理装置。
- 前記ガス流通機構は、ガス流生成装置をさらに備える、請求項5または6に記載の熱処理装置。
- 前記冷却ガスが大気である、請求項4〜7のいずれかに記載の熱処理装置。
- 前記透光部材が石英ガラス製である、請求項4〜7のいずれかに記載の熱処理装置。
- 前記熱処理炉内における前記透光部材の赤外線出射側に対向する領域へ前記被処理品を移動させる移動手段をさらに有する、請求項4〜9のいずれかに記載の熱処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012156142A JP6076631B2 (ja) | 2012-07-12 | 2012-07-12 | ヒータユニットおよび熱処理装置 |
KR1020130054347A KR101969044B1 (ko) | 2012-07-12 | 2013-05-14 | 히터 유닛 및 열처리 장치 |
CN201610423627.7A CN106102189B (zh) | 2012-07-12 | 2013-07-09 | 加热器单元和热处理装置 |
CN201310286664.4A CN103546996B (zh) | 2012-07-12 | 2013-07-09 | 加热器单元和热处理装置 |
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JP2012156142A JP6076631B2 (ja) | 2012-07-12 | 2012-07-12 | ヒータユニットおよび熱処理装置 |
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JP2014022042A true JP2014022042A (ja) | 2014-02-03 |
JP6076631B2 JP6076631B2 (ja) | 2017-02-08 |
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JP2012156142A Active JP6076631B2 (ja) | 2012-07-12 | 2012-07-12 | ヒータユニットおよび熱処理装置 |
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JP (1) | JP6076631B2 (ja) |
KR (1) | KR101969044B1 (ja) |
CN (2) | CN103546996B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102030927B1 (ko) * | 2018-05-10 | 2019-10-10 | 경북대학교 산학협력단 | 필름 어닐링장치 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105202890A (zh) * | 2015-10-27 | 2015-12-30 | 无锡太湖阳山水蜜桃科技有限公司 | 一种花粉颗粒烘干机 |
DE102017011312A1 (de) * | 2017-12-08 | 2019-06-13 | Broetje-Automation Gmbh | Vorrichtung zum Herstellen von Vorformlingen |
CN108225024B (zh) * | 2018-03-15 | 2023-09-19 | 重庆科技学院 | 废弃物连续处理旋转实验炉 |
JP7105656B2 (ja) * | 2018-09-10 | 2022-07-25 | 株式会社ジェイテクトサーモシステム | 熱処理装置、および、熱処理方法 |
KR102174429B1 (ko) | 2020-01-09 | 2020-11-04 | 조성희 | 부단수터닝 차단밸브 |
KR102559562B1 (ko) * | 2021-03-11 | 2023-07-27 | 주식회사 한국제이텍트써모시스템 | 열처리 오븐의 배기 덕트 일체형 히터 유닛 |
KR102551053B1 (ko) * | 2021-05-12 | 2023-07-05 | 주식회사 한국제이텍트써모시스템 | 열처리 오븐의 히터 유닛 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004273125A (ja) * | 2003-03-05 | 2004-09-30 | Ushio Inc | 加熱装置 |
JP2007026698A (ja) * | 2005-07-12 | 2007-02-01 | Ushio Inc | 光加熱装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2640968B2 (ja) * | 1988-05-25 | 1997-08-13 | 富士通株式会社 | 石英ランプ加熱装置 |
JPH0210648A (ja) * | 1988-06-27 | 1990-01-16 | Matsushita Electric Works Ltd | 赤外線照射装置 |
JP3380988B2 (ja) * | 1993-04-21 | 2003-02-24 | 東京エレクトロン株式会社 | 熱処理装置 |
JPH07270091A (ja) * | 1994-03-29 | 1995-10-20 | Tetsudo Kizai Kogyo Kk | 冷却板表面での結露を防止した放射熱交換式冷却装置 |
JP3088250B2 (ja) | 1994-10-28 | 2000-09-18 | 日本電気株式会社 | 乾燥装置 |
KR20000003799U (ko) * | 1998-07-29 | 2000-02-25 | 구자홍 | 할로겐램프를 구비한 전자레인지의 냉각구조. |
KR100881786B1 (ko) * | 2000-12-27 | 2009-02-03 | 도쿄엘렉트론가부시키가이샤 | 처리 장치 |
JP4630307B2 (ja) * | 2007-05-22 | 2011-02-09 | エスペック株式会社 | 熱処理装置 |
JP5504793B2 (ja) * | 2009-09-26 | 2014-05-28 | 東京エレクトロン株式会社 | 熱処理装置及び冷却方法 |
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- 2012-07-12 JP JP2012156142A patent/JP6076631B2/ja active Active
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- 2013-05-14 KR KR1020130054347A patent/KR101969044B1/ko active IP Right Grant
- 2013-07-09 CN CN201310286664.4A patent/CN103546996B/zh active Active
- 2013-07-09 CN CN201610423627.7A patent/CN106102189B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004273125A (ja) * | 2003-03-05 | 2004-09-30 | Ushio Inc | 加熱装置 |
JP2007026698A (ja) * | 2005-07-12 | 2007-02-01 | Ushio Inc | 光加熱装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102030927B1 (ko) * | 2018-05-10 | 2019-10-10 | 경북대학교 산학협력단 | 필름 어닐링장치 |
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Publication number | Publication date |
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JP6076631B2 (ja) | 2017-02-08 |
CN103546996A (zh) | 2014-01-29 |
KR20140009017A (ko) | 2014-01-22 |
KR101969044B1 (ko) | 2019-04-15 |
CN106102189A (zh) | 2016-11-09 |
CN103546996B (zh) | 2016-08-10 |
CN106102189B (zh) | 2019-09-03 |
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