CN106102189B - Unit heater and annealing device - Google Patents
Unit heater and annealing device Download PDFInfo
- Publication number
- CN106102189B CN106102189B CN201610423627.7A CN201610423627A CN106102189B CN 106102189 B CN106102189 B CN 106102189B CN 201610423627 A CN201610423627 A CN 201610423627A CN 106102189 B CN106102189 B CN 106102189B
- Authority
- CN
- China
- Prior art keywords
- heat
- gas
- insulating material
- main part
- heat source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000137 annealing Methods 0.000 title claims abstract description 33
- 239000007789 gas Substances 0.000 claims abstract description 147
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 239000000112 cooling gas Substances 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000011810 insulating material Substances 0.000 claims description 44
- 230000008676 import Effects 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- -1 calcirm-fluoride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention provides unit heater and annealing device.Annealing device (10) includes heat-treatment furnace (1), heat source (21), transmissive member (3) and gas flow mechanism (4).Heat-treatment furnace (1) accommodates workpiece.Heat source (21) uses the heat source of infra-red-emitting.Transmissive member (3) and heat source (21) are oppositely disposed, heat source (21) and gas isolating.Transmissive member (3) is made of the material for penetrating at least part of the infrared ray radiated from heat source (21).Gas flow mechanism (4) is configured to make cooling gas circulation in the space (300) being formed between heat source (21) and transmissive member (3).
Description
The application is the Shen for the applying date being on 07 09th, 2013, entitled " unit heater and annealing device "
Please number be 201310286664.4 patent applications divisional application.
Technical field
The present invention relates to unit heaters and annealing device, in particular to fit through obtained using radiant heat it is lower
Temperature region (such as 300 DEG C or less) unit heater and annealing device that are heat-treated.
Background technique
In order to soak liquid component from the drop for being attached with water, organic solvent etc. or by these liquid using heat
Workpiece gasifies and keeps workpiece dry, uses the drying device with heat source.
In patent document 1, the drying device dry as the water droplet made on silicon wafer, proposes following technical sides
Case: use infrared lamp as heat source, configuration and silicon wafer same material (Si) between chip setting table and far infrared lamp
Optical filter.The wave that there is optical filter the infrared ray for the wavelength that can make effectively to make water droplet dry to penetrate and remove heating silicon wafer
The function of long infrared ray.Therefore, only drop can be heated without heating to silicon wafer, so as to make silicon wafer promptly
It is dry.
Existing technical literature
Patent document 1: Japanese Patent Laid-Open Publication flat No. 8-122232
In the drying device recorded in the patent document 1, since optical filter absorbs infrared ray, so optical filter itself
With heat, also the air around optical filter is heated.Therefore, flammable gas (N- is generated from workpiece when dry
Methyl pyrrolidone (hereinafter referred to as NMP) gas etc.) in the case where, atmosphere temperature is increased to ignition temperature, and there are danger on fire
It is dangerous.For example, in lithium ion battery electrode, when due to as the slurry for making the collector coated in metal foil surface
Solvent uses NMP sometimes, there is this danger.
Summary of the invention
In view of the problem of the existing technology, the purpose of the present invention is when inhibiting the raising of atmosphere temperature efficiently
Workpiece is heat-treated.
The present invention provides a kind of unit heater, and the unit heater includes: heat source, infra-red-emitting；Plate it is saturating
Light component penetrates at least part of the infrared ray, with the transparent surface of the side on the thickness direction of the transmissive member
The mode opposite with the heat source configures, the heat source and gas isolating；And gas flow mechanism, make cooling gas in shape
It circulates in space between heat source described in Cheng Yu and the transmissive member, the gas flow mechanism has to be connect with the space
Gas introduction port and gas discharge outlet, the gas introduction port and the gas discharge outlet are in the transparent surface along the party
Direction on configuration in the position more more outward than the heat source, the gas flow mechanism is by the gas introduction port by institute
Cooling gas is stated to import in the space, and make the cooling gas along the transparent surface of the party in the space from
Laterally the gas discharge outlet effluent is logical for the gas introduction port.
