CN203855685U - Heat treatment device - Google Patents
Heat treatment device Download PDFInfo
- Publication number
- CN203855685U CN203855685U CN201420074781.4U CN201420074781U CN203855685U CN 203855685 U CN203855685 U CN 203855685U CN 201420074781 U CN201420074781 U CN 201420074781U CN 203855685 U CN203855685 U CN 203855685U
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- Prior art keywords
- interlayer
- thermal treatment
- treatment unit
- heating
- thermal
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 65
- 239000011229 interlayer Substances 0.000 claims abstract description 121
- 239000010410 layer Substances 0.000 claims abstract description 30
- 238000007669 thermal treatment Methods 0.000 claims description 78
- 238000009413 insulation Methods 0.000 claims description 44
- 230000008676 import Effects 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 238000005265 energy consumption Methods 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000001603 reducing effect Effects 0.000 abstract description 2
- 238000004321 preservation Methods 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The utility model relates to a semiconductor treatment device and discloses a heat treatment device which comprises a heating layer and an interlayer, wherein the interlayer surrounds a sample to be heated to form a heating cavity; the heating layer is arranged in the heating cavity and used for heating the sample to be heated; the interlayer is hollow inside to allow external gas to enter the interlayer. According to the heat treatment device disclosed by the utility model, the interlayer hollow inside is arranged in the heat treatment device, and the gas pressure in the interlayer is controlled; when the heat treatment device is in a heating to a heat preservation stage, the gas pressure in the interlayer is controlled to a negative pressure, and the heat loss caused by heat transfer and heat convection is reduced so that the temperature in the heat treatment device quickly reaches the process temperature; when the heat treatment device is in heat preservation at the process temperature, the energy consumption for keeping the process temperature can be reduced; when the heat treatment device is in cooling, the pressure in the interlayer is controlled to a non-negative pressure state, and the gas stays in a flow state to carry the heat away so as to realize an effect of quickly heating and cooling and achieve an aim of reducing the energy consumption for the heating/heat preservation of the heat treatment device.
Description
Technical field
The utility model relates to heat treatment technics field, particularly a kind of thermal treatment unit of rapid temperature rise and drop.
Background technology
In semi-conductor manufacture and production technology, the semiconductor crystal wafer as processed substrate is implemented to the various thermal treatments such as film forming processing, oxide-diffused processing, modification, anneal.In these heat treatment processes, especially for remove strain after film forming anneal and ion implantation after anneal process in, from improving processing power and diffusion being suppressed to the angle for irreducible minimum, the technical need of heat treatment process trends towards the cooling that heats up at high speed.
In prior art, in technical field of semiconductors, thermal treatment unit is mainly made up of parts such as heater strip, thermal insulation layer, metal outer wall, the innermost layer of heater strip in thermal treatment unit, and thermal insulation layer is coated on heater strip outside, and outermost is wrapped up by metal outer wall.Conventional Heat Treatment device, thermal insulation layer is made up of certain thickness single material, and temperature rise rate and rate of temperature fall are comparatively slow, have extended the process time, affect productive rate; There is the thermal treatment unit of fast lifting temperature function, conventionally, on conventional Heat Treatment device basic, realize fast lifting temperature function by the mode of the air-supply of perforate on thermal insulation layer.
Fig. 1 is thermal treatment unit structural representation in prior art.
As shown in Figure 1, in prior art, thermal treatment unit 100 comprises zone of heating 102 and thermal insulation layer 101, described thermal insulation layer 101 forms a heating chamber around sample to be heated (not indicating in accompanying drawing), described zone of heating 102 is arranged on thermal insulation layer 101 inside, has through hole 103, at described thermal insulation layer 101 sidewalls in the time that thermal treatment unit 100 need to be lowered the temperature, cold wind can enter heating chamber by described through hole 103, thereby realizes the cooling of thermal treatment unit 100.
Chinese patent CN102414800A discloses a kind of thermal treatment unit, and it has in the space of the ring-type of the heat-eliminating medium stream of the heat-eliminating mediums such as internal circulation water coolant, and by passing into heat-eliminating medium, for example, water coolant is realized the fast cooling of thermal treatment unit.
