TWM512209U - Heater block of rapid thermal processing apparatus - Google Patents

Description

Rapid hot process equipment

This creation relates to a process equipment, particularly to a fast thermal process equipment.

Rapid Thermal Processing (RTP) refers to heating the surface of the wafer at an extremely fast rate for stress relief, annealing, and the like. In order to maintain process stability, an airtight cavity or vacuum environment is required to place the wafer therein. The outside of the airtight cavity is a quartz plate as a window, and the light of the lamp penetrates the quartz plate to heat the wafer in the airtight cavity. However, when the process requires a higher temperature or a lower vacuum, the quartz plate is broken, so the quartz plate must be increased in thickness to withstand the internal and external pressure difference caused by the high vacuum. However, the increase in thickness causes the heat radiation penetration of the lamp to become low, which in turn increases the lamp power or quantity to maintain the temperature and temperature rise of the entire apparatus, resulting in a large amount of energy consumed by the entire apparatus on the thickened quartz plate.

Therefore, in order to solve the above problems, the purpose of the present invention is to provide a rapid thermal process equipment, which can solve the problem of quartz plate design strength, and achieve the purpose of rapid temperature rise and energy loss reduction.

The technical means adopted by the present invention to solve the problems of the prior art provides a rapid thermal process apparatus for forming a high temperature airtight environment for heat treatment. The rapid thermal process apparatus comprises: an airtight cavity having an airtight cavity a chamber for placing a heat-treated target object; a plurality of tubes having radiation penetrability, each of the tubes being disposed in the airtight chamber, and one end of each of the tubes is joined to the airtight chamber to communicate with the external space, thereby The inside of the plurality of tubes is isolated from the airtight chamber; and a plurality of heating elements are disposed correspondingly inside the plurality of tubes, and the airtight chamber is heated through the tube to form the airtight chamber The heat-treated object is heat-treated in a high-temperature airtight environment.

In an embodiment of the present invention, a rapid thermal processing apparatus is provided, further comprising a stage disposed in the airtight chamber for mounting the heat treatment target object.

In an embodiment of the present invention, a rapid thermal processing apparatus is provided, further comprising a transparent quartz plate disposed in the airtight cavity and interposed between the loading stage and the plurality of tubes to form a process Chamber.

In an embodiment of the present invention, a rapid thermal process apparatus is provided, further comprising a process gas vent.

In an embodiment of the present invention, a rapid thermal processing apparatus is provided, and the plurality of tubes and the plurality of heating elements are respectively disposed on upper and lower sides of the heat treatment target object.

In an embodiment of the present disclosure, a rapid thermal process apparatus is provided, the plurality of heating elements being juxtaposed.

In one embodiment of the present disclosure, a rapid thermal process apparatus is provided, the plurality of heating elements being staggered.

Through the technical means adopted by the present creation, the rapid thermal processing equipment provided by the present invention is provided with a plurality of heating elements correspondingly disposed inside a plurality of tubes having good radiation penetration, and the heating elements are made of tubes and airtight chambers. Isolated. Since the pipe is tubular and has good resistance to pressure difference, the heat energy of the heating element of the present invention only needs to penetrate the wall of the thin pipe to heat the target object, thereby reducing the loss of heat radiation and increasing the temperature rise. effectiveness. In addition, the heating element can be connected to the airtight cavity through the opening of the airtight cavity to avoid the complicated replacement action, which is convenient for operation and maintenance.

In an embodiment of the present invention, a rapid thermal process apparatus is provided, further comprising a sealing member seal disposed between the airtight cavity and the pipe such that the heating element can extend beyond the airtight cavity.

The specific embodiments of the present invention will be further described by the following examples and accompanying drawings.

Embodiments of the present creation will be described below based on Figs. 1 to 3 . This description is not intended to limit the implementation of the present invention, but is one of the embodiments of the present invention.

As shown in FIG. 1 to FIG. 2, a rapid thermal processing apparatus 100 according to a first embodiment of the present invention is used to form a high temperature airtight environment for heat treatment, and the rapid thermal processing apparatus 100 includes an airtight chamber 1 , a plurality of heating elements 2, and a plurality of tubes 3 having good radiation penetration.

The airtight chamber 1 has an airtight chamber R for placing a heat treatment target object W. The heat treatment target object W may be a wafer, a semiconductor element, or a target. In detail, the airtight cavity 1 has an air suction port (not shown) for connecting a vacuuming mechanism to evacuate the airtight chamber R to form an airtight environment.

Each of the tubes 3 is disposed in the airtight chamber R, and at least one end of each of the tubes 3 is joined to the airtight chamber 1 to communicate with the external space, so that the plurality of heating elements 2 are separated from the inside and the airtight chamber of the plurality of tubes 3 The R phase is isolated to prevent the heating element 2 from contaminating the vacuum chamber R and the heat treatment target object W. The pipe 3 has good radiation penetration, such as a quartz tube, sapphire, or yttrium fluoride, but the present creation is not limited thereto.

The heating element 2 is disposed correspondingly inside the pipe 3, and heats the airtight chamber R through the pipe 2 to form a high temperature airtight environment in the airtight chamber R, so as to quickly heat treat the heat treatment target object W, for example, stress relief, Annealing and so on. The heating element 2 can be a halogen source, but is not limited to infrared, ultraviolet, radiation, laser, ultrasonic, electromagnetic, microwave heating. In the present embodiment, the plurality of heating elements 2 are juxtaposed to each other, but the present invention is not limited thereto, and in other embodiments, the plurality of heating elements may be arranged in an interlaced manner. In the present embodiment, the heating element 2 further includes a power connector 21 for connecting to a power supply mechanism E.

The heat energy generated by the heating element 2 penetrates the pipe wall of the pipe 3 from the inside of the pipe 3 to the heat treatment target object W. In the present creation, the inside of the pipe 3 and the inside of the airtight chamber R are vacuum, and the inside of the pipe 3 is a normal pressure, so that there is a pressure difference between the inside and the outside of the pipe 3. Since the pipe 3 is a round pipe and has good pressure resistance, the thickness of the pipe wall is not enough to be treated or thickened enough to resist the pressure difference between the inside and the outside of the pipe 3. Thereby, the heat energy generated by the heating element 2 can easily penetrate the pipe wall of the pipe 3 to rapidly heat up and reduce energy loss.

Preferably, the opening of the pipe 3 connected to the airtight cavity 1 allows the heating element 2 to pass through the inside of the pipe 3 in a removable manner, thereby facilitating maintenance and replacement.

The rapid thermal processing apparatus 100 of the present embodiment further includes a sealing member 4 and a stage 5. The heating element 2 extends to the outside of the airtight chamber 1 and the sealing member 4 is sealingly disposed between the airtight chamber 1 and the tube 3 such that the heating element 2 can extend beyond the airtight chamber 1. The material of the sealing member 4 has heat insulation or self-cooling ability to prevent the heat energy provided by the heating element 2 from leaking from the opening of the pipe 3 to the outer space of the rapid thermal processing apparatus 100. The power connector 21 passes through the sealing member 4 to connect the body of the heating element 2 and the power supply mechanism E. The stage 5 is disposed in the airtight chamber R for placing the heat treatment target object W.

As shown in FIG. 3, a rapid thermal processing apparatus 100a according to another embodiment of the present invention is similar to the rapid thermal processing apparatus 100 of the embodiment of FIG. 2, and includes a gas-tight chamber 1 and a plurality of heatings. Element 2, and a plurality of tubes 3 having good radiation penetration. The main difference between the two embodiments is that the rapid thermal processing apparatus 100a further includes two light transmissive quartz plates 6 and a process gas vent 7, and a plurality of heating elements 2 are respectively disposed on the upper and lower sides of the heat treatment target object W. Two transparent quartz plates 6 are disposed in the airtight chamber R and are disposed between the stage 5 and the plurality of tubes 3 to form a process chamber P. The plurality of heating elements 2 respectively heat the heat-treated target article W from the outside of the process chamber P. Since the two transparent quartz plates 6 are all located in the airtight chamber R in a vacuum environment, there is almost no pressure difference between the upper and lower sides of the transparent quartz plate 6, thereby reducing the thickness requirement of the transparent quartz plate 6, and also avoiding heating. The thermal energy of the element 2 is wasted in the translucent quartz plate 6 which is penetrated too thick. The process gas vent 7 is used to introduce a process gas, such as nitrogen or an inert gas, into the process chamber P to meet specific process requirements.