In addition, the present invention provides a kind of annealing device, the annealing device includes: heat-treatment furnace, is accommodated processed
Part；Heat source, infra-red-emitting；The transmissive member of plate penetrates at least part of the infrared ray, with the transmissive member
Thickness direction on the transparent surface mode opposite with the heat source of a side configure, in the heat source and the heat-treatment furnace
Gas isolating；And gas flow mechanism, make cooling gas in the sky being formed between the heat source and the transmissive member
Between middle circulation, the gas flow mechanism includes: gas introduction tube, has the gas introduction port that connect with the space；And
Gas outlet pipe, has the gas discharge outlet connecting with the space, and the gas introduction tube and the gas outlet pipe are embedded
In the heat-treatment furnace, the gas introduction port and the gas discharge outlet are on the direction along the transparent surface of the party
It positioned at the position more more outward than the heat source, and configures in following position: vertical with the transparent surface of the party
The distance of transparent surface of the distance of transparent surface on direction away from the party than the heat source away from the party is small, the gas stream
Logical mechanism imports the cooling gas in the space by the gas introduction port, and makes the cooling gas along institute
The transparent surface for stating a side is logical from the gas introduction port side to the gas discharge outlet effluent in the space.
In addition, the present invention provides a kind of annealing device, the annealing device includes: heat-treatment furnace, is accommodated processed
Part；Heat source, infra-red-emitting；The transmissive member of plate penetrates at least part of the infrared ray, with the transmissive member
Thickness direction on the transparent surface mode opposite with the heat source of a side configure, in the heat source and the heat-treatment furnace
Gas isolating；Heat-insulating material, comprising: main part keeps the heat source；And flange part, it is formed in the side of the main part
Face；And gas flow mechanism, so that cooling gas is circulated in the space being formed between the heat source and the transmissive member,
The heat-insulating material is in the state that the insertion of the main part of the heat-insulating material is set to the mounting hole on the heat-treatment furnace
Be mounted on the heat-treatment furnace, the gas flow mechanism have set on the heat-insulating material the flange part and with institute
The gas introduction port and gas discharge outlet of space connection are stated, the gas introduction port and the gas discharge outlet are along described one
It is located at the position more more outward than the heat source on the direction of the transparent surface of side, and configures relative to the heat-insulating material
The position of the main part side opposite each other, the gas flow mechanism make the cooling gas along the institute of the heat-insulating material
The side for stating the gas introduction port side of main part flow to the space thus by the cooling from the gas introduction port
Gas imports in the space, after so that the cooling gas is circulated in the space along the transparent surface of the party, makes institute
Cooling gas is stated along the side of the gas discharge outlet side of the main part of the heat-insulating material from the spatial flow
To the gas discharge outlet to which the cooling gas be discharged.
Unit heater of the invention includes heat source, transmissive member and gas flow mechanism.Heat source uses infra-red-emitting
Heat source.Transmissive member and heat source are oppositely disposed, and heat source is separated with atmosphere.Transmissive member is by making the infrared ray from heat source radiation
At least part penetrate material formed.Gas flow mechanism is configured to that cooling gas is made to be formed in heat source and transmissive member
Between space in circulate.
According to the structure, if transmissive member and workpiece are oppositely disposed, utilize transmitted through transmissive member
Infrared ray carries out radiant heating to workpiece, is thus heat-treated (such as dry) to workpiece.At this point, by shape
At the cooling gas flowed in the space between heat source and transmissive member, to cool down transmissive member.That is, even if because being put from heat source
A part of infrared ray penetrated by transmissive member absorb and make transmissive member have heat, the heat of transmissive member also be cooled gas
It seizes, transmissive member will not overheat.
The gas flow mechanism can use following structures: including gas introduction port and gas discharge outlet, the cooling
Gas is imported from gas introduction port, is circulated in the space, is discharged from gas discharge outlet.
As the material of the transmissive member, it is suitble to using the quartz glass being easy to get.
In addition, annealing device of the invention includes heat-treatment furnace, heat source, transmissive member and gas flow mechanism.At heat
It manages furnace and accommodates workpiece.Heat source uses the heat source of infra-red-emitting.Transmissive member and heat source are oppositely disposed, heat source and Re Chu
Manage the gas isolating in furnace.Transmissive member is formed by the material for penetrating at least part of the infrared ray radiated from heat source.Gas
Body flow mechanism is configured to that cooling gas is made to circulate in the space being formed between heat source and transmissive member.
