CN103546996B - Unit heater and annealing device - Google Patents
Unit heater and annealing device Download PDFInfo
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- CN103546996B CN103546996B CN201310286664.4A CN201310286664A CN103546996B CN 103546996 B CN103546996 B CN 103546996B CN 201310286664 A CN201310286664 A CN 201310286664A CN 103546996 B CN103546996 B CN 103546996B
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- gas
- thermal source
- transmissive member
- heat
- annealing device
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- 238000000137 annealing Methods 0.000 title claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 73
- 238000010438 heat treatment Methods 0.000 claims abstract description 52
- 239000000112 cooling gas Substances 0.000 claims abstract description 21
- 230000008676 import Effects 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000017531 blood circulation Effects 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Furnace Details (AREA)
- Drying Of Solid Materials (AREA)
- Resistance Heating (AREA)
Abstract
The present invention provides unit heater and annealing device.Annealing device (10) includes heat-treatment furnace (1), thermal source (21), transmissive member (3) and gas flow mechanism (4).Heat-treatment furnace (1) houses processed part.Thermal source (21) uses the thermal source of infra-red-emitting.Transmissive member (3) is oppositely disposed with thermal source (21), thermal source (21) and gas isolating.Transmissive member (3) is made by making the ultrared material passed through at least partially radiated from thermal source (21).Gas flow mechanism (4) circulates in being configured to make cooling gas in the space (300) being formed between thermal source (21) and transmissive member (3).
Description
Technical field
The present invention relates to unit heater and annealing device, particularly to fitting through utilization radiation
The relatively low temperature province (such as less than 300 DEG C) that heat obtains carry out heat treatment unit heater and
Annealing device.
Background technology
In order to utilize heat to make liquid component from being attached with the drop of water, organic solvent etc. or by this
The processed part of a little liquid moistenings gasifies and makes processed part be dried, and uses the dry dress with thermal source
Put.
In patent documentation 1, as the drying device making the water droplet on silicon wafer be dried, it is proposed that
Following technical scheme: use infrared lamp is as thermal source, at wafer setting table and far infrared lamp
Between configure material (Si) identical with silicon wafer light filter.Light filter has can be made effectively to make
The infrared ray of the wavelength that water droplet is dried passes through and removes the ultrared merit of the wavelength of heating silicon wafer
Energy.Accordingly, it is capable to only silicon wafer is not heated, it is thus possible to make silicon wafer fast by drop heating
It is dried fastly.
Prior art literature
Patent documentation 1: flat No. 8-122232 of Japanese Laid-Open Patent Publication
In the drying device described in described patent documentation 1, owing to light filter absorbs infrared ray,
So light filter itself has heat, also the air around light filter is heated.Therefore, it is being dried
Time from processed part produce flammable gas (N-Methyl pyrrolidone (hereinafter referred to as NMP) gas
Body etc.) in the case of, atmosphere temperature is increased to ignition temperature, there is danger on fire.Such as,
In lithium ion battery electrode, due to as the slurry making the collector body being coated in metal foil surface
Solvent during material uses NMP sometimes, exists for this danger.
Summary of the invention
The problem existed in view of described prior art, it is an object of the invention to limit suppression atmosphere temperature
Rise flash and efficiently processed part is carried out heat treatment.
The unit heater of the present invention, comprising: thermal source, infra-red-emitting；Transmissive member, with
Described thermal source be oppositely disposed, described thermal source and gas isolating, and make described ultrared at least
A part passes through；Supporting member, supports described transmissive member；And gas flow mechanism, constitute
For making cooling gas circulate in the space being formed between described thermal source and described transmissive member, institute
State space to be surrounded by described transmissive member, described supporting member and described thermal source.
According to described structure, if transmissive member is oppositely disposed with processed part, then utilize transmission
The infrared ray crossing transmissive member carries out radiation heating to processed part, thus processed part is carried out heat
Process (the driest).Now, by the space being formed between thermal source and transmissive member
The cooling gas of flowing, cools down transmissive member.That is, even if the part because radiating from thermal source is red
Outside line is absorbed by transmissive member and makes transmissive member have heat, and the heat of transmissive member is also cooled
Gas seizes, and transmissive member will not be overheated.
