CN103008203B - Film curing device - Google Patents
Film curing device Download PDFInfo
- Publication number
- CN103008203B CN103008203B CN201210540488.8A CN201210540488A CN103008203B CN 103008203 B CN103008203 B CN 103008203B CN 201210540488 A CN201210540488 A CN 201210540488A CN 103008203 B CN103008203 B CN 103008203B
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- Prior art keywords
- furnace chamber
- gas
- film solidification
- solidification equipment
- heating
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- 238000010438 heat treatment Methods 0.000 claims abstract description 79
- 238000007711 solidification Methods 0.000 claims description 63
- 230000008023 solidification Effects 0.000 claims description 63
- 239000007789 gas Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000000112 cooling gas Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 abstract description 8
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000001351 cycling effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000005917 acylation reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 230000016507 interphase Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Abstract
The invention relates to the technical field of the manufacturing of liquid crystal display, in particular to a film curing device, which is used for improving the film curing efficiency. The invention discloses a film curing device, which comprises a furnace body with a furnace chamber, a furnace door which is arranged on the furnace body, a microwave heating unit which is arranged inside the furnace chamber, a control unit which is connected with the microwave heating unit through a signal and used for controlling the microwave intensity and heating time and an intake and exhaust unit which is arranged inside the furnace chamber. By adopting a microwave heating way, when a heated material is cured and heated, the heated material can reach a set heating temperature within a short time; in addition, the film curing device also can be used for cooling after the heating and temperature increase, so that the cycling time from a heating furnace to a cooling furnace can be reduced; and therefore, when the film curing device is used for curing the film, the film curing efficiency can be increased.
Description
Technical field
The present invention relates to liquid crystal display manufacturing technology field, particularly a kind of film solidification equipment.
Background technology
Film solidification refers to the process that the heating such as the photoresist be coated on substrate or alignment films are occurred chemical reaction, comprises two stages of heating and cooling, completes respectively at heating furnace and cool furnace; Particularly, first the substrate being coated with photoresist or alignment films is placed in heating furnace and heats, photoresist or alignment films are reacted, and then this substrate is placed on cooling curing in cool furnace.
But, existing heating furnace adopts heat conducting mode to heat, and be heated to 230 DEG C and will need about 25 minutes, the heat time is longer, and complete heating in heating furnace after, also will put cool furnace into and cool, need certain turnaround time; Therefore, utilize heating furnace and cool furnace to carry out the process length consuming time of film solidification, the efficiency of film solidification is low.
Summary of the invention
The object of the present invention is to provide a kind of film solidification equipment, for improving the efficiency of film solidification.
To achieve these goals, the invention provides following technical scheme:
A kind of film solidification equipment, comprising: the body of heater with furnace chamber; Be arranged on the fire door on described body of heater; Be arranged on the microwave heating unit in described furnace chamber; Be connected with described microwave heating unit signal, for controlling the control unit of microwave intensity and heat time; And the intake and exhaust unit be arranged in described furnace chamber.
Preferably, described intake and exhaust unit comprises:
Being fixedly mounted on described furnace chamber top, entering air inlet subelement in described furnace chamber for making gas;
And be fixedly mounted on described furnace chamber top, the exhaust subelement that the gas for entering in described furnace chamber is discharged.
Preferably, described control unit is programmable logic controller (PLC).
Preferably, described microwave heating unit is fixedly mounted on described furnace chamber top.
Further, above-mentioned film solidification equipment also comprises: be fixedly mounted on the support unit bottom described furnace chamber.
Preferably, described support unit is multiple glass support pipe or multiple ceramic support pipe.
Preferably, the height of described stay pipe is less than 5cm.
Further, above-mentioned film solidification equipment also comprises: be arranged on described fire door surrounding, for absorbing the gasket of the microwave from the slot leakage between described fire door and described body of heater.
Preferably, described gasket is silicon rubber gasket.
Further, above-mentioned film solidification equipment also comprises: be arranged on the interlocking microswitch on fire door.
Film solidification equipment provided by the invention, the mode of heating using microwave is adopted to heat, utilize microwave to the unique effect of molecule polar groups, namely microwave penetrates in heating object material and is converted into heat energy with the polar molecule interphase interaction in heating object material, heating object material each several part being heated up with obtaining heat in a flash, just can make the inside and outside heating simultaneously of heating object material without the need to any heat transfer process, heating up simultaneously; Compared with existing employing heat transfer mode of heating, heating object material can be made in the short period of time to reach the temperature of setting; In addition, film solidification equipment provided by the invention can also cool fast to heating object material, decreases the turnaround time from forwarding cool furnace heating furnace week to; Therefore, compared with prior art, utilize film solidification equipment provided by the invention to carry out film solidification, reduce heat time and turnaround time, thus improve the efficiency of film solidification.
Accompanying drawing explanation
The structural representation of a kind of film solidification equipment that Fig. 1 provides for the embodiment of the present invention;
The graph of a relation of the microwave heating time that Fig. 2 provides for the embodiment of the present invention and sub-acylation degree.
Detailed description of the invention
Existing film solidification process, the heat conducting mode of heating of general employing carries out film solidification, heat time is longer, and, also to cool in cool furnace after heating completes, need certain turnaround time, therefore, utilize heating furnace and cool furnace to carry out the process length consuming time of film solidification, film curing efficiency is low.
In view of this, the invention provides a kind of technical scheme of improvement, adopt the mode of heating using microwave to carry out film solidification, will the time of heating be shortened; And heating and cooling are arranged in same device, decrease the turnaround time, thus improve the efficiency of film solidification.
In order to make those skilled in the art better understand technical scheme of the present invention, below in conjunction with Figure of description, the embodiment of the present invention is described in detail.
First declare, in liquid crystal display manufacturing technology field, film solidification comprises: photoresist solidification, alignment films solidification and sealed plastic box solidification etc., for convenience, hereafter will be cured as example with alignment films and be described.
As shown in Figure 1, a kind of film solidification equipment provided by the invention, comprising: the body of heater 10 with furnace chamber, is arranged on the fire door 11 on body of heater 10, is arranged on the microwave heating unit 13 in furnace chamber; Be connected with microwave heating unit 13 signal, for controlling the control unit (not shown in FIG.) of microwave intensity and heat time; And the intake and exhaust unit 14 be arranged in furnace chamber.
Particularly, adopt the mode of heating using microwave, utilize microwave to the unique effect of molecule polar groups, namely microwave penetrates in alignment films and is converted into heat energy with the polar molecule interphase interaction of alignment films, makes alignment films each several part all in the sub-acylation reaction of the polyamic acid that heated up with obtaining heat in a flash; As shown in Figure 2; in the sub-acylation reaction of polyamic acid; in microwave heating time 7min, sub-acylation degree can reach 91%; and conventional heating 5 hours sub-acylation degree just can reach 57%; visible, adopt the mode of heating using microwave to carry out film solidification, firing rate is fast; the sub-acylation reaction of polyamic acid is complete, thus significantly improves the efficiency of film solidification.
In addition, in large scale liquid crystal faceplate manufacturing process, when film solidification is carried out to alignment films, the mode of heating using microwave is adopted to carry out film solidification, film solidification equipment to alignment films inside and outside simultaneously heat, heat up simultaneously, homogeneous heating, there will not be alignment films uneven thickness one, thus ensures the picture display quality of liquid crystal panel.
When the film solidification equipment using the embodiment of the present invention to provide carries out alignment films solidification, the substrate 1 being coated with alignment films is placed in furnace chamber, open microwave heating unit 13 and intake and exhaust unit 14, utilize microwave to the unique effect of molecule polar groups, namely microwave penetrates the polar molecule interphase interaction in alignment films and in alignment films and is converted into heat energy, alignment films each several part being heated up with obtaining heat in a flash, just can make the inside and outside heating simultaneously of alignment films without the need to any heat transfer process, heating up simultaneously.In the heating period, in furnace chamber, supply gas at normal temperature by intake and exhaust unit 14, the solvent volatilized in film solidification process and foreign matter are discharged furnace chamber by exhaust outlet; After having heated, in furnace chamber, supply refrigerating gas by intake and exhaust unit 14, accelerate alignment films cooling; Therefore, compared with prior art, the film solidification equipment adopting the embodiment of the present invention to provide, can complete film solidification in the short period of time, and decreases the turnaround time from forwarding cool furnace heating furnace week to, thus improves the efficiency of film solidification.
Continue see Fig. 1, preferably, above-mentioned intake and exhaust unit 14 comprises: be fixedly mounted on furnace chamber top, enters air inlet subelement 141 in furnace chamber for making gas; And be fixedly mounted on furnace chamber top, the exhaust subelement 142 that the gas for entering in furnace chamber is discharged.Wherein, air inlet subelement 141 respectively with for gas at normal temperature pipeline and refrigerating gas pipeline connection, in furnace chamber for gas at normal temperature and refrigerating gas; Exhaust subelement 142 is communicated with gas exhaust piping, discharges furnace chamber by entering in furnace chamber the gas absorbing solvent and the foreign matter volatilized in film solidification process.Particularly, when opening microwave heating unit 13, also open gas at normal temperature pipeline simultaneously, by air inlet subelement 141, gas at normal temperature is sent in furnace chamber, the gas entered in furnace chamber flows on substrate 1 surface, exhaust subelement 142 will enter the gas in furnace chamber, and the solvent volatilized in film solidification process and foreign matter discharge furnace chamber; After heating completes, close microwave heating unit 13, close gas at normal temperature pipeline, open cooling gas piping, cooling-air is entered in furnace chamber alignment films is cooled.Compared with prior art, adopt the film solidification equipment that the present embodiment provides, heating and cooling are carried out at same device, decrease turnaround time substrate being transferred to cool furnace, thus improve the efficiency of film solidification.
Preferably, above-mentioned control unit is programmable logic controller (PLC), can write and control microwave intensity and the program of heat time in programmable logic controller (PLC), so that control microwave intensity and heat time.By setting microwave intensity and heat time, control the microwave that microwave heating unit 13 sends preset strength, and complete heating in Preset Time.Preferably, in the specific implementation, in programmable logic controller (PLC), setting sends the microwave that frequency is fixed on 915MHZ wavelength, the microwave of this frequency is corresponding with the dielectric constant of orientation liquid, the microwave that microwave heating unit can be made to launch has the effect of selective heating, namely only heat for orientation liquid, so can reduce energy consumption, thus cost-saving.
In the specific implementation, above-mentioned microwave heating unit 13 is platy structure, is fixedly mounted on the top of furnace chamber, bottom or sidewall; Preferably, microwave heating unit 13 is fixedly mounted on the top of furnace chamber.
Continue see Fig. 1, above-mentioned film solidification equipment also comprises: be fixedly mounted on the support unit 12 bottom furnace chamber; Setting like this is beneficial to air circulation, accelerates cooling effectiveness.
Preferably, above-mentioned support unit 12 is multiple glass support pipe or multiple ceramic support pipe; Microwave is so set and can penetrates glass or pottery, such microwave just can in furnace chamber roundtrip, improve microwave utilization rate, simultaneously more homogeneous to alignment films heating to be solidified.
Preferably, the height of above-mentioned stay pipe is less than 5cm.
Further, above-mentioned film solidification equipment also comprises: be arranged on described fire door 11 surrounding, for absorbing the gasket of the microwave from the slot leakage between fire door 11 and body of heater 10.
Preferably, gasket is silicon rubber gasket.Setting like this, can fall a small amount of microwave absorption gone out from slot leakage between fire door 11 and body of heater 10, reduces microwave to the infringement of operator, improves the processing safety of film solidification equipment.
Further, above-mentioned film solidification equipment also comprises the interlocking microswitch be arranged on fire door; When fire door does not shut or open fire door, powered-down, improves the processing safety of film solidification equipment further.
In sum, film solidification equipment provided by the invention, the mode of heating using microwave is adopted to heat, utilize microwave to the unique effect of molecule polar groups, namely microwave penetrates in heating object material and is converted into heat energy with the polar molecule interphase interaction in heating object material, heating object material each several part being heated up with obtaining heat in a flash, just can make the inside and outside heating simultaneously of heating object material without the need to any heat transfer process, heating up simultaneously; Compared with existing employing heat transfer mode of heating, heating object material can be made in the short period of time to reach the temperature of setting; In addition, film solidification equipment provided by the invention can also cool fast to heating object material, reduces the turnaround time of knowing clearly from forwarding cool furnace heating furnace week to; Therefore, compared with prior art, utilize film solidification equipment provided by the invention to carry out film solidification, reduce heat time and turnaround time, thus improve the efficiency of film solidification.
In addition, adopt the mode of heating using microwave to carry out film solidification, homogeneous heating, there will not be alignment films uneven thickness one situation, thus improve liquid crystal panel display quality.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a film solidification equipment, comprising: the body of heater with furnace chamber, is arranged on the fire door on described body of heater; It is characterized in that, also comprise:
Be arranged on the microwave heating unit in described furnace chamber;
Be connected with described microwave heating unit signal, for controlling the control unit of microwave intensity and heat time;
And the intake and exhaust unit be arranged in described furnace chamber, described intake and exhaust unit comprises for making gas enter air inlet subelement in described furnace chamber; Described air inlet subelement respectively with for gas at normal temperature pipeline and refrigerating gas pipeline connection, in furnace chamber for gas at normal temperature and refrigerating gas;
When opening microwave heating unit, also open gas at normal temperature pipeline, send in furnace chamber by air inlet subelement by gas at normal temperature, the gas entered in furnace chamber flows at substrate surface simultaneously; After heating completes, close microwave heating unit, close gas at normal temperature pipeline, open cooling gas piping, cooling-air is entered in furnace chamber alignment films is cooled.