According to the structure, if being oppositely disposed transmissive member and workpiece, utilize transmitted through transmissive member
Infrared ray carries out radiant heating to workpiece, can be heat-treated to workpiece (such as dry).At this point, using in shape
At the cooling transmissive member of the cooling gas flowed in the space between heat source and transmissive member.That is, even if because being radiated from heat source
A part of infrared ray by transmissive member absorb and make transmissive member have heat, the heat of transmissive member also be cooled gas take by force
It walks, transmissive member will not overheat.
The gas flow mechanism can use following structures: including the gas introduction tube and gas connecting with the space
Discharge pipe, cooling gas are imported from gas introduction tube, are circulated in the space, are discharged from gas outlet pipe.In addition, the gas
Body flow mechanism can further include air flow-producing device.
Arbitrary non-flammable gases can be used in the cooling gas, but from the aspect of cost, are suitble to using atmosphere (often
The air of temperature, normal pressure).
In addition, if include moving parts, the moving parts make the workpiece into the heat-treatment furnace with
The transmissive member projects the opposite region movement in infrared ray side, then heat treatment can be carried out continuously to workpiece, from
And operating efficiency can be improved.
According to the present invention, efficiently workpiece can be heat-treated when inhibiting the raising of atmosphere temperature.Therefore, i.e.,
Make to generate flammable gas (NMP etc.) from workpiece in heat treatment, atmosphere temperature will not be increased to ignition temperature, not have
There is the risk for generating and exploding.
Detailed description of the invention
Fig. 1 is the brief configuration figure for indicating the annealing device of one embodiment of the present invention.
Fig. 2 is the brief configuration figure for indicating the annealing device of other embodiments of the present invention.
Fig. 3 is the main portion of annealing device for indicating to make heat source and integrated one example of unit heater of transmissive member
The cross-sectional view divided.
Description of symbols
10 ... annealing devices
1 ... heat-treatment furnace
2 ... heaters
21 ... heat sources
22 ... heat-insulating materials
3 ... transmissive members
4 ... gas flow mechanisms
41 ... gas introduction tubes
41 ' ... gas introduction ports
42 ... gas outlet pipes
42 ' ... gas discharge outlets
43 ... pressure fan
44 ... snorkels
5 ... supporting members
22A ... main part
22B ... flange part
100 ... workpieces
200 ... unit heaters
300 ... are formed in the space between heat source and transmissive member
Specific embodiment
The annealing device of embodiment of the present invention is illustrated with reference to the accompanying drawings.
As shown in Figure 1, annealing device 10 includes heat-treatment furnace 1, heat source 21, transmissive member 3 and gas flow mechanism
4.The annealing device 10 be suitable for by the lower temperature region (such as 300 DEG C or less) that is obtained using radiant heat into
Capable heat treatment.
Heat-treatment furnace 1 includes framework 11 and heat insulation layer 12.Framework 11 is made of the material with heat resistance.Heat insulation layer 12 is set
In the inside of framework 11.By the structure, make heat-treatment furnace 1 that there is heat resistance and thermal insulation.It is suitble to using ceramic fibre etc.
Heat-insulating material constitutes heat insulation layer 12.In addition, can also be constituted and be insulated with air layer by making to become hollow on the inside of framework 11
Layer 12.
In the present embodiment, heat-treatment furnace 1 is in flat box-formed shape.The shape of heat-treatment furnace 1 is without being limited thereto.Such as
It is also possible to have round-ended cylinder shape etc..In the center of top portion of heat-treatment furnace 1, it is through with for installing the heater 2 described below
Rectangle mounting hole 1A.
The inside of heat-treatment furnace 1 becomes the upper and lower narrow space in figure.Workpiece 100 is housed in the space.Make
The inside of heat-treatment furnace 1 become narrow space up and down be in order to make the infrared ray radiated from the heater described below efficiently according to
Penetrate workpiece 100.
As the specific example of workpiece 100, lithium ion battery electrode etc. can be enumerated.As described above, lithium ion
The electrode that battery is used has been used flammable NMP in production as the slurry for solvent.
Use the calandria of the plate of infra-red-emitting as heat source 21.Specifically, can enumerate nickel filament calandria,
Halogen heater, carbon heater etc..In addition, the solid arrow in Fig. 1 indicates the infrared ray radiated from heat source 21.Needed for heat source 21
The output wanted changes due to the treatment conditions of the size of heat-treatment furnace 1 and workpiece 100.