Described gas flow mechanism can use following structure: includes that gas introduction port and gas are discharged
Mouthful, described cooling gas imports from gas introduction port, circulates in described space, discharges from gas
Mouth is discharged.
As the material of described transmissive member, the quartz glass that applicable use is readily obtained.
Additionally, the annealing device of the present invention, comprising: heat-treatment furnace, house processed part；
Thermal source, infra-red-emitting；Transmissive member, is oppositely disposed with described thermal source, described thermal source and institute
State the gas isolating in heat-treatment furnace, and make described ultrared pass through at least partially；Supporting
Component, supports described transmissive member；And gas flow mechanism, it is configured to make cooling gas in shape
Circulating in thermal source described in Cheng Yu and the space between described transmissive member, described space is by described printing opacity
The wall of component, described supporting member, described thermal source and described heat-treatment furnace seals.
According to described structure, if making transmissive member be oppositely disposed with processed part, then utilize transmission
The infrared ray crossing transmissive member carries out radiation heating to processed part, processed part can be carried out heat
Process (the driest).Now, utilize in the space being formed between thermal source and transmissive member
The cooling gas cooling transmissive member of flowing.That is, even if because of a part of infrared ray radiated from thermal source
Being absorbed by transmissive member and make transmissive member have heat, the heat of transmissive member is also cooled gas
Seizing, transmissive member will not be overheated.
Described gas flow mechanism can use following structure: includes the gas being connected with described space
Ingress pipe and gas outlet pipe, cooling gas imports from gas introduction tube, circulates in described space,
Discharge from gas outlet pipe.Additionally, described gas flow mechanism can also include air flow-producing device.
Described cooling gas can use arbitrary non-flammable gases, but from the standpoint of cost, suitable
Close and use air (room temperature, the air of normal pressure).
If additionally, include mobile parts, described mobile parts make described processed part to described heat
The region relative with the injection infrared ray side of described transmissive member processed in stove is moved, the most permissible
Processed part is carried out continuously heat treatment, it is thus possible to improve working performance.
According to the present invention, the liter flash of atmosphere temperature can be suppressed efficiently processed part to be carried out heat in limit
Process.Therefore, even if producing flammable gas (NMP etc.) when heat treatment from processed part,
Atmosphere temperature does not rises to ignition temperature yet, does not produce the danger of blast.
Accompanying drawing explanation
Fig. 1 is the brief configuration figure of the annealing device representing one embodiment of the present invention.
Fig. 2 is the brief configuration figure of the annealing device representing other embodiments of the present invention.
Fig. 3 is to represent at the heat of one example of unit heater making thermal source and transmissive member integration
The sectional view of reason device major part.
Description of reference numerals
10 ... annealing device
1 ... heat-treatment furnace
2 ... heater
21 ... thermal source
22 ... adiabator
3 ... transmissive member
4 ... gas flow mechanism
41 ... gas introduction tube
41 ' ... gas introduction port
42 ... gas outlet pipe
42 ' ... gas discharge outlet
43 ... pressure fan
44 ... snorkel
5 ... supporting member
22A ... main part
22B ... flange part
100 ... processed part
200 ... unit heater
300 ... the space being formed between thermal source and transmissive member
Detailed description of the invention
With reference to the accompanying drawings the annealing device of embodiment of the present invention is illustrated.
As it is shown in figure 1, annealing device 10 includes heat-treatment furnace 1, thermal source 21, transmissive member 3
And gas flow mechanism 4.Described annealing device 10 is suitable for by utilizing radiant heat to obtain
The heat treatment that carries out of relatively low temperature province (such as less than 300 DEG C).
Heat-treatment furnace 1 includes framework 11 and heat insulation layer 12.Framework 11 is by the material with thermostability
Make.Heat insulation layer 12 is located at the inner side of framework 11.By described structure, heat-treatment furnace 1 is made to have
There are thermostability and thermal insulation.It is suitable for using the adiabators such as ceramic fibre to constitute heat insulation layer 12.This
Outward, hollow is become inside framework 11 by making, it is also possible to constitute heat insulation layer 12 with air layer.