Above-mentioned prior art, due to thermosteresis, needs the temperature of enough power ability maintenance heat treatment unit inside, and energy consumption is larger.Therefore, in semiconductor production, be badly in need of less energy-consumption, can realize rapid temperature rise and drop and there is the high-performance thermal treatment unit of heat insulation effect.
Utility model content
Technical problem to be solved in the utility model is, a kind of thermal treatment unit is provided, and can realize rapid temperature rise and drop, and have lower energy consumption.
In order to address the above problem, the utility model provides a kind of thermal treatment unit, comprises zone of heating and interlayer, the inner smooth surface of described interlayer and inner hollow, and form heating chamber around sample to be heated; Described zone of heating is positioned at described interlayer inner side, is arranged in described heating chamber.
As selectable technical scheme, between described zone of heating and described interlayer, be provided with the first thermal insulation layer, described interlayer arranged outside has the second thermal insulation layer, and described interlayer outer surface is coated with reflectance coating, all for preventing the heat loss of described heating chamber.
As selectable technical scheme, described interlayer comprises 2 or 2 above secondary interlayers, and described secondary interlayer is spliced to form the heating chamber around sample to be heated.Further, zone of heating lead-in wire is arranged between adjacent described secondary interlayer, between adjacent twice level interlayers, has space, and described space allows lead-in wire and the thermopair of zone of heating to pass through.Further, in described secondary interlayer, be provided with supporting pad, described supporting pad is arranged at described secondary interlayer inner hollow position.
As selectable technical scheme, described secondary interlayer has import and outlet, passes into and extracts out for gas.Further, between described secondary interlayer and import, outlet, without splicing seams, be seamless integral structure; Further, described import is arranged on secondary interlayer top, and described outlet is arranged on secondary interlayer bottom; Further, described import and outlet are relatively arranged on the diagonal lines two-end-point place of described secondary interlayer.
As selectable technical scheme, described outlet is connected with vacuum generator; Described import and exit are provided with blower fan, adjust air-flow to form in described interlayer.
As selectable technical scheme, this thermal treatment unit also comprises end insulation block, set collar and shell, described end insulation block, set collar are all arranged at top and the bottom of described thermal treatment unit, and described shell is around described the second thermal insulation layer, and are connected with described set collar.
As selectable technical scheme, this thermal treatment unit also comprises top insulation cover, and described top insulation cover is arranged at the top of described thermal treatment unit.
The thermal treatment unit that the utility model provides, by the interlayer of an inner hollow is set in thermal treatment unit, and heating and cooling are realized and controlled to the gaseous tension (being gas concentration) of controlling interlayer inside and insulation is processed.When thermal treatment unit intensification and to holding stage, controlling interlayer internal gas pressure is negative pressure, reduces the thermosteresis that heat is transmitted and thermal convection brings, and makes thermal treatment unit internal temperature arrive fast technological temperature, when arrival technological temperature is incubated, can reduce the energy consumption that maintains technological temperature; In the time that thermal treatment unit is lowered the temperature, controlling interlayer internal pressure is non-negative pressure state, and makes gas take away heat in flow state, reaches the effect of thermal treatment unit rapid temperature rise and drop, the object of energy consumption thereby realization reduction thermal treatment unit heats up/is incubated.
Brief description of the drawings
Fig. 1 is thermal treatment unit structural representation in prior art;
The thermal treatment unit structure exploded perspective view that Fig. 2 provides for the utility model;
The thermal treatment unit structural representation that Fig. 3 provides for the utility model;
The thermal treatment unit cross-sectional view that Fig. 4 provides for the utility model;
The secondary sandwich structure schematic diagram of thermal treatment unit that Fig. 5 provides for the utility model;
The secondary interlayer sectional view of thermal treatment unit that Fig. 6 provides for the utility model;
The thermal treatment unit vertical view that Fig. 7 provides for the utility model.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
Those skilled in the art can understand other advantages of the present utility model and effect easily by the disclosed content of this specification sheets.The utility model can also be implemented or be applied by other different embodiment, and the every details in this specification sheets also can be based on different viewpoints and application, carries out various modifications or change not deviating under spirit of the present utility model.
Fig. 2～Fig. 4 is respectively thermal treatment unit structure exploded perspective view, thermal treatment unit structural representation and the thermal treatment unit cross-sectional view that the utility model provides.
As shown in Figure 2, the thermal treatment unit 200 that this embodiment provides comprises zone of heating 1, interlayer 4, the first thermal insulation layer 2, the second thermal insulation layer 3, end insulation block 8, set collar 9, top insulation cover 13 and shell 10.
As shown in Figure 2 to 4, in this embodiment, described interlayer 4 forms a heating chamber (not indicating in accompanying drawing) around sample to be heated (not indicating in accompanying drawing).Described zone of heating 1 is arranged in described heating chamber, is positioned at described interlayer 4 inner sides.In this embodiment, described zone of heating 1 is heater strip, and described zone of heating 1 is around described sample to be heated, with sample to be heated described in Omnidirectional heating.Described interlayer 4 is non-metallic material, and interlayer 4 inside configuration smooth surfaces, and inner hollow allow ambient atmos to enter described interlayer 4, to control the gaseous tension (being gas concentration) of interlayer 4 inside.
Fig. 5, Fig. 6 are respectively the secondary sandwich structure schematic diagram of thermal treatment unit and the secondary interlayer sectional view that the utility model provides.
As shown in Figure 5, Figure 6, described interlayer 4 comprises two or more secondary interlayers 12, and these secondary interlayer 12 constitutional featuress are consistent with interlayer 4, and all inner hollow allow air-flow to pass through.In other words, described secondary interlayer 12 is arc structure, described multiple secondary interlayer 12 splicing composition interlayers 4, and then the heating chamber of formation belt passing round heated sample.The lead-in wire of zone of heating 1 is arranged between twice adjacent level interlayers 12, therefore, between adjacent twice level interlayers 12, has space, and this space allows the lead-in wire (not indicating in accompanying drawing) of zone of heating 1 and thermopair (not indicating in accompanying drawing) to pass through.
As preferred implementation, as shown in Fig. 2～Fig. 6, described interlayer 4 comprises 2 secondary interlayers 12, this secondary interlayer 12 is the convex structure of approximately 180 °, described two secondary interlayers 12 act synergistically, be spliced to form annular interlayer 4 around described sample to be heated, make described interlayer 4 form the heating chamber around sample to be heated.Between two that are spliced to form interlayer 4 secondary interlayers 12, having space, is the splicing gap between adjacent twice level interlayers 12, and described space allows lead-in wire and the thermopair of zone of heating 1 to pass through.
As optional embodiment, the secondary interlayer 12 of described interlayer 4 is made up of quartz, and is jointless structure, all has certain intensity and rigidity under high temperature and negative pressure.
As shown in Figure 6, in this embodiment, inside in described interlayer 4 hollows is also provided with supporting pad 11, described supporting pad 11 is positioned at the part of described secondary interlayer 12 inner hollow, in order to strengthen the intensity of 4/ level interlayer 12 of interlayer under negative pressure state, prevent the inner recess of 4/ level interlayer 12 sidewall of interlayer to 4/ level interlayer 12 hollow of interlayer.Preferably, supporting pad 11 is positioned at the inner hollow part of each secondary interlayer 12 near mid-way.
As optional embodiment, in the outside of described interlayer 4, near a side of shell 10, be provided with reflectance coating (not indicating in figure), further stop heat transmission, reduce calorific loss, to strengthen heat insulation effect.
As preferred implementation, as shown in Figure 2 to 4, between described zone of heating 1 and interlayer 4, be also provided with the first thermal insulation layer 2, described the first thermal insulation layer 2 is for preventing the heat loss of heating chamber, and is the installation of zone of heating 1 condition of fixedly providing convenience.As optional embodiment, the material of the first thermal insulation layer 2 is insulating cotton.
As preferred forms, described interlayer 4 outsides are also provided with the second thermal insulation layer 3, and described the second thermal insulation layer 3, for preventing the heat loss of described heating chamber, can be convenient to the installation of shell 10 simultaneously.As optional embodiment, the material of described the second thermal insulation layer 3 is insulating cotton.
In this embodiment, when thermal treatment unit 200 heats up and during to holding stage, controlling interlayer 4 internal gas pressures is negative pressure, even if interlayer 4 inside have lower gas concentration, thereby reduce the thermosteresis that heat is transmitted and thermal convection brings, make thermal treatment unit 200 internal temperatures arrive fast technological temperature, when arrival technological temperature is incubated, can reduce the energy consumption that maintains technological temperature.
In this embodiment, in the time that thermal treatment unit 200 is lowered the temperature, controlling interlayer 4 internal pressures is non-negative pressure state, even if interlayer 4 inside have higher gas concentration, and make gas take away heat in flow state, make thermal treatment unit 200 internal temperature fast reducings and reach target temperature.
The thermal treatment unit structure vertical view that Fig. 7 provides for the utility model.
In this embodiment, in order to realize above-mentioned fast lifting temp effect, and reduce the thermal treatment unit energy consumption that heats up/be incubated, need to control the gaseous tension in interlayer 4, i.e. gas concentration.Therefore,, as shown in Fig. 5～Fig. 7, as preferred implementation, interlayer 4 is provided with import 6 and outlet 7, passing into and exporting for gas.In this embodiment, described interlayer 4 comprises two secondary interlayers 12, and each secondary interlayer 12 has import 6 and outlet 7, and secondary interlayer 12 and import 6, there is no splicing seams between exporting 7, is seamless integral structure.Described import 6 and outlet 7 allow gas to come in and go out.
In this embodiment, import 6 and outlet 7 are oppositely arranged on the two ends of secondary interlayer 12, so that gas flow.As preferred embodiment, described import 6 is arranged on the top of secondary interlayer 12, and described outlet 7 is arranged on the bottom of secondary interlayer 12.As most preferred embodiment, import 6 and outlet 7 are oppositely arranged on the diagonal lines two-end-point place of secondary interlayer 12, to strengthen the convection effect between the freezing air in secondary interlayer 12 and the hot gas in heating chamber, thereby obtain better cooling-down effect.
As optional embodiment, in described import 6 and outlet 7 places, one blower fan (not indicating in figure) is respectively set, to accelerate gas flow, better control interlayer 4 internal gas pressures.Further, be also provided with a vacuum generator (not indicating in accompanying drawing) at described outlet 7 places, in order to the gas of interlayer 4 inside is extracted out, to reduce gaseous tension.As optional embodiment, described vacuum generator is vacuum pump.
In this embodiment, in the time of needs fast cooling, recovering interlayer 4 internal pressures is normal pressure, and utilizes blower fan to adjust air-flow inner formation of interlayer 4, realizes fast cooling by convective heat exchange.Heating up and the constant temperature stage, close import 6, by the pressure in interlayer 4 being pumped into negative pressure with outlet 7 vacuum generators that are connected, it is the state of relative vacuum, the thermal resistance effect of vacuum can reduce the heat dissipation of thermal treatment unit 200, improve the heat-up rate of thermal treatment unit 200, simultaneously in the constant temperature stage, also can improve by the combined action of vacuum generator and blower fan the precision of thermal treatment unit 200 temperature controls.
In this embodiment, thermal treatment unit 200 also comprises end insulation block 8 and set collar 9, is all arranged on top and the bottom of described thermal treatment unit 200.Further, be also provided with top insulation cover 13 at the top of described thermal treatment unit 200, for preventing thermal treatment unit 200 top heat loss.Described shell 10 is around described the second thermal insulation layer 3, and described shell 10 is connected with described set collar 9, so that 200 one-tenth of described thermal treatment units are as a whole.As optional embodiment, described set collar 9 and shell 10 are metal.