Using vacuum mold 22 integration of the heat-insulating materials such as the heat source 21 and ceramic fibre, heater 2 is fabricated to
Defined shape.In the present embodiment, heater 2 is using the shape for being in square plate shape.In addition, the shape of heater 2 is not limited to
This.For example, if heat-treatment furnace 1 is that have round-ended cylinder shape, corresponding thereto, heater 2 can also be formed as half it is tubular or
A quarter is tubular.
A part of heat source 21 is exposed in the bottom surface of heat-insulating material 22.The truncation of heat-insulating material 22 carrys out the heat of self-heat power 21.
Therefore the radiation direction of the infrared ray of heater 2 has directive property.That is, heater 2 from the bottom surface of heat-insulating material 22 downward
Project infrared ray.
Flange part 22B is formed on the top of heat-insulating material 22.When heater 2 is installed on heat-treatment furnace 1, insulation
The main part 22A of material 22 is inserted into the mounting hole 1A.Then the flange part 22B of heat-insulating material 22 is consolidated with fixed screw etc.
It is scheduled on the outer wall of heat-treatment furnace 1.Heater 2 is mounted on heat in such a way that heat source 21 is in face of the inside of heat-treatment furnace 1 as a result,
In treatment furnace 1.
On the inner wall of heat-treatment furnace 1, supporting member 5 is mounted on around the opening of mounting hole 1A.After supporting member 5 supports
The transmissive member 3 of face narration.
Transmissive member 3 is configured in the lower section of heater 2, is left from heat source 21 and opposite with heat source 21.Transmissive member 3 is heat
Source 21 is separated with the atmosphere in heat-treatment furnace 1.It is red using that can make to radiate from heat source 21 as the material of transmissive member 3
The material that at least part infrared ray in outside line penetrates, such as be suitble to using the quartz glass being easy to get.In addition, light transmission structure
The material of part 3 is without being limited thereto.Although such as price is slightly expensive, and barium fluoride, calcirm-fluoride, sapphire etc. also can be used.
Transmissive member 3 is plate-like.The thickness of transmissive member 3 is, for example, 3~5mm or so.In addition, the thickness of transmissive member 3
It is not limited to the range.In terms of light transmittance, the thickness of transmissive member 3 is thin to be advantageous.
In order to which reliably heat source 21 and the atmosphere in heat-treatment furnace 1 are separated, between transmissive member 3 and supporting member 5
The higher the better for adhesion.In order to improve the adhesion, transmissive member 3 can be pacified by containment member (not indicating in figure)
In supporting member 5.As the material of the containment member, it is suitble to using the fluorine resin with heat resistance and solvent resistance
Or Si system resin.
As will be described later, transmissive member 3 and heat source 21 are separated is in order between heat source 21 and transmissive member 3
Form the space 300 for flowing cooling gas.In addition, the wave H expression in Fig. 1 is distributed from the surface of transmissive member 3
Heat out.
Gas flow mechanism 4 is configured to that cooling gas is made to circulate in space 300.In the present embodiment, gas circulates
Mechanism 4 has gas introduction tube 41 and gas outlet pipe 42, and cooling gas is imported from gas introduction tube 41, flowed in space 300
It is logical, it is discharged from gas outlet pipe 42.Gas introduction tube 41 and gas outlet pipe 42 are compactly embedded in heat-treatment furnace 1.
In addition, gas flow mechanism 4 has the pressure fan 43 of an example as air flow-producing device of the invention.It send
Blower 43 is connect by snorkel 44 with gas introduction tube 41.In the present embodiment, the cooling gas flowed in space 300
Flow can be very small, does not also need the precise controlling to flow.Therefore pressure fan 43 can choose low-cost specified small wind
The pressure fan of amount type.
In addition, as described above, be sent into addition to pressure fan 43 is connect with gas introduction tube 41 structure of cooling gas with
Outside, pressure fan 43 is also possible to connect with gas outlet pipe 42 to aspirate the structure of cooling gas.
In addition to this, using the adjuster of high-pressure gas cylinder and adjusting gas flow, it also may be constructed air flow-producing device.
In this case, due to air flow-producing device not power consumption, it is possible to reduce operating cost.
Arbitrary non-flammable gases can be used in cooling gas, but are suitble to use atmosphere (air at room temperature and atmospheric ionization).Due to
Without worrying influence of the atmosphere to environment, without constructing the circulatory system and cooling system etc., so can be to be realized with a low cost gas
Flow mechanism.
Workpiece 100 carries out in the region opposite with the injection infrared ray side of transmissive member 3 in heat-treatment furnace 1
Heat treatment.In addition it is also possible to which the moving parts that workpiece 100 is mobile to the region is arranged.Specifically, such as figure institute
Show have conveying roller 6.In addition, moving parts is not limited to conveying roller 6.Such as be also possible to conveyer belt etc..It can using moving parts
To be carried out continuously heat treatment to workpiece 100, so as to improve operating efficiency.
There is no problem as shown, overall length (the left and right width of Fig. 1) of the workpiece 100 even if than heat-treatment furnace 1 is long.
In this case, by two sides of heat-treatment furnace 1 setting opening (be sent into mouth 1B and send out mouth 1C), can automatically into
Row be sent into as indicated by the arrows outside heat-treatment furnace 1 workpiece 100,1 inner edge of heat-treatment furnace successively carry out heat treatment side it is defeated
A series of operations sent.In addition, in the case where workpiece 100 is that have sheet shaped piece flexible, as shown in Fig. 2, existing respectively
The outside configuration outlet roller 7 and work beam 8 be sent into mouth 1B, send out mouth 1C, can be carried out continuously heat treatment in roll-to-roll mode.
Annealing device 10 in the embodiment, if transmissive member 3 and workpiece 100 are oppositely disposed,
Can use the infrared ray transmitted through transmissive member 3 and radiant heating carried out to workpiece 100, thus to workpiece 100 into
Row heat treatment (such as dry).At this point, using the cooling gas for pressing flowing shown in dotted arrow in figure in space 300, it is cooling
Transmissive member 3.That is, even if transmissive member 3 has heat because a part of infrared ray radiated from heat source 21 is absorbed by transmissive member 3
Amount, also cooled gas seizes the heat of transmissive member 3, therefore transmissive member 3 will not overheat.
According to the present invention, efficiently workpiece can be heated when inhibiting the raising of atmosphere temperature.Cause
This, even if generating flammable gas (NMP etc.) from workpiece 100 in heat treatment, atmosphere temperature will not be increased to combustion
Point temperature, the risk that do not explode.
Fig. 3 is to indicate that the annealing device for one example of unit heater for being integrally formed heat source and transmissive member is main
Partial cross-sectional view.In the example of unit heater 200 shown in Fig. 3, supporting member 5 is formed as top with flange part
The tubular of 5B is inserted into the main part 22A of heater 2 inside the cylinder of supporting member 5, and heater 2 is consolidated using flange part 22B
It is scheduled in supporting member 5.Therefore the unit heater 200 for being integrally formed heat source 21 and transmissive member 3 can be formed.
Gas introduction port 41 ' and gas discharge outlet 42 ' penetrate through the flange part 22B of heater 2.Gas introduction port 41 ' is gentle
One end of body outlet 42 ' and the space 300 being formed between heat source 21 and transmissive member 3 connect.Therefore, by the way that air-flow is produced
Generating apparatus is connect with the other end of gas introduction port 41 ' or gas discharge outlet 42 ', and cooling gas can be made to flow in space 300
It is logical.
When unit heater 200 is mounted on heat-treatment furnace 1, the main part 5A of supporting member 5 is inserted into hot place
In the mounting hole 1A for managing furnace 1.Then it is fixed on the outer wall of heat-treatment furnace 1 using flange part 5B by fixed screw etc..As a result,
Unit heater 200 can be configured to detachable.
The explanation of the embodiment is considered as all to be example in all respects, is not the content of limitation.This hair
Not described embodiment of bright range, is represented by claim.In addition, the scope of the present invention also includes wanting with right
Ask all deformations in equivalent connotation and range.
Claims (12)
1. a kind of unit heater, which is characterized in that
The unit heater includes:
Heat source, infra-red-emitting；
The transmissive member of plate penetrates at least part of the infrared ray, on the thickness direction of the transmissive member
The transparent surface of the one side mode opposite with the heat source configures, the heat source and gas isolating；And
Gas flow mechanism makes cooling gas circulate in the space being formed between the heat source and the transmissive member,
The gas flow mechanism has the gas introduction port and gas discharge outlet connecting with the space,
The gas introduction port and the gas discharge outlet configure on the direction along the transparent surface of the party than described
The more outward position of heat source,
The gas flow mechanism is imported the cooling gas in the space by the gas introduction port, and is made described
Cooling gas is along the transparent surface of the party from the gas introduction port side to the gas discharge outlet side in the space
Circulation.
2. unit heater according to claim 1, which is characterized in that the gas introduction port and the gas discharge outlet
Configuration is in following position: comparing institute at a distance from the transparent surface on the direction vertical with the transparent surface of the party away from the party
The distance for stating transparent surface of the heat source away from the party is small.
3. unit heater according to claim 1 or 2, which is characterized in that the unit heater further includes heat insulating material
Material, the heat-insulating material is between the heat source and the gas introduction port.
4. unit heater according to claim 1, which is characterized in that
The unit heater further includes heat-insulating material,
The heat-insulating material includes: main part, keeps the heat source；And flange part, it is formed in the side of the main part,
The gas introduction port and the gas discharge outlet are set to the flange part of the heat-insulating material, and configure in phase
For the position of the main part side opposite each other of the heat-insulating material,
The gas flow mechanism imports the cooling gas along the gas of the main part of the heat-insulating material
The side of mouth side flow to the space from the gas introduction port to import the cooling gas in the space, makes institute
It states after cooling gas circulates in the space along the transparent surface of the party, makes the cooling gas along the heat insulating material
The side of the gas discharge outlet side of the main part of material is discharged from the spatial flow to the gas discharge outlet
The cooling gas.
5. unit heater according to claim 4, which is characterized in that
The unit heater further includes the supporting member of tubular,
The supporting member includes: main part, is inserted into for the main part of the heat-insulating material；And flange part, it is formed in
The side of the main part of the supporting member, in the state of heat-insulating material insertion, by making the heat-insulating material
The flange part abutted with the flange part of the supporting member, thus support the heat-insulating material,
The transmissive member is with the party of described in the state of the heat-insulating material insertion heat source and the transmissive member
Transparent surface mode relative to each other be supported on the main part of the supporting member,
The gas for the main part that the gas flow mechanism makes the cooling gas flow into the heat-insulating material imports
To will be described in the cooling gas imports between the face of the inside of the main part of the side and supporting member of mouthful side
In space, after so that the cooling gas is circulated in the space along the transparent surface of the party, make the cooling gas stream
Enter the side of the gas discharge outlet side of the main part of the heat-insulating material and the main part of the supporting member
Inside face between so that the cooling gas be discharged.
6. a kind of annealing device, which is characterized in that
The annealing device includes:
Heat-treatment furnace accommodates workpiece；
Heat source, infra-red-emitting；
The transmissive member of plate penetrates at least part of the infrared ray, on the thickness direction of the transmissive member
The transparent surface of the one side mode opposite with the heat source configures, the gas isolating in the heat source and the heat-treatment furnace；With
And
Gas flow mechanism makes cooling gas circulate in the space being formed between the heat source and the transmissive member,
The gas flow mechanism includes: gas introduction tube, has the gas introduction port connecting with the space；And gas row
Outlet pipe, has the gas discharge outlet connecting with the space, and the gas introduction tube and the gas outlet pipe are embedded in described
In heat-treatment furnace,
The gas introduction port and the gas discharge outlet are located on the direction along the transparent surface of the party than the heat
The more outward position in source, and configure in following position: away from described on the direction vertical with the transparent surface of the party
The distance of transparent surface of the distance of the transparent surface of one side than the heat source away from the party is small,
The gas flow mechanism imports the cooling gas in the space by the gas introduction port, and makes described
Cooling gas is along the transparent surface of the party from the gas introduction port side to the gas discharge outlet side in the space
Circulation.
7. annealing device according to claim 6, which is characterized in that the transmissive member is quartz glass system.
8. annealing device according to claim 6, which is characterized in that the annealing device further includes moving parts,
The moving parts makes injection infrared ray side phase with the transmissive member of the workpiece into the heat-treatment furnace
Pair region it is mobile.
