CN106024680B - 端口门定位装置及相关的方法 - Google Patents
端口门定位装置及相关的方法 Download PDFInfo
- Publication number
- CN106024680B CN106024680B CN201610416629.3A CN201610416629A CN106024680B CN 106024680 B CN106024680 B CN 106024680B CN 201610416629 A CN201610416629 A CN 201610416629A CN 106024680 B CN106024680 B CN 106024680B
- Authority
- CN
- China
- Prior art keywords
- port door
- door
- framework
- closing organ
- movable closing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title description 25
- 230000033001 locomotion Effects 0.000 claims abstract description 111
- 230000003068 static effect Effects 0.000 claims abstract description 101
- 230000007246 mechanism Effects 0.000 claims abstract description 91
- 210000000056 organ Anatomy 0.000 claims abstract description 91
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 230000000694 effects Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 description 28
- 230000000295 complement effect Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 241000272470 Circus Species 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000037023 motor activity Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B7/00—Special arrangements or measures in connection with doors or windows
- E06B7/28—Other arrangements on doors or windows, e.g. door-plates, windows adapted to carry plants, hooks for window cleaners
- E06B7/32—Serving doors; Passing-through doors ; Pet-doors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
- E06B3/50—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
- E06B3/50—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement
- E06B3/5009—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement where the sliding and rotating movements are necessarily performed simultaneously
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B5/00—Doors, windows, or like closures for special purposes; Border constructions therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Vessels And Lids Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/828,236 | 2010-06-30 | ||
| US12/828,236 US8870516B2 (en) | 2010-06-30 | 2010-06-30 | Port door positioning apparatus and associated methods |
| CN201180041909.6A CN103155132B (zh) | 2010-06-30 | 2011-06-29 | 端口门定位装置及相关的方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180041909.6A Division CN103155132B (zh) | 2010-06-30 | 2011-06-29 | 端口门定位装置及相关的方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106024680A CN106024680A (zh) | 2016-10-12 |
| CN106024680B true CN106024680B (zh) | 2019-02-19 |
Family
ID=45398872
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610416629.3A Active CN106024680B (zh) | 2010-06-30 | 2011-06-29 | 端口门定位装置及相关的方法 |
| CN201180041909.6A Active CN103155132B (zh) | 2010-06-30 | 2011-06-29 | 端口门定位装置及相关的方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180041909.6A Active CN103155132B (zh) | 2010-06-30 | 2011-06-29 | 端口门定位装置及相关的方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8870516B2 (enExample) |
| JP (2) | JP5732132B2 (enExample) |
| KR (1) | KR101545067B1 (enExample) |
| CN (2) | CN106024680B (enExample) |
| WO (1) | WO2012003240A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2912315B1 (ja) | 1998-01-12 | 1999-06-28 | 鹿児島日本電気株式会社 | 蛍光表示管の排気装置 |
| US6918731B2 (en) | 2001-07-02 | 2005-07-19 | Brooks Automation, Incorporated | Fast swap dual substrate transport for load lock |
| JP5736686B2 (ja) | 2010-08-07 | 2015-06-17 | シンフォニアテクノロジー株式会社 | ロードポート |
| JP5729148B2 (ja) * | 2011-06-07 | 2015-06-03 | 東京エレクトロン株式会社 | 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置 |
| WO2013005363A1 (ja) | 2011-07-06 | 2013-01-10 | 平田機工株式会社 | 容器開閉装置 |
| JP5993252B2 (ja) * | 2012-09-06 | 2016-09-14 | 東京エレクトロン株式会社 | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
| CN103214474B (zh) * | 2013-05-02 | 2016-04-27 | 南开大学 | 一类含4,5-二氢噻唑醇酸酯的5-甲基-1,2,3-噻二唑衍生物及其制备方法和用途 |
| US20150345810A1 (en) * | 2014-05-30 | 2015-12-03 | Denso International America, Inc. | Dual layer door |
| DK178586B1 (en) * | 2015-02-02 | 2016-07-25 | Vestas Wind Sys As | Wind turbine access panel and method for securing same |
| KR101695948B1 (ko) * | 2015-06-26 | 2017-01-13 | 주식회사 테라세미콘 | 기판처리 시스템 |
| USD811627S1 (en) | 2016-06-16 | 2018-02-27 | Curtis Alan Roys | LED lamp |
| JP6414535B2 (ja) * | 2015-10-28 | 2018-10-31 | 株式会社ダイフク | 収納容器 |
| US10622236B2 (en) * | 2017-08-30 | 2020-04-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for handling wafer carrier doors |
| JP6697428B2 (ja) * | 2017-11-01 | 2020-05-20 | ファナック株式会社 | ファンユニットを備えるモータ駆動装置 |
| KR101831202B1 (ko) | 2017-12-20 | 2018-02-22 | 주식회사 싸이맥스 | 로드포트의 포트도어 구동장치 |
| CN108005549B (zh) * | 2018-01-12 | 2024-03-26 | 珠海市优氧健康产业有限公司 | 一种健康舱舱门密封结构 |
| CN109615781B (zh) * | 2018-12-17 | 2023-09-19 | 航天信息股份有限公司 | 自动出货装置 |
| TW202312331A (zh) * | 2021-07-06 | 2023-03-16 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 卡匣蓋開啟裝置 |
| US12077938B2 (en) * | 2021-10-12 | 2024-09-03 | Caterpillar Inc. | Secondary control system and method for mounting with service orientation |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109863A (ja) * | 1991-10-17 | 1993-04-30 | Shinko Electric Co Ltd | 機械式インターフエース装置 |
| US5302120A (en) * | 1992-06-15 | 1994-04-12 | Semitool, Inc. | Door assembly for semiconductor processor |
| US6106213A (en) * | 1998-02-27 | 2000-08-22 | Pri Automation, Inc. | Automated door assembly for use in semiconductor wafer manufacturing |
| CN1543663A (zh) * | 2001-07-13 | 2004-11-03 | 阿赛斯特技术公司 | 包含智能通道门的smif装载通道接口 |
| CN1743254A (zh) * | 2004-08-30 | 2006-03-08 | 阿尔卡特公司 | 在微环境晶片传送盒和设备零件之间的真空接口 |
| TWI278057B (en) * | 2004-10-26 | 2007-04-01 | Tdk Corp | Enclosed container lid opening/closing system and enclosed container lid opening/closing method |
| TW200943463A (en) * | 2007-10-03 | 2009-10-16 | Tokyo Electron Ltd | Inlet port mechanism for introducing object and treatment system |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US659699A (en) * | 1900-01-29 | 1900-10-16 | Harold Rowntree | Door mechanism. |
| US4367915A (en) * | 1978-06-29 | 1983-01-11 | Georges Michael P | Automatic microscope slide |
| DE59611078D1 (de) * | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
| US6082949A (en) * | 1996-10-11 | 2000-07-04 | Asyst Technologies, Inc. | Load port opener |
| US6109395A (en) * | 1997-07-14 | 2000-08-29 | Vertical Mobility, Llc | Convertible lift mechanism having a scissor lift linkage |