In the present embodiment, heat-treatment furnace 1 is in flat box-formed shape.The shape of heat-treatment furnace 1
Shape is not limited to this.Can also be such as to have round-ended cylinder shape etc..In the center of top portion of heat-treatment furnace 1,
It is through with the rectangle installing hole 1A for installing heater 2 described below.
The inside of heat-treatment furnace 1 becomes the narrowest space in figure.Processed part 100 is housed in
In described space.It is to make to chat from behind that the inside making heat-treatment furnace 1 becomes the narrowest space
The infrared ray of the heater radiation stated irradiates processed part 100 efficiently.
As the object lesson of processed part 100, lithium ion battery electrode etc. can be enumerated.As
Upper described, the electrode of lithium ion battery employs flammable NMP as molten when making
The slurry of agent.
Use the calandria of tabular of infra-red-emitting as thermal source 21.Specifically, can enumerate
Nickel filament calandria, halogen heater, carbon heater etc..Additionally, the solid arrow table in Fig. 1
Show the infrared ray from thermal source 21 radiation.Output required for thermal source 21 is because of the size of heat-treatment furnace 1
Change with the treatment conditions of processed part 100.
Utilize vacuum mold that the adiabators 22 such as described thermal source 21 and ceramic fibre is integrated,
Heater 2 is fabricated to the shape of regulation.In the present embodiment, heater 2 uses in square tabular
Shape.Additionally, the shape of heater 2 is not limited to this.Such as, if heat-treatment furnace 1 is to have
Round-ended cylinder shape, the most corresponding thereto, it is also possible to heater 2 is formed as half tubular or 1/4th
Tubular.
A part for thermal source 21 is exposed in the bottom surface of adiabator 22.Adiabator 22 block from
The heat of thermal source 21.Therefore the ultrared radiation direction of heater 2 has directivity.That is, add
Hot device 2 penetrates downward infrared ray from the bottom surface of adiabator 22.
It is formed with flange part 22B on the top of adiabator 22.Heater 2 is being installed at heat
Time on reason stove 1, the main part 22A of adiabator 22 inserts in described installing hole 1A.Then use
Fixed screws etc. are fixed on the flange part 22B of adiabator 22 on the outer wall of heat-treatment furnace 1.By
This, be arranged on heat-treatment furnace heater 2 by thermal source 21 in the way of the inside of heat-treatment furnace 1
On 1.
On the inwall of heat-treatment furnace 1, supporting member 5 is arranged on around the opening of installing hole 1A.
Supporting member 5 supports transmissive member 3 described below.
Transmissive member 3 is arranged in the lower section of heater 2, leave from thermal source 21 and with thermal source 21 phase
Right.3 thermals source 21 of transmissive member separate with the atmosphere in heat-treatment furnace 1.As transmissive member 3
Material, use and at least some of infrared ray from the infrared ray that thermal source 21 radiates can be made saturating
The material crossed, such as, be suitable for using the quartz glass being readily obtained.Additionally, the material of transmissive member 3
Material is not limited to this.Although such as price is the most expensive, but barium fluoride, calcium fluoride, indigo plant can also be used
Gem etc..
Transmissive member 3 is plate-shaped.The thickness of transmissive member 3 for example, 3～about 5mm.Additionally,
The thickness of transmissive member 3 is not limited to described scope.In terms of light transmittance, the thickness of transmissive member 3
Thin is favourable.
In order to reliably thermal source 21 be separated with the atmosphere in heat-treatment furnace 1, transmissive member 3 with
Adhesion between bearing member 5 is the highest more good.In order to improve described adhesion, can be printing opacity structure
Part 3 is arranged in supporting member 5 by containment member (not representing in figure).As described close
The material of envelope component, applicable use has thermostability and the fluorine resin of solvent resistance or Si system resin.
As will be described later, transmissive member 3 and thermal source 21 being separated is in order at thermal source 21
And between transmissive member 3, form the space 300 for making cooling gas flow.Additionally, in Fig. 1
Wave H represents the heat given out from the surface of transmissive member 3.
Gas flow mechanism 4 is configured to make cooling gas circulate in space 300.This embodiment party
In formula, gas flow mechanism 4 has gas introduction tube 41 and a gas outlet pipe 42, cooling gas from
Gas introduction tube 41 imports, and circulates, discharge from gas outlet pipe 42 in space 300.Gas
Ingress pipe 41 and gas outlet pipe 42 are embedded in heat-treatment furnace 1 compactly.