9. a kind of annealing device, which is characterized in that
The annealing device includes:
Heat-treatment furnace accommodates workpiece；
Heat source, infra-red-emitting；
The transmissive member of plate penetrates at least part of the infrared ray, on the thickness direction of the transmissive member
The transparent surface of the one side mode opposite with the heat source configures, the gas isolating in the heat source and the heat-treatment furnace；
Heat-insulating material, comprising: main part keeps the heat source；And flange part, it is formed in the side of the main part；And
Gas flow mechanism makes cooling gas circulate in the space being formed between the heat source and the transmissive member,
The heat-insulating material is set to the shape of the mounting hole on the heat-treatment furnace in the main part insertion of the heat-insulating material
It is mounted under state on the heat-treatment furnace,
The gas that the gas flow mechanism has the flange part set on the heat-insulating material and connect with the space
Introducing port and gas discharge outlet,
The gas introduction port and the gas discharge outlet are located on the direction along the transparent surface of the party than the heat
The more outward position in source, and configure in the position of the main part side opposite each other relative to the heat-insulating material,
The gas flow mechanism imports the cooling gas along the gas of the main part of the heat-insulating material
The side of mouth side flow to the space from the gas introduction port to import the cooling gas in the space, makes institute
It states after cooling gas circulates in the space along the transparent surface of the party, makes the cooling gas along the heat insulating material
The side of the gas discharge outlet side of the main part of material is discharged from the spatial flow to the gas discharge outlet
The cooling gas.
10. annealing device according to claim 9, which is characterized in that
The annealing device further includes the supporting member of tubular,
The supporting member includes: main part, is inserted into for the main part of the heat-insulating material；And flange part, it is formed in
The side of the main part of the supporting member, in the state of heat-insulating material insertion, by making the heat-insulating material
The flange part abutted with the flange part of the supporting member, thus support the heat-insulating material,
The supporting member is mounted on described in the state that the main part of the supporting member is inserted into the mounting hole
On heat-treatment furnace,
The transmissive member is with the party of described in the state of the heat-insulating material insertion heat source and the transmissive member
Transparent surface mode relative to each other be supported on the main part of the supporting member,
The gas for the main part that the gas flow mechanism makes the cooling gas flow into the heat-insulating material imports
To will be described in the cooling gas imports between the face of the inside of the main part of the side and supporting member of mouthful side
In space, after so that the cooling gas is circulated in the space along the transparent surface of the party, make the cooling gas
Flow into the side of the gas discharge outlet side of the main part of the heat-insulating material and the main body of the supporting member
To which the cooling gas be discharged between the face of the inside in portion.
11. annealing device according to claim 9 or 10, which is characterized in that the transmissive member is quartz glass system
's.
12. annealing device according to claim 9 or 10, which is characterized in that the annealing device further includes movement
Component, the moving parts make injection infrared ray one with the transmissive member of the workpiece into the heat-treatment furnace
The opposite region in side is mobile.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012156142A JP6076631B2 (en) | 2012-07-12 | 2012-07-12 | Heater unit and heat treatment apparatus |
| JP2012-156142 | 2012-07-12 | ||
| CN201310286664.4A CN103546996B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310286664.4A Division CN103546996B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102189A CN106102189A (en) | 2016-11-09 |
| CN106102189B true CN106102189B (en) | 2019-09-03 |
Family
ID=49969948
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610423627.7A Active CN106102189B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
| CN201310286664.4A Active CN103546996B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310286664.4A Active CN103546996B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6076631B2 (en) |
| KR (1) | KR101969044B1 (en) |