| JPH11145269A (ja) | 1997-11-11 | 1999-05-28 | Starlite Co Ltd | 密閉式基板用カセット及びそれを用いたデバイスの製造方法 |
| US6178361B1 (en) * | 1998-11-20 | 2001-01-23 | Karl Suss America, Inc. | Automatic modular wafer substrate handling device |
| WO2000051921A1 (en) * | 1999-03-05 | 2000-09-08 | Pri Automation, Inc. | Material handling and transport system and process |
| TW484750U (en) * | 2000-09-08 | 2002-04-21 | Ind Tech Res Inst | Opening/closing device for front-opened type wafer box |
| US6883274B2 (en) * | 2001-11-09 | 2005-04-26 | Knaack Manufacturing Company | Device and method for opening a door |
| KR100729699B1 (ko) * | 2003-05-15 | 2007-06-19 | 티디케이가부시기가이샤 | 클린 박스 개폐 장치를 구비하는 클린 장치 |
| KR100589702B1 (ko) | 2004-08-05 | 2006-06-19 | (주)아이씨디 | 진공챔버용 도어 조립체 |
| JP2009070868A (ja) | 2007-09-11 | 2009-04-02 | Panasonic Corp | 基板収納用容器 |
| JP4624458B2 (ja) * | 2008-11-11 | 2011-02-02 | Ｔｄｋ株式会社 | 密閉容器及び該密閉容器の蓋開閉システム |
| JP4748816B2 (ja) * | 2008-11-28 | 2011-08-17 | Ｔｄｋ株式会社 | 密閉容器の蓋開閉システム |
-
2010
- 2010-06-30 US US12/828,236 patent/US8870516B2/en active Active
-
2011
- 2011-06-29 CN CN201610416629.3A patent/CN106024680B/zh active Active
- 2011-06-29 WO PCT/US2011/042455 patent/WO2012003240A2/en not_active Ceased
- 2011-06-29 KR KR1020137001918A patent/KR101545067B1/ko active Active
- 2011-06-29 CN CN201180041909.6A patent/CN103155132B/zh active Active
- 2011-06-29 JP JP2013518671A patent/JP5732132B2/ja active Active
-
2014
- 2014-10-07 US US14/508,974 patent/US9378995B2/en active Active
-
2015
- 2015-04-10 JP JP2015081055A patent/JP6101302B2/ja active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109863A (ja) * | 1991-10-17 | 1993-04-30 | Shinko Electric Co Ltd | 機械式インターフエース装置 |
| US5302120A (en) * | 1992-06-15 | 1994-04-12 | Semitool, Inc. | Door assembly for semiconductor processor |
| US6106213A (en) * | 1998-02-27 | 2000-08-22 | Pri Automation, Inc. | Automated door assembly for use in semiconductor wafer manufacturing |
| CN1543663A (zh) * | 2001-07-13 | 2004-11-03 | 阿赛斯特技术公司 | 包含智能通道门的smif装载通道接口 |
| CN1743254A (zh) * | 2004-08-30 | 2006-03-08 | 阿尔卡特公司 | 在微环境晶片传送盒和设备零件之间的真空接口 |
| JP2006074033A (ja) * | 2004-08-30 | 2006-03-16 | Alcatel | ミニエンバイロメントポッドと装置との間の真空インタフェース |
| TWI278057B (en) * | 2004-10-26 | 2007-04-01 | Tdk Corp | Enclosed container lid opening/closing system and enclosed container lid opening/closing method |
| TW200943463A (en) * | 2007-10-03 | 2009-10-16 | Tokyo Electron Ltd | Inlet port mechanism for introducing object and treatment system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130054326A (ko) | 2013-05-24 |
| JP2015128197A (ja) | 2015-07-09 |
| CN103155132B (zh) | 2016-08-03 |
| JP5732132B2 (ja) | 2015-06-10 |
| CN103155132A (zh) | 2013-06-12 |
| US20150021230A1 (en) | 2015-01-22 |
| JP2013539203A (ja) | 2013-10-17 |
| US20120000816A1 (en) | 2012-01-05 |
| CN106024680A (zh) | 2016-10-12 |
| US8870516B2 (en) | 2014-10-28 |
| KR101545067B1 (ko) | 2015-08-17 |
| WO2012003240A2 (en) | 2012-01-05 |
| US9378995B2 (en) | 2016-06-28 |
| WO2012003240A3 (en) | 2012-04-12 |
| JP6101302B2 (ja) | 2017-03-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |