JP2012504192A - 合金被覆装置及びメタライディング方法 - Google Patents
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
- F01D5/00—Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
- F01D5/12—Blades
- F01D5/28—Selecting particular materials; Particular measures relating thereto; Measures against erosion or corrosion
- F01D5/288—Protective coatings for blades
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2203/00—Non-metallic inorganic materials
- F05C2203/08—Ceramics; Oxides
- F05C2203/0804—Non-oxide ceramics
- F05C2203/083—Nitrides
- F05C2203/0839—Nitrides of boron
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2230/00—Manufacture
- F05D2230/30—Manufacture with deposition of material
- F05D2230/31—Layer deposition
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2300/00—Materials; Properties thereof
- F05D2300/20—Oxide or non-oxide ceramics
- F05D2300/22—Non-oxide ceramics
- F05D2300/222—Silicon
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2300/00—Materials; Properties thereof
- F05D2300/60—Properties or characteristics given to material by treatment or manufacturing
- F05D2300/611—Coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12986—Adjacent functionally defined components
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Turbine Rotor Nozzle Sealing (AREA)
Abstract
【選択図】図1
Description
12 ハウジング
14 酸素が実質的にない雰囲気
16 容器
18 電解浴
20 陰極又は導電性基板
22 被覆すべき表面
24 電気回路
26 陽極又は導電性要素
28 浸漬された表面
30 可変電源
Claims (24)
- 酸素が実質的にない雰囲気と、
前記雰囲気内の電解浴と、
前記浴内に浸漬された表面を有する導電性基板と、
各要素は導電性であり、各々互いに別個の組成を有すると共に、各々前記浴内に浸漬された表面を有する複数の要素と、
前記基板及び前記複数の各要素と共に作動可能な電源であって、電流密度を前記各要素及び前記基板に供給して、印加される前記電流密度に比例して前記浴内の前記複数の各要素からの材料により前記基板が被覆される、該電源と、
を備える装置。 - 前記複数の要素のうちの少なくとも1つは、原子、金属、非金属材料、及び合金のうちの少なくとも1つを含む、請求項1に記載の装置。
- 前記要素は、ケイ素(Si)、ニオブ(Nb)、ホウ素(B)、及びタンタル(Ta)よりなる原子群から選択される、請求項1に記載の装置。
- 前記複数の要素は、ホウ素である第1の要素と、ニオブである第2の要素とを含む2つの要素を有し、前記第1及び第2の要素に印加される前記電流密度は、ホウ化ニオブの合金被覆を前記基板に付与する、請求項1に記載の装置。
- 前記基板は鋼を含む、請求項1に記載の装置。
- 前記電解浴はフッ化物塩を含む、請求項1に記載の装置。
- 前記フッ化物塩は、リチウム、ナトリウム、カリウム、ルビジウム、及びセシウムのフッ化物よりなる群から選択される、請求項6に記載の装置。
- 前記雰囲気は、不活性雰囲気及び真空のうちの少なくとも一方を含む、請求項1に記載の装置。
- 前記基板及び前記複数の要素と共に作動可能な前記電源は、電気回路を形成し、前記複数の要素は陽極を構成し、前記基板は陰極を構成する、請求項1に記載の装置。
- 基板に被覆を塗布する装置であって、
酸素が実質的にない雰囲気を内部に有するハウジングと、
前記ハウジング内に担持される電解浴と、
前記浴内に浸漬された表面を有する導電性基板と、
各要素は互いに別個の組成を有すると共に、各々前記浴内に浸漬された表面を有する複数の導電性要素と、
陽極を形成する前記複数の要素を有する電気回路と、該電気回路内に陰極を形成する前記基板とを形成するために前記基板及び前記複数の各要素に接続された電源であって、該電源は、予め選択された電流を前記複数の各要素に別個に供給して、前記各要素及び前記基板に電流密度を生じさせるために作動可能であり、メタライディング反応により、前記複数の各要素に印加される電流密度に比例して前記浴内の前記複数の要素から前記基板上に拡散した材料で前記基板が被覆される、電源と、
を備える前記装置。 - 前記電源は、前記複数の要素と共に作動可能であり、予め選択された電流を、前記陽極を形成する前記各要素に印加する複数の電源を含む、請求項10に記載の装置。
- 前記電解浴と共に作動可能であり、前記電解浴を加熱するためのヒーターを更に備える、請求項10に記載の装置。
- 前記陽極を形成する前記複数の要素のうちの少なくとも1つは、原子、金属、非金属材料、及び合金のうちの少なくとも1つを含む、請求項10に記載の装置。
- 前記基板は、金属タービンブレード及びシングルブレードのうちの少なくとも一方を含み、前記陽極を形成する前記複数の要素は、ニオブを含む第1の陽極と、ホウ素を含む第2の陽極とを含む、請求項10に記載の装置。
- 前記電解浴はフッ化物塩を含み、前記フッ化物塩は、リチウム、ナトリウム、カリウム、ルビジウム、及びセシウムのフッ化物よりなる群から選択される、請求項10に記載の装置。
- 前記雰囲気は不活性雰囲気及び真空のうちの少なくとも一方を含む、請求項10に記載の装置。
- 基板に被覆を塗布する方法であって、
酸素が実質的にない雰囲気及び前記雰囲気内の電解浴を供給する工程、
導電性基板を前記浴内に浸漬する工程、
各要素は互いに別個の組成を有する複数の導電性要素を前記浴内に浸漬する工程、
電流密度を前記複数の各要素に印加する工程、及び
前記複数の各要素に印加される電流密度に比例して、前記浴内で前記複数の各要素からの材料で前記基板を被覆するのに十分な電流密度を印加する工程、
を含む前記方法。 - 前記複数の各要素を、原子、金属、非金属材料、及び合金のうちの少なくとも1つから選択する工程を更に含む、請求項17に記載の方法。
- 前記電流密度を印加する工程は、前記電解浴内に前記複数の各要素を陽極として形成し、前記基板を陰極として形成する工程を含み、前記電解浴は溶融フッ化物塩を含む、請求項17に記載の方法。
- 前記陰極は金属タービン式ブレード及びシングルブレードのうちの少なくとも一方を含み、前記陽極を形成する前記複数の導電性要素は、ニオブを含む第1の陽極と、ホウ素を含む第2の陽極とを含み、こうして前記方法は、前記金属ブレードにニオブとホウ素との合金を被覆する、請求項19に記載の方法。
- 前記複数の要素は、ホウ素である第1の要素と、ニオブである第2の要素とを含む2つの要素を有し、前記電流密度を印加する工程は、前記第1及び第2の各要素に電流密度を印加して、前記基板にホウ化ニオブの合金を被覆する工程を含む、請求項19に記載の方法。
- ホウ素である前記第1の要素に印加される電流密度は、ニオブである前記第2の要素に印加される電流密度に略等しく、これにより、前記基板にNbBである合金被覆を形成する、請求項21に記載の方法。
- ホウ素である前記第1の要素に印加される電流密度は、ニオブである前記第2の要素に印加される電流密度の2倍であり、これにより、前記基板にNbB2である合金被覆を形成する、請求項21に記載の方法。
- 前記電流密度を印加する工程中に、前記電解浴を加熱すると共に前記電解浴の温度を制御する工程を更に含む、請求項17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10095008P | 2008-09-29 | 2008-09-29 | |
US61/100,950 | 2008-09-29 | ||
PCT/US2009/058154 WO2010036758A2 (en) | 2008-09-29 | 2009-09-24 | Alloy coating apparatus and metalliding method |
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JP2012504192A true JP2012504192A (ja) | 2012-02-16 |
JP2012504192A5 JP2012504192A5 (ja) | 2012-12-06 |
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JP2011529206A Pending JP2012504192A (ja) | 2008-09-29 | 2009-09-24 | 合金被覆装置及びメタライディング方法 |
Country Status (9)
Country | Link |
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US (2) | US20110132769A1 (ja) |
EP (1) | EP2329063A4 (ja) |
JP (1) | JP2012504192A (ja) |
KR (1) | KR101314380B1 (ja) |
CN (1) | CN102131961B (ja) |
BR (1) | BRPI0919209A8 (ja) |
CA (1) | CA2733946A1 (ja) |
RU (1) | RU2463390C1 (ja) |
WO (1) | WO2010036758A2 (ja) |
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CN103088376B (zh) * | 2012-12-25 | 2016-02-10 | 江苏省宜兴电子器件总厂 | 一种陶瓷封装外壳镍钴电镀工艺 |
US9765441B2 (en) * | 2013-09-05 | 2017-09-19 | Baker Hughes Incorporated | Methods of forming borided down-hole tools |
US9790608B2 (en) * | 2013-09-05 | 2017-10-17 | Baker Hughes Incorporated | Methods of forming borided down hole tools |
EP3143286B1 (en) * | 2014-05-15 | 2018-04-25 | Nuovo Pignone S.r.l. | Method for preventing the corrosion of an impeller-shaft assembly of a turbomachine |
CN104313657A (zh) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Hdi印制线路板通孔的电沉积装置 |
CN104746114B (zh) * | 2015-04-20 | 2017-10-20 | 华北理工大学 | 一种Fe‑Mo复合材料及其制备方法 |
CN105350062B (zh) * | 2015-12-07 | 2018-01-19 | 依力柏电能有限公司 | 一种电镀装置 |
US10106902B1 (en) * | 2016-03-22 | 2018-10-23 | Plasma Processes, Llc | Zirconium coating of a substrate |
CN114808084A (zh) * | 2021-01-29 | 2022-07-29 | 泰科电子(上海)有限公司 | 电镀装置和电镀系统 |
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- 2009-09-24 KR KR1020117007271A patent/KR101314380B1/ko not_active IP Right Cessation
- 2009-09-24 RU RU2011104145/02A patent/RU2463390C1/ru not_active IP Right Cessation
- 2009-09-24 WO PCT/US2009/058154 patent/WO2010036758A2/en active Application Filing
- 2009-09-24 BR BRPI0919209A patent/BRPI0919209A8/pt not_active IP Right Cessation
- 2009-09-24 CN CN2009801329206A patent/CN102131961B/zh not_active Expired - Fee Related
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EP2329063A2 (en) | 2011-06-08 |
US20110132769A1 (en) | 2011-06-09 |
KR20110049895A (ko) | 2011-05-12 |
RU2463390C1 (ru) | 2012-10-10 |
WO2010036758A2 (en) | 2010-04-01 |
RU2011104145A (ru) | 2012-08-20 |
CN102131961A (zh) | 2011-07-20 |
BRPI0919209A2 (pt) | 2015-12-08 |
US20110280732A1 (en) | 2011-11-17 |
CN102131961B (zh) | 2012-12-19 |
WO2010036758A3 (en) | 2010-06-03 |
BRPI0919209A8 (pt) | 2016-08-23 |
CA2733946A1 (en) | 2010-04-01 |
KR101314380B1 (ko) | 2013-10-04 |
EP2329063A4 (en) | 2012-03-21 |
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