| CN (2) | CN106102189B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202890A (en) * | 2015-10-27 | 2015-12-30 | 无锡太湖阳山水蜜桃科技有限公司 | Pollen grain dryer |
| DE102017011312A1 (en) * | 2017-12-08 | 2019-06-13 | Broetje-Automation Gmbh | Apparatus for producing preforms |
| CN108225024B (en) * | 2018-03-15 | 2023-09-19 | 重庆科技学院 | Rotary experiment furnace for continuous waste treatment |
| KR102030927B1 (en) * | 2018-05-10 | 2019-10-10 | 경북대학교 산학협력단 | Apparatus for drying flexible film having air distribution function |
| JP7105656B2 (en) * | 2018-09-10 | 2022-07-25 | 株式会社ジェイテクトサーモシステム | Heat treatment apparatus and heat treatment method |
| KR102174429B1 (en) | 2020-01-09 | 2020-11-04 | 조성희 | Turning-hottapping gate valve |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296617A (en) * | 1988-05-25 | 1989-11-30 | Fujitsu Ltd | Quartz lamp heating device |
| CN101311659A (en) * | 2007-05-22 | 2008-11-26 | 爱斯佩克株式会社 | Heat treatment equipment |
| CN102031567A (en) * | 2009-09-26 | 2011-04-27 | 东京毅力科创株式会社 | Heat processing apparatus and cooling method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0210648A (en) * | 1988-06-27 | 1990-01-16 | Matsushita Electric Works Ltd | Infrared ray radiating device |
| JP3380988B2 (en) * | 1993-04-21 | 2003-02-24 | 東京エレクトロン株式会社 | Heat treatment equipment |
| JPH07270091A (en) * | 1994-03-29 | 1995-10-20 | Tetsudo Kizai Kogyo Kk | Radiant heat exchange type cooler for preventing dew condensation on cooling plate surface |
| JP3088250B2 (en) | 1994-10-28 | 2000-09-18 | 日本電気株式会社 | Drying equipment |
| KR20000003799U (en) * | 1998-07-29 | 2000-02-25 | 구자홍 | Cooling structure of microwave oven with halogen lamp. |
| KR100881786B1 (en) * | 2000-12-27 | 2009-02-03 | 도쿄엘렉트론가부시키가이샤 | Treating device |
| JP4042592B2 (en) * | 2003-03-05 | 2008-02-06 | ウシオ電機株式会社 | Heating device |
| JP4696736B2 (en) * | 2005-07-12 | 2011-06-08 | ウシオ電機株式会社 | Light heating device |
-
2012
- 2012-07-12 JP JP2012156142A patent/JP6076631B2/en active Active
-
2013
- 2013-05-14 KR KR1020130054347A patent/KR101969044B1/en active IP Right Grant
- 2013-07-09 CN CN201610423627.7A patent/CN106102189B/en active Active
- 2013-07-09 CN CN201310286664.4A patent/CN103546996B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296617A (en) * | 1988-05-25 | 1989-11-30 | Fujitsu Ltd | Quartz lamp heating device |
| CN101311659A (en) * | 2007-05-22 | 2008-11-26 | 爱斯佩克株式会社 | Heat treatment equipment |
| CN102031567A (en) * | 2009-09-26 | 2011-04-27 | 东京毅力科创株式会社 | Heat processing apparatus and cooling method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6076631B2 (en) | 2017-02-08 |
| KR101969044B1 (en) | 2019-04-15 |
| CN103546996B (en) | 2016-08-10 |
| KR20140009017A (en) | 2014-01-22 |
| CN103546996A (en) | 2014-01-29 |
| CN106102189A (en) | 2016-11-09 |
| JP2014022042A (en) | 2014-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106102189B (en) | Unit heater and annealing device | |
| EP2566295B1 (en) | Coating film drying furnace | |
| TWI611730B (en) | Infrared heating device and drying oven | |
| TW201116492A (en) | Device and treatment chamber for thermal treatment of substrates | |
| JP4488155B2 (en) | Apparatus and method for heat treating at least one workpiece | |
| CN105074885A (en) | Modular substrate heater for efficient thermal cycling | |
| JP2003500865A (en) | Window cooled | |
| JP5797413B2 (en) | Heater unit and heat treatment apparatus | |
| TWI577957B (en) | Heater unit and heat treatment apparatus | |
| TWM512209U (en) | Heater block of rapid thermal processing apparatus | |
| CN103774237A (en) | Heat treatment device | |
| JP5449645B2 (en) | A method of manufacturing a silicon plate for heat treatment. | |
| KR101462460B1 (en) | Supporting Device for Divided Window Plates of Chamber for Heat Treatment of Substrates, and Chamber for Heat Treatment of Substrates and Heat Treatment Apparatus of Substrate Having the Same | |
| CN201289000Y (en) | Reflective cover with infrared lamp | |
| WO2019109405A1 (en) | Lpcvd vacuum heating chamber | |
| JP3888617B2 (en) | Heating device | |
| CN217664422U (en) | Infrared heating device for improving heating uniformity of substrate | |
| KR101668787B1 (en) | Heat processing apparatus comprising | |
| KR20130095580A (en) | Heater unit and heat treatment apparatus | |
| KR100395661B1 (en) | Rapid thermal processing apparatus | |
| CN102212658A (en) | Vacuum infrared heating annealing furnace | |
| KR101416588B1 (en) | A Apparatus for Heating Substrates in High Vacuum Chamber, Apparatus for Aligning Substrates Having the Same and Heating Apparatus Using FIR | |
| WO2009034191A2 (en) | Heat recovery apparatus | |
| CN103313446A (en) | Heater unit and thermal treatment device | |
| TWI572739B (en) | Heating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |