CN203900678U - Combined type infrared heating module used for reflow soldering furnace - Google Patents
Combined type infrared heating module used for reflow soldering furnace Download PDFInfo
- Publication number
- CN203900678U CN203900678U CN201420219655.3U CN201420219655U CN203900678U CN 203900678 U CN203900678 U CN 203900678U CN 201420219655 U CN201420219655 U CN 201420219655U CN 203900678 U CN203900678 U CN 203900678U
- Authority
- CN
- China
- Prior art keywords
- infrared heating
- reflow soldering
- heating module
- quartz ampoule
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 62
- 238000005476 soldering Methods 0.000 title claims abstract description 20
- 239000010453 quartz Substances 0.000 claims abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000003708 ampul Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000001035 drying Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Abstract
The utility model relates to a combined type infrared heating module used for a reflow soldering furnace. The module comprises an air inlet pipe (1), infrared heating wires (2), a quartz shell (4) and quartz pipe bundles (5). The infrared heating wires (2) are placed in the quartz shell (4). The quartz pipe bundles (5) are placed between adjacent infrared heating wires (2) and are communicated with the air inlet pipe (1). Compared with the prior art, the combined type infrared heating module is compact in structure and is more economical and practical.
Description
Technical field
The utility model relates to a kind of heating module, especially relates to a kind of compound infrared heating module for reflow soldering.
Background technology
Reflow soldering is the equipment for carrying out soldering to being loaded with the circuit board of electronic devices and components.It is by a kind of heating environment is provided, thereby solder(ing) paste being heated melt allows surface-pasted components and parts and circuit board combine reliably by solder(ing) paste alloy.According to the difference of mode of heating, reflow soldering is divided into hot air type reflow soldering and FAR INFRARED HEATING stove conventionally.
Hot air type reflow soldering, by the laminar motion transferring heat energy of hot blast, utilizes heater strip and blowing motor, makes furnace air constantly heat up and circulate, and treats that weldment is subject to the heating of red-hot gas in stove, thereby realizes welding.Many heating modules of arranging in the burner hearth of existing reflow soldering, for providing hot blast after heating and the components and parts after surface mount by convection type heat-shift, dissolve solder(ing) paste alloy on circuit board and solidify, thus welding component.
Far infrared type heating furnace is that the heat transfer form of far infrared is radiant heat transfer, and by electromagnetic wave transferring energy, at far-infrared radiation during to heated object, a part of ray is reflected back, and a part is penetrated over.When the far infrared wavelength of transmitting and the absorbing wavelength of heating object are when consistent, heated object flood tide absorbs far infrared, at this moment, there is " resonance " in interior of articles molecule and atom---produce strong vibration, rotation, and vibration and rotation raise object temperature, reached the object of heating.
In solar panel manufacturing process, reflow ovens is applied to the dry link of solar panel after oversampling circuit printing, and it can provide automatic and stable heating environment, and the coating on cell panel is dried on cell substrates.But no matter adopt hot air type reflow soldering or FAR INFRARED HEATING stove, all can be limited to existing technology, and cannot reach desirable drying effect.
When adopting Far-infrared Heating mode, due to the characteristic of Far-infrared Heating, far infrared can be radiated coating inside.Now the inside of coating and outer surface can be dried substantially simultaneously, and moisture can very evenly remove from coating.But because the volatile substances of coating surface can vaporizationization become steam in dry process, these steam are commonly called VOC in industry.Because pressure in the burner hearth is more balanced, except can being deflated device, near VOC exhaust outlet takes away.Other VOC is suspended in burner hearth inside, absorbs and reflecting far-infrared ray, thereby affects the effect of infrared radiation heating.Originally be radiated infrared ray on cell panel by VOC vapor absorption and reflected away, causing drying effect not good.
If while adopting hot air type reflow soldering, because device interior is carrying out hot air circulation always.Now VOC is easy to be blown to four winds, and cannot assemble and swim in together, thereby solve defect of infrared heating furnace.But solar panel surface is during by heated-air drying, and what be first dried is the outmost surface of cell panel.The outer surface of cell panel coating is sloughed moisture at first, and dry, surface solidify to form rapidly a solid shell closely.But the coating on cell panel surface does not all remove moisture content, the inside of coating is still moist.Now, because outer surface has cured, the moisture of coating inside cannot escape out, causes coating drying effect not good, outer dry interior wet.
Summary of the invention
The purpose of this utility model is exactly to provide a kind of compound infrared heating module for reflow soldering in order to overcome the defect of above-mentioned prior art existence.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of compound infrared heating module for reflow soldering, it is characterized in that, this module comprises blast pipe, infrared heating silk, quartz container and quartz ampoule group, described infrared heating silk is put into quartz container, described quartz ampoule group is located between adjacent infrared heating silk, and is communicated with blast pipe.
Between described quartz ampoule group and infrared heating silk, space is filled with heat insulation plasterboard.
Described blast pipe is communicated with burner hearth by quartz ampoule group.
Described quartz ampoule group has 24.
In described blast pipe, stream has fresh air, and this fresh air enters burner hearth by quartz ampoule group.
The luminescent spectrum of described infrared heating silk is in far infrared spectrum.
Compared with prior art, the utlity model has following advantage:
1) prevent that VOC from assembling, and guaranteed the stablizing effect of infrared heating.
2) VOC can, by regulating air-flow to be discharged to outside burner hearth, guarantee the clean of burner hearth and product.
3) compact conformation, economy, resultant effect are good.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model;
Fig. 2 is that the D-D of Fig. 1 is to cutaway view;
Fig. 3 is the E portion enlarged drawing of Fig. 2.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.The present embodiment be take technical solutions of the utility model and is implemented as prerequisite, provided detailed embodiment and concrete operating process, but protection domain of the present utility model is not limited to following embodiment.
A kind of novel heating module is provided.This heating module combines the characteristic of infrared heating, has introduced the airduct design of hot air type reflow ovens simultaneously.This module mainly consists of blast pipe 1, infrared heating silk 2, heat insulation plasterboard 3, quartz container 4 and quartz ampoule group 5.
As shown in Figures 2 and 3, a kind of compound infrared heating module for reflow soldering, this module comprises blast pipe 1, infrared heating silk 2, quartz container 4, quartz ampoule group 5 and cavity 6, quartz ampoule group 4 is distributed in module front end, infrared heating silk 2 is placed in quartz container 4, between quartz ampoule group 5 and infrared heating silk 2, space is filled with heat insulation plasterboard 3, and blast pipe 1 is installed on module rear end.Quartz ampoule group 5 is communicated with cavity 6 and burner hearth.Quartz ampoule group 5 has 24.
As shown in Figure 1,24 quartz ampoule groups are uniformly distributed in module front end.
The interior stream of blast pipe 1 has fresh air, and this fresh air enters burner hearth by quartz ampoule group 5 after entering cavity 6, thereby imitates the situation of reflux heating module.
Infrared heating silk 2 makes its filament light-emitting spectrum in far infrared spectral region by design.
The present invention adopts the method for infrared heating, puts into infrared heating silk 2 in quartz container 4, outwards radiation infrared by quartz container 4 after 2 energisings of infrared heating silk.Meanwhile, the blast pipe 1 connecting outside heating module allows fresh clean gas inject, by quartz ampoule group 5, is evenly blown in burner hearth.Heat insulation plasterboard 3 plays heat insulation effect, prevents that the live gas of injection from taking away the heat on infrared heating silk, guarantees heating effect.
The present invention well combines the advantage of infrared heating module and hot air reflux module, and mode of heating adopts the mode of infrared heating, heating simultaneously inside and outside can reaching, and homogeneous heating, drying effect is good.Owing to having introduced the concept of hot air reflux, in module, be also not exclusively static pressure simultaneously.In module, still have fresh gas inject, these gases can will stop VOC to flock together, and become air-flow slowly at freeze profile.By adjusting the flow direction of air-flow, the VOC producing in burner hearth is converged near air draft, by air exhausting device, these VOC are discharged to outside burner hearth.
Claims (5)
1. the compound infrared heating module for reflow soldering, it is characterized in that, this module comprises blast pipe (1), infrared heating silk (2), quartz container (4) and quartz ampoule group (5), described infrared heating silk (2) is put into quartz container (4), described quartz ampoule group (5) is located between adjacent infrared heating silk (2), and is communicated with blast pipe (1).
2. a kind of compound infrared heating module for reflow soldering according to claim 1, is characterized in that, between described quartz ampoule group (5) and infrared heating silk (2), space is filled with heat insulation plasterboard (3).
3. a kind of compound infrared heating module for reflow soldering according to claim 1, is characterized in that, described blast pipe (1) is communicated with burner hearth by quartz ampoule group (5).
4. a kind of compound infrared heating module for reflow soldering according to claim 1, is characterized in that, described quartz ampoule group (5) has 24.
5. a kind of compound infrared heating module for reflow soldering according to claim 1, is characterized in that, the interior stream of described blast pipe (1) has fresh air, and this fresh air enters burner hearth by quartz ampoule group (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420219655.3U CN203900678U (en) | 2014-04-30 | 2014-04-30 | Combined type infrared heating module used for reflow soldering furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420219655.3U CN203900678U (en) | 2014-04-30 | 2014-04-30 | Combined type infrared heating module used for reflow soldering furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203900678U true CN203900678U (en) | 2014-10-29 |
Family
ID=51774969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420219655.3U Expired - Lifetime CN203900678U (en) | 2014-04-30 | 2014-04-30 | Combined type infrared heating module used for reflow soldering furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203900678U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113751813A (en) * | 2021-08-03 | 2021-12-07 | 薛梦 | Reflow oven of hollow circuit board |
-
2014
- 2014-04-30 CN CN201420219655.3U patent/CN203900678U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113751813A (en) * | 2021-08-03 | 2021-12-07 | 薛梦 | Reflow oven of hollow circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141029 |