The thermal treatment unit that this embodiment provides, by the interlayer of an inner hollow is set in thermal treatment unit, and heating and cooling are realized and controlled to the gaseous tension (being gas concentration) of controlling interlayer inside and insulation is processed.When thermal treatment unit intensification and to holding stage, controlling interlayer internal gas pressure is negative pressure, reduces the thermosteresis that heat is transmitted and thermal convection brings, and makes thermal treatment unit internal temperature arrive fast technological temperature, when arrival technological temperature is incubated, can reduce the energy consumption that maintains technological temperature; In the time that thermal treatment unit is lowered the temperature, controlling interlayer internal pressure is non-negative pressure state, and makes gas take away heat in flow state, reaches the effect of thermal treatment unit rapid temperature rise and drop, the object of energy consumption thereby realization reduction thermal treatment unit heats up/is incubated.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (15)
1. a thermal treatment unit, comprises zone of heating and thermal insulation layer, it is characterized in that, also comprises interlayer, and described zone of heating is positioned at described interlayer inner side, and described interlayer forms heating chamber around sample to be heated; The arranged outside of described zone of heating has at least one deck thermal insulation layer; The inner smooth surface of described interlayer and inner hollow, described interlayer be provided with the import that passes into and export and the outlet for gas, to allow ambient atmos to enter the inner hollow position of described interlayer; By controlling the airshed of described import and outlet, control the switching of gaseous tension between negative pressure and non-negative pressure state in described interlayer, to coordinate the processing of described heating chamber being carried out to rapid temperature rise and drop and insulation; Wherein, when thermal treatment unit heats up and to holding stage, controlling interlayer internal gas pressure is negative pressure; In the time that thermal treatment unit is lowered the temperature, the pressure of controlling in the inner hollow position of described interlayer is non-negative pressure state, and makes gas take away heat in flow state.
2. thermal treatment unit according to claim 1, is characterized in that, described thermal insulation layer comprises the first thermal insulation layer, is arranged between described zone of heating and described interlayer.
3. thermal treatment unit according to claim 2, is characterized in that, described thermal insulation layer comprises the second thermal insulation layer, is arranged on described interlayer outside.
4. thermal treatment unit according to claim 1, is characterized in that, is coated with reflectance coating at described interlayer outer surface.
5. thermal treatment unit according to claim 1, is characterized in that, described interlayer comprises 2 or 2 above secondary interlayers, and described secondary interlayer is spliced to form the heating chamber around sample to be heated.
6. thermal treatment unit according to claim 5, is characterized in that, described zone of heating lead-in wire is arranged between adjacent described secondary interlayer, between adjacent twice level interlayers, has space, and described space allows lead-in wire and the thermopair of zone of heating to pass through.
7. thermal treatment unit according to claim 5, is characterized in that, described secondary interlayer has respectively import and outlet, passes into and extracts out for gas.
8. thermal treatment unit according to claim 7, is characterized in that, between described secondary interlayer and import, outlet, without splicing seams, is seamless integral structure.
9. thermal treatment unit according to claim 7, is characterized in that, described import is arranged at described secondary interlayer top, and described outlet is arranged at described secondary interlayer bottom.
10. thermal treatment unit according to claim 9, is characterized in that, described import and outlet are relatively arranged on the diagonal lines two-end-point place of described secondary interlayer.
11. thermal treatment units according to claim 7, is characterized in that, described outlet is connected with vacuum generator.
12. thermal treatment units according to claim 7, is characterized in that, described import and exit are provided with blower fan, adjust air-flow in order to form in described interlayer.
13. thermal treatment units according to claim 5, is characterized in that, in described secondary interlayer, are provided with supporting pad, and described supporting pad is arranged at described secondary interlayer inner hollow position.
14. thermal treatment units according to claim 3, it is characterized in that, also comprise end insulation block, set collar and shell, described end insulation block, set collar are all arranged at top and the bottom of described thermal treatment unit, described shell is around described the second thermal insulation layer, and is connected with described set collar.
15. thermal treatment units according to claim 14, is characterized in that, also comprise top insulation cover, and described top insulation cover is arranged at the top of described thermal treatment unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420074781.4U CN203855685U (en) | 2014-02-20 | 2014-02-20 | Heat treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420074781.4U CN203855685U (en) | 2014-02-20 | 2014-02-20 | Heat treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203855685U true CN203855685U (en) | 2014-10-01 |
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ID=51605552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420074781.4U Expired - Lifetime CN203855685U (en) | 2014-02-20 | 2014-02-20 | Heat treatment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203855685U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107740191A (en) * | 2017-12-01 | 2018-02-27 | 浙江海洋大学 | A kind of annealing device |
-
2014
- 2014-02-20 CN CN201420074781.4U patent/CN203855685U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107740191A (en) * | 2017-12-01 | 2018-02-27 | 浙江海洋大学 | A kind of annealing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180105 Address after: 100176 Beijing economic and Technological Development Zone, Beijing, Wenchang Road, No. 8, No. Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141001 |