Additionally, gas flow mechanism 4 has an example of the air flow-producing device as the present invention
Pressure fan 43.Pressure fan 43 is connected with gas introduction tube 41 by snorkel 44.In this enforcement
In mode, in space 300, the cooling gas flow of flowing can be the least, it is not required that convection current
The precise controlling of amount.Therefore pressure fan 43 can select the pressure fan of specified little air quantity type that price is low.
Additionally, as it has been described above, except pressure fan 43 is connected with gas introduction tube 41 send into cold
But beyond the structure of gas, it is also possible to be pressure fan 43 to be connected with gas outlet pipe 42 aspirate
The structure of cooling gas.
In addition, high-pressure gas cylinder and the actuator of adjusting gas flow are used, it is also possible to constitute
Air flow-producing device.In this case, due to air flow-producing device not power consumption, it is possible to reduce
Operating cost.
Cooling gas can use arbitrary non-flammable gases, but is suitable for using air (room temperature, often
The air of pressure).Owing to not worrying the air impact on environment, blood circulation and cold need not be constructed
But system etc., so can be to be realized with a low cost gas flow mechanism.
The processed part 100 injection infrared ray side phase with transmissive member 3 in heat-treatment furnace 1
To region in carry out heat treatment.In addition it is also possible to arrange processed part 100 to described region
The mobile parts of movement.Specifically, as it can be seen, possess conveying roller 6.Additionally, mobile parts
It is not limited to conveying roller 6.It can also be such as conveyer belt etc..The mobile parts of utilization can be to processed part
100 are carried out continuously heat treatment, it is thus possible to improve working performance.
Even if as it can be seen, processed part 100 is than total length (the left and right width of Fig. 1 of heat-treatment furnace 1
Degree) long the most no problem.In this case, by opening the two of heat-treatment furnace 1 sides settings
Mouth (is sent into mouth 1B and sends a mouthful 1C), can automatically carry out from heat-treatment furnace 1 outside such as arrow
Send into processed part 100 shown in head S, carry out the conveying of heat treatment limit successively at heat-treatment furnace 1 inner edge
A series of operations.Additionally, in the case of processed part 100 is the sheet shaped piece with flexibility,
As in figure 2 it is shown, sending into mouth 1B, sending the outside configuration outlet roller 7 of mouthful 1C and batch respectively
Roller 8, it is possible to be carried out continuously heat treatment in the way of volume to volume.
Annealing device 10 in the embodiment, if transmissive member 3 and processed part 100
Relative configuration, then can utilize the infrared ray transmitted through transmissive member 3 to carry out processed part 100
Radiation heating, thus carries out heat treatment (the driest) to processed part 100.Now, utilize
The cooling gas flowed as shown in dotted arrow in figure in space 300, cools down transmissive member 3.That is,
Even if a part of infrared ray because radiating from thermal source 21 is absorbed by transmissive member 3, transmissive member 3 has
Having heat, the heat of transmissive member 3 gas that is also cooled to seize, therefore transmissive member 3 will not mistake
Heat.
According to the present invention, it is possible to processed part is carried out by the liter flash of limit suppression atmosphere temperature efficiently
Heat treated.Therefore, even if producing flammable gas when heat treatment from processed part 100
(NMP etc.), atmosphere temperature does not rises to ignition temperature yet, does not has the danger of blast.
Fig. 3 is the heat representing one example of unit heater making thermal source and transmissive member be integrally forming
The sectional view of processing means major part.In the example of the unit heater 200 shown in Fig. 3,
Supporting member 5 is formed as top there is the tubular of flange part 5B, the main part of heater 2
22A is inserted into inside the cylinder of supporting member 5, utilizes flange part 22B that heater 2 is fixed on and props up
In bearing member 5.Therefore the heater list making thermal source 21 and transmissive member 3 be integrally forming can be formed
Unit 200.
Gas introduction port 41 ' and the flange part 22B of the through heater of gas discharge outlet 42 ' 2.Gas
One end of body introducing port 41 ' and gas discharge outlet 42 ' be formed at thermal source 21 and transmissive member 3
Between space 300 connect.Therefore, by air flow-producing device and gas introduction port 41 ' or
The other end of gas discharge outlet 42 ' connects, and cooling gas can be made to circulate in space 300.
