CN106030789B - 嵌入式多端子电容器 - Google Patents

嵌入式多端子电容器 Download PDF

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Publication number
CN106030789B
CN106030789B CN201580008869.3A CN201580008869A CN106030789B CN 106030789 B CN106030789 B CN 106030789B CN 201580008869 A CN201580008869 A CN 201580008869A CN 106030789 B CN106030789 B CN 106030789B
Authority
CN
China
Prior art keywords
capacitor
terminal
ground
metal layer
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580008869.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN106030789A (zh
Inventor
H·B·蔚
D·W·金
K-P·黄
Y·K·宋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN106030789A publication Critical patent/CN106030789A/zh
Application granted granted Critical
Publication of CN106030789B publication Critical patent/CN106030789B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/01—Details
    • H03K3/013—Modifications of generator to prevent operation by noise or interference
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
    • G05F3/02—Regulating voltage or current
    • G05F3/08—Regulating voltage or current wherein the variable is DC
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN201580008869.3A 2014-02-18 2015-02-06 嵌入式多端子电容器 Expired - Fee Related CN106030789B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461941275P 2014-02-18 2014-02-18
US61/941,275 2014-02-18
US14/249,189 US9628052B2 (en) 2014-02-18 2014-04-09 Embedded multi-terminal capacitor
US14/249,189 2014-04-09
PCT/US2015/014885 WO2015126639A1 (en) 2014-02-18 2015-02-06 Embedded multi-terminal capacitor

Publications (2)

Publication Number Publication Date
CN106030789A CN106030789A (zh) 2016-10-12
CN106030789B true CN106030789B (zh) 2018-11-20

Family

ID=53799036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580008869.3A Expired - Fee Related CN106030789B (zh) 2014-02-18 2015-02-06 嵌入式多端子电容器

Country Status (5)

Country Link
US (1) US9628052B2 (enExample)
EP (1) EP3108504A1 (enExample)
JP (1) JP6285560B2 (enExample)
CN (1) CN106030789B (enExample)
WO (1) WO2015126639A1 (enExample)

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US9136236B2 (en) 2012-09-28 2015-09-15 Intel Corporation Localized high density substrate routing
US9190380B2 (en) 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
US9159690B2 (en) 2013-09-25 2015-10-13 Intel Corporation Tall solders for through-mold interconnect
US9349703B2 (en) 2013-09-25 2016-05-24 Intel Corporation Method for making high density substrate interconnect using inkjet printing
CN106898594A (zh) * 2017-02-28 2017-06-27 美的智慧家居科技有限公司 用于无线保真系统级封装芯片的基板及其形成方法
US10658941B2 (en) * 2018-04-17 2020-05-19 General Electric Company Compact design of multilevel power converter systems
CN110941156B (zh) * 2018-09-25 2023-08-25 富士胶片商业创新有限公司 图像形成装置及基板
US11538793B2 (en) * 2020-10-27 2022-12-27 Mediatek Singapore Pte. Ltd. Semiconductor structure
US12476194B2 (en) * 2021-01-06 2025-11-18 Mediatek Singapore Pte. Ltd. Semiconductor structure
US12494410B2 (en) * 2021-12-14 2025-12-09 Intel Corporation Integrated circuit device comprising tunable transmission line using buried power rail technology
TWI831569B (zh) * 2023-01-12 2024-02-01 瑞昱半導體股份有限公司 電源規劃方法、晶片裝置以及適用於電源規劃方法的非暫態電腦可讀取媒體

Citations (2)

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CN1610971A (zh) * 2001-06-26 2005-04-27 英特尔公司 具有垂直连接电容器的电子装置及其制造方法
CN101232777A (zh) * 1999-09-02 2008-07-30 伊比登株式会社 印刷布线板及其制造方法

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CN101232776B (zh) 1999-09-02 2011-04-20 揖斐电株式会社 印刷布线板
US6611419B1 (en) * 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
US7183658B2 (en) * 2001-09-05 2007-02-27 Intel Corporation Low cost microelectronic circuit package
US7405364B2 (en) 2002-12-30 2008-07-29 Intel Corporation Decoupled signal-power substrate architecture
KR100691146B1 (ko) 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
TWI414218B (zh) 2005-02-09 2013-11-01 日本特殊陶業股份有限公司 配線基板及配線基板內建用之電容器
JP2006237520A (ja) 2005-02-28 2006-09-07 Nec Tokin Corp 薄型多端子コンデンサおよびその製造方法
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CN101232777A (zh) * 1999-09-02 2008-07-30 伊比登株式会社 印刷布线板及其制造方法
CN1610971A (zh) * 2001-06-26 2005-04-27 英特尔公司 具有垂直连接电容器的电子装置及其制造方法

Also Published As

Publication number Publication date
EP3108504A1 (en) 2016-12-28
CN106030789A (zh) 2016-10-12
US9628052B2 (en) 2017-04-18
WO2015126639A1 (en) 2015-08-27
US20150236681A1 (en) 2015-08-20
JP6285560B2 (ja) 2018-02-28
JP2017508281A (ja) 2017-03-23

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