CN106048512B - 一种离子渗氮及电弧离子镀制备dlc一体化复合方法 - Google Patents

一种离子渗氮及电弧离子镀制备dlc一体化复合方法 Download PDF

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CN106048512B
CN106048512B CN201610521966.9A CN201610521966A CN106048512B CN 106048512 B CN106048512 B CN 106048512B CN 201610521966 A CN201610521966 A CN 201610521966A CN 106048512 B CN106048512 B CN 106048512B
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卢国英
石昌仑
石武昌
兰睿
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Changzhou Quark Coating Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605—Carbon
    • C23C14/0611—Diamond
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding

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Abstract

本发明公开了一种离子渗氮及电弧离子镀制备DLC一体化复合方法。包括以下步骤：步骤S100：用多弧离子镀设备进行离子增强渗氮，渗氮时，气体压力选择0.5‑5pa，氮气流量20‑200sccm，灯丝电流为40‑60A，灯丝电源电压为20V‑100V,灯丝电源电流为10A‑50A，工件偏压为300‑1000V，根据渗氮层深度的需求，渗氮时间0.5‑5小时，渗氮深度为10‑50微米，显微硬度约为hv1000；步骤S200：渗氮结束后，直接在工件涂层，涂层时弧流30‑80A，工件偏压为0‑100V，根据厚度需求，涂层时间为20min‑100min,涂层厚度为0.5‑3微米。

Description

一种离子渗氮及电弧离子镀制备DLC一体化复合方法
技术领域
本发明涉及镀膜技术领域，尤其涉及一种离子渗氮及电弧离子镀制备DLC一体化复合方法。
背景技术
类金刚石薄膜(DLC)是一种介于石墨和金刚石之间的物质，兼具力金刚石和石墨的优良特性，其中金刚石的碳碳是以sp3键形式结合，而石墨的碳碳是以sp2键形式结合。sp3键含量越高，硬度越硬，越有力切削加工，但sp3含量越高，脆性越大，涂层结合力越差。电弧离子镀DLC涂层可以获得sp3含量很高的DLC，但结合力差是目前面临的主要问题。
发明内容
为了克服现有技术的结合力差的问题，本发明提供了一种离子渗氮及电弧离子镀制备DLC一体化复合方法。
为了达到上述目的，本发明提供的一种离子渗氮及电弧离子镀制备DLC一体化复合方法，包括以下步骤：步骤S100：用多弧离子镀设备进行离子增强渗氮，渗氮时，气体压力选择0.5-5Pa，氮气流量20-200sccm，灯丝电流为40-60A，灯丝电源电压为20V-100V,灯丝电源电流为10A-50A，工件偏压为300-1000V，根据渗氮层深度的需求，渗氮时间0.5-5小时，渗氮深度为10-50微米，显微硬度约为hv1000；步骤S200：渗氮结束后，直接在工件涂层，涂层时弧流30-80A，工件偏压为0-100V，根据厚度需求，涂层时间为20min-100min,涂层厚度为0.5-3微米，使处理过的工件硬度为hv4000，结合力为1级。
优选的，所述步骤100：用多弧离子镀设备进行离子增强渗氮，渗氮时，气体压力选择0.5、1或3Pa，氮气流量50sccm，氢气流量50sccm，灯丝电流为50A，灯丝电源电压为60V,灯丝电源电流为30A，工件偏压为400V，根据渗氮层深度的需求，渗氮时间4小时，渗氮深度为40微米，显微硬度为hv1000。
优选的，步骤S200：渗氮结束后，直接在工件涂层，涂层时弧流50A，工件偏压为20V，根据厚度需求，涂层时间为50min,涂层厚度为1微米，使处理过的工件硬度为hv4000，结合力为1级。
有益效果：采用此工艺后，涂层结合力有极大地提高；一体化处理方式可以节省整个工艺的流程时间。
附图说明
图1是涂层结合力标准(洛氏硬度计150Kg压力)。
图2是本实施例的涂层结合力检测结果。
具体实施方式
为使本发明解决的技术问题、采用的技术方案和达到的技术效果更加清楚，下面结合实施例对本发明作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释本发明，而非对本发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本发明相关的部分而非全部内容。
本实施例的离子渗氮及电弧离子镀制备DLC一体化复合方法，步骤100：用多弧离子镀设备进行离子增强渗氮，渗氮时，气体压力选择0.5-5Pa，氮气流量20-200sccm，氢气流量20-200sccm，灯丝电流为40-60A，灯丝电源电压为20V-100V,灯丝电源电流为10A-50A，工件偏压为300-1000V，根据渗氮层深度的需求，渗氮时间0.5-5小时，渗氮深度为10-50微米，显微硬度约为hv1000；气体压力过高，灯丝电源电流波动会比较大，过低，又不容易激发出电子，同样氮气流量和氢气流量合适的配比和流量，更有利于渗氮的效果；而灯丝电源电压值和电流值选择60V、30A，能够激发出合适的电子量；我们认为气体压力2Pa，氮气流量为50sccm，氢气流量为50sccm,灯丝电流为50A，灯丝电源电压为60V，灯丝电源电流为30A，工件偏压为400V，渗氮时间4个小时，40微米的厚度，更有利于获得支撑DLC涂层的渗氮层。
步骤S200：渗氮结束后，直接在工件涂层，涂层时弧流30-80A，工件偏压为0-100V，根据厚度需求，涂层时间为20min-100min,涂层厚度为0.5-3微米，使处理过的工件硬度为hv4000，结合力为1级。参数的选择，最终的目的是选择合适的参数来保证结合力的情况下尽可能地提高涂层的厚度，从而延长工件的使用寿命。如果弧流过小，离子能量不够，而弧流过大，涂层表面的粗糙度会有所增加；偏压过低，离子能量不够，结合力较差，但偏压过高，涂层应力会随之增加，结合力也会下降；涂层时间决定涂层厚度，厚度过低，耐磨性不够，厚度过高，应力增大，结合力下降。所以我们认为，较为合理的参数选择应该为：其中弧流为50A，工件偏压为20V，时间为50min，厚度为1微米。
图1是涂层结合力标准，从左至右依次为：良好、较好、较差、很差。图2为本实施例的涂层结合力检测结果，可以看到为良好。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (3)

1.一种离子渗氮及电弧离子镀制备DLC一体化复合方法，包括以下步骤：
步骤S100：用多弧离子镀设备进行离子增强渗氮，渗氮时，气体压力选择0.5-5Pa，氮气流量20-200sccm，氢气流量20-200sccm，灯丝电流为40-60A，灯丝电源电压为20V-100V,灯丝电源电流为10A-50A，工件偏压为300-1000V，根据渗氮层深度的需求，渗氮时间0.5-5小时，渗氮深度为10-50微米，显微硬度为hv1000；
步骤S200：渗氮结束后，直接在工件涂层，涂层时弧流30-80A，工件偏压为0-100V，根据厚度需求，涂层时间为20min-100min,涂层厚度为0.5-3微米，使处理过的工件硬度为hv4000，结合力为1级。
2.根据权利要求1所述的一种离子渗氮及电弧离子镀制备DLC一体化复合方法，其特征在于，所述步骤S100：用多弧离子镀设备进行离子增强渗氮，渗氮时，气体压力选择0.5、1或3Pa，氮气流量50sccm，氢气流量50sccm，灯丝电流为50A，灯丝电源电压为60V,灯丝电源电流为30A，工件偏压为400V，根据渗氮层深度的需求，渗氮时间4小时，渗氮深度为40微米，显微硬度为hv1000。
3.根据权利要求1所述的一种离子渗氮及电弧离子镀制备DLC一体化复合方法，其特征在于，步骤S200：渗氮结束后，直接在工件涂层，涂层时弧流50A，工件偏压为20V，根据厚度需求，涂层时间为50min,涂层厚度为1微米，使处理过的工件硬度为hv4000，结合力为1级。
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