When unit heater 200 is arranged on heat-treatment furnace 1, the main body of supporting member 5
Portion 5A is inserted in the installing hole 1A of heat-treatment furnace 1.Then utilize flange part 5B by fixing
Screws etc. are fixed on the outer wall of heat-treatment furnace 1.Thus, it is possible to unit heater 200 is constituted
For detachable.
Explanation to described embodiment is considered as being the most all example, is not to limit
Content.The scope of the present invention is not described embodiment, but is represented by claim.This
Outward, all of deformation in the scope of the present invention also includes the connotation that is equal to claim and scope.
Claims (13)
1. a unit heater, it is characterised in that including:
Thermal source, infra-red-emitting；
Transmissive member, is oppositely disposed with described thermal source, described thermal source and gas isolating, and makes
Described ultrared pass through at least partially；
Supporting member, supports described transmissive member；And
Gas flow mechanism, is configured to make cooling gas be formed at described thermal source and described printing opacity structure
Circulate in space between part,
Described space is surrounded by described transmissive member, described supporting member and described thermal source.
Unit heater the most according to claim 1, it is characterised in that described gas circulates
Mechanism includes gas introduction port and the gas discharge outlet being connected with described space, described cooling gas from
Described gas introduction port imports, and circulates, discharge from described gas discharge outlet in described space.
Unit heater the most according to claim 1, it is characterised in that described being arranged in
A described transmissive member only it is configured with between processed part and described thermal source in atmosphere.
Unit heater the most as claimed in any of claims 1 to 3, it is characterised in that
Described transmissive member is quartz glass system.
5. an annealing device, it is characterised in that including:
Heat-treatment furnace, houses processed part；
Thermal source, infra-red-emitting；
Transmissive member, is oppositely disposed with described thermal source, in described thermal source and described heat-treatment furnace
Gas isolating, and make described ultrared pass through at least partially；
Supporting member, supports described transmissive member；And
Gas flow mechanism, is configured to make cooling gas be formed at described thermal source and described printing opacity structure
Circulate in space between part,
Described space is by described transmissive member, described supporting member, described thermal source and described heat treatment
The wall of stove seals.
Annealing device the most according to claim 5, it is characterised in that described gas circulates
Mechanism includes gas introduction tube and the gas outlet pipe being connected with described space, and cooling gas is from described
Gas introduction tube imports, and circulates, discharge from described gas outlet pipe in described space.
Annealing device the most according to claim 6, it is characterised in that described gas imports
Pipe and described gas outlet pipe are embedded in described heat-treatment furnace.
Annealing device the most according to claim 6, it is characterised in that described gas circulates
Mechanism also includes air flow-producing device.
Annealing device the most according to claim 7, it is characterised in that described gas circulates
Mechanism also includes air flow-producing device.
10. according to the annealing device according to any one of claim 5～9, it is characterised in that
Described cooling gas is air.
11. according to the annealing device according to any one of claim 5～9, it is characterised in that
Described transmissive member is quartz glass system.
12. according to the annealing device according to any one of claim 5～9, it is characterised in that
Described annealing device also includes mobile parts, and described mobile parts make described processed part to described
The region relative with the injection infrared ray side of described transmissive member in heat-treatment furnace is moved.
13. annealing devices according to claim 5, it is characterised in that described processed
A described transmissive member only it is configured with between part and described thermal source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610423627.7A CN106102189B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-156142 | 2012-07-12 | ||
| JP2012156142A JP6076631B2 (en) | 2012-07-12 | 2012-07-12 | Heater unit and heat treatment apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610423627.7A Division CN106102189B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103546996A CN103546996A (en) | 2014-01-29 |
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| CN201310286664.4A Active CN103546996B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
| CN201610423627.7A Active CN106102189B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
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| CN201610423627.7A Active CN106102189B (en) | 2012-07-12 | 2013-07-09 | Unit heater and annealing device |
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| Country | Link |
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| JP (1) | JP6076631B2 (en) |
| KR (1) | KR101969044B1 (en) |
| CN (2) | CN103546996B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105202890A (en) * | 2015-10-27 | 2015-12-30 | 无锡太湖阳山水蜜桃科技有限公司 | Pollen grain dryer |
| DE102017011312A1 (en) * | 2017-12-08 | 2019-06-13 | Broetje-Automation Gmbh | Apparatus for producing preforms |
| CN108225024B (en) * | 2018-03-15 | 2023-09-19 | 重庆科技学院 | Rotary experiment furnace for continuous waste treatment |
| KR102030927B1 (en) * | 2018-05-10 | 2019-10-10 | 경북대학교 산학협력단 | Apparatus for drying flexible film having air distribution function |
| JP7105656B2 (en) * | 2018-09-10 | 2022-07-25 | 株式会社ジェイテクトサーモシステム | Heat treatment apparatus and heat treatment method |
| KR102174429B1 (en) | 2020-01-09 | 2020-11-04 | 조성희 | Turning-hottapping gate valve |
| KR102551053B1 (en) * | 2021-05-12 | 2023-07-05 | 주식회사 한국제이텍트써모시스템 | Heater unit of heat treatment oven |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296617A (en) * | 1988-05-25 | 1989-11-30 | Fujitsu Ltd | Quartz lamp heating device |
| JPH0210648A (en) * | 1988-06-27 | 1990-01-16 | Matsushita Electric Works Ltd | Infrared ray radiating device |
| JPH07270091A (en) * | 1994-03-29 | 1995-10-20 | Tetsudo Kizai Kogyo Kk | Radiant heat exchange type cooler for preventing dew condensation on cooling plate surface |
| JPH08122232A (en) * | 1994-10-28 | 1996-05-17 | Nec Corp | Drier |
| CN1243223A (en) * | 1998-07-29 | 2000-02-02 | Lg电子株式会社 | Cooling device of microwave oven with halogen lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3380988B2 (en) * | 1993-04-21 | 2003-02-24 | 東京エレクトロン株式会社 | Heat treatment equipment |
| KR100881786B1 (en) * | 2000-12-27 | 2009-02-03 | 도쿄엘렉트론가부시키가이샤 | Treating device |
| JP4042592B2 (en) * | 2003-03-05 | 2008-02-06 | ウシオ電機株式会社 | Heating device |
| JP4696736B2 (en) * | 2005-07-12 | 2011-06-08 | ウシオ電機株式会社 | Light heating device |
| JP4630307B2 (en) * | 2007-05-22 | 2011-02-09 | エスペック株式会社 | Heat treatment equipment |
| JP5504793B2 (en) * | 2009-09-26 | 2014-05-28 | 東京エレクトロン株式会社 | Heat treatment apparatus and cooling method |
-
2012
- 2012-07-12 JP JP2012156142A patent/JP6076631B2/en active Active
-
2013
- 2013-05-14 KR KR1020130054347A patent/KR101969044B1/en active IP Right Grant
- 2013-07-09 CN CN201310286664.4A patent/CN103546996B/en active Active
- 2013-07-09 CN CN201610423627.7A patent/CN106102189B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296617A (en) * | 1988-05-25 | 1989-11-30 | Fujitsu Ltd | Quartz lamp heating device |
| JPH0210648A (en) * | 1988-06-27 | 1990-01-16 | Matsushita Electric Works Ltd | Infrared ray radiating device |
| JPH07270091A (en) * | 1994-03-29 | 1995-10-20 | Tetsudo Kizai Kogyo Kk | Radiant heat exchange type cooler for preventing dew condensation on cooling plate surface |
| JPH08122232A (en) * | 1994-10-28 | 1996-05-17 | Nec Corp | Drier |
| CN1243223A (en) * | 1998-07-29 | 2000-02-02 | Lg电子株式会社 | Cooling device of microwave oven with halogen lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103546996A (en) | 2014-01-29 |
| CN106102189A (en) | 2016-11-09 |
| KR101969044B1 (en) | 2019-04-15 |
| JP6076631B2 (en) | 2017-02-08 |
| KR20140009017A (en) | 2014-01-22 |
| JP2014022042A (en) | 2014-02-03 |
| CN106102189B (en) | 2019-09-03 |
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