2. film solidification equipment as claimed in claim 1, it is characterized in that, described intake and exhaust unit also comprises:
Be fixedly mounted on described furnace chamber top, the exhaust subelement that the gas for entering in described furnace chamber is discharged;
Described air inlet subelement is fixedly mounted on described furnace chamber top, enters air inlet subelement in described furnace chamber for making gas.
3. film solidification equipment as claimed in claim 1, it is characterized in that, described control unit is programmable logic controller (PLC).
4. the film solidification equipment as described in as arbitrary in claim 1-3, it is characterized in that, described microwave heating unit is fixedly mounted on described furnace chamber top.
5. film solidification equipment as claimed in claim 4, is characterized in that, also comprise: be fixedly mounted on the support unit bottom described furnace chamber.
6. film solidification equipment as claimed in claim 5, it is characterized in that, described support unit is multiple glass support pipe or multiple ceramic support pipe.
7. film solidification equipment as claimed in claim 6, it is characterized in that, the height of described stay pipe is less than 5cm.
8. film solidification equipment as claimed in claim 1, is characterized in that, also comprise: be arranged on described fire door surrounding, for absorbing the gasket of the microwave from the slot leakage between described fire door and described body of heater.
9. film solidification equipment as claimed in claim 8, it is characterized in that, described gasket is silicon rubber gasket.
10. film solidification equipment as claimed in claim 1, is characterized in that, also comprise: be arranged on the interlocking microswitch on described fire door.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210540488.8A CN103008203B (en) | 2012-12-13 | 2012-12-13 | Film curing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210540488.8A CN103008203B (en) | 2012-12-13 | 2012-12-13 | Film curing device |
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CN103008203A CN103008203A (en) | 2013-04-03 |
CN103008203B true CN103008203B (en) | 2015-07-15 |
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CN201210540488.8A Expired - Fee Related CN103008203B (en) | 2012-12-13 | 2012-12-13 | Film curing device |
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Families Citing this family (5)
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CN104280943B (en) * | 2014-10-31 | 2017-03-29 | 合肥鑫晟光电科技有限公司 | Heating chamber and thermal-curable system |
CN104312478B (en) * | 2014-10-31 | 2017-08-25 | 合肥鑫晟光电科技有限公司 | Sealant composition, display device, heating chamber and thermal-curable system |
CN105271792B (en) * | 2015-09-24 | 2018-03-27 | 京东方科技集团股份有限公司 | Solidification equipment and curing |
CN110296583A (en) * | 2018-03-21 | 2019-10-01 | 安徽瑞科玛电池有限公司 | A kind of lithium battery drying unit |
CN113406821B (en) * | 2021-06-18 | 2022-07-29 | 深圳市华星光电半导体显示技术有限公司 | Baking device for liquid crystal alignment film |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102059214A (en) * | 2010-12-06 | 2011-05-18 | 惠州市德赛聚能电池有限公司 | Coating drying technology and device thereof |
CN102468158A (en) * | 2010-10-28 | 2012-05-23 | 株式会社日立国际电气 | Substrate processing apparatus and method of manufacturing a semiconductor device |
CN102806188A (en) * | 2011-05-30 | 2012-12-05 | 张家港市佳龙真空浸漆设备制造厂 | Continuous microwave curing equipment for vacuum pressure paint impregnation electrical equipment |
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JP5982758B2 (en) * | 2011-02-23 | 2016-08-31 | 東京エレクトロン株式会社 | Microwave irradiation device |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102468158A (en) * | 2010-10-28 | 2012-05-23 | 株式会社日立国际电气 | Substrate processing apparatus and method of manufacturing a semiconductor device |
CN102059214A (en) * | 2010-12-06 | 2011-05-18 | 惠州市德赛聚能电池有限公司 | Coating drying technology and device thereof |
CN102806188A (en) * | 2011-05-30 | 2012-12-05 | 张家港市佳龙真空浸漆设备制造厂 | Continuous microwave curing equipment for vacuum pressure paint impregnation electrical equipment |
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