In summary, the rapid thermal processing equipment provided by the present invention has a plurality of heating elements correspondingly disposed inside a plurality of tubes having good radiation penetration, and the heating elements are separated from the airtight chamber by the tubes. Compared with the prior art, the pipe of the present invention is tubular and has good resistance to pressure difference, so the pipe wall can be quite thin, and the heat energy of the heating element of the present invention only needs to penetrate the pipe wall of the thin pipe. Heat treatment of the target object to reduce heat radiation loss to improve heating efficiency. In addition, since the normal pressure is maintained between the inside of the pipe and the heating element, the heating element does not need to use a special material or strengthen the thickness of the lamp in order to resist the vacuum environment of the vacuum chamber, thereby reducing the production cost. In addition, the heating element can be connected to the airtight cavity through the opening of the airtight cavity to avoid the complicated replacement action, which is convenient for operation and maintenance.

The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications based on the scope of the patent application as defined below and the above description, but such modifications still belong to The creative spirit of this creation is within the scope of this creation.

100‧‧‧Quick thermal process equipment
100a‧‧‧Quick thermal process equipment
1‧‧‧ airtight cavity
2‧‧‧ heating element
21‧‧‧Power connectors
3‧‧‧ pipes
4‧‧‧ Sealing members
5‧‧‧ stage
6‧‧‧Transparent quartz plate
7‧‧‧Process gas vents
E‧‧‧Power supply agency
P‧‧‧Processing chamber
R‧‧‧ airtight chamber
W‧‧‧ Heat treatment target

Fig. 1 is a schematic view showing a rapid thermal process apparatus according to an embodiment of the present invention. Figure 2 is a cross-sectional view showing a rapid thermal process apparatus in accordance with an embodiment of the present invention. Figure 3 is a cross-sectional view showing a rapid thermal process apparatus in accordance with another embodiment of the present invention.

100‧‧‧Quick thermal process equipment

1‧‧‧ airtight cavity

2‧‧‧ heating element

21‧‧‧Power connectors

3‧‧‧ pipes

4‧‧‧ Sealing members

E‧‧‧Power supply agency

R‧‧‧ airtight chamber

Claims (9)

A rapid thermal processing apparatus for forming a high temperature airtight environment for heat treatment, the rapid thermal process apparatus comprising: an airtight chamber having an airtight chamber for placing a heat treatment target object; and a plurality of radiation penetrating properties The tube is disposed in the airtight chamber and one end of each of the tubes is joined to the airtight cavity to communicate with the external space, so that the inside of the plurality of tubes is isolated from the airtight chamber; and a plurality of heating The component is disposed inside the plurality of tubes, and the airtight chamber is heated through the tube to form the high temperature airtight environment in the airtight chamber to heat treat the heat treatment target object. The rapid thermal processing apparatus according to claim 1, further comprising a stage disposed in the airtight chamber for loading the heat treatment target object. The rapid thermal processing apparatus of claim 2, further comprising a light transmissive quartz plate disposed in the airtight cavity and interposed between the loading stage and the plurality of tubes to form a process chamber. The rapid thermal process apparatus of claim 1, further comprising a process gas vent. The rapid thermal processing apparatus of claim 1, wherein the plurality of tubes and the plurality of heating elements are respectively disposed on upper and lower sides of the heat treatment target object. The rapid thermal process apparatus of claim 1, wherein the plurality of heating elements are juxtaposed. The rapid thermal processing apparatus of claim 1, wherein the plurality of heating elements are staggered. The rapid thermal processing apparatus of claim 1, further comprising a sealing member disposed between the airtight cavity and the radiation penetrating tube to extend the heating element to the airtight cavity outer. The rapid thermal processing apparatus of claim 1, wherein the heating element is replaceably placed in the radiation-permeable tube.