CN105940486A - 对准方法、电子部件的连接方法、连接体的制造方法、连接体、各向异性导电膜 - Google Patents

对准方法、电子部件的连接方法、连接体的制造方法、连接体、各向异性导电膜 Download PDF

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Publication number
CN105940486A
CN105940486A CN201580007486.4A CN201580007486A CN105940486A CN 105940486 A CN105940486 A CN 105940486A CN 201580007486 A CN201580007486 A CN 201580007486A CN 105940486 A CN105940486 A CN 105940486A
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China
Prior art keywords
alignment mark
side alignment
electroconductive particle
substrate
transparency carrier
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CN201580007486.4A
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English (en)
Inventor
阿久津恭志
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Dexerials Corp
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Dexerials Corp
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Priority to CN202110438784.6A priority Critical patent/CN113382556A/zh
Publication of CN105940486A publication Critical patent/CN105940486A/zh
Pending legal-status Critical Current

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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H05K2203/166—Alignment or registration; Control of registration

Abstract

将对准标记设在与粘着各向异性导电膜的区域重叠的位置，并且精度良好地进行利用通过照相机进行的摄像图像的对准。在透明基板（12）的表面，经由导电性粘接剂（1）搭载电子部件（18），从透明基板（12）的背面侧对基板侧对准标记（21）及部件侧对准标记（22）进行摄像，由摄像图像调整两对准标记（21、22）的位置，从而对齐电子部件（18）相对于透明基板（12）的搭载位置，在该对准方法中，导电性粘接剂（1）在俯视下有规则地排列有导电性粒子（4），在摄像图像中，沿着两对准标记（21、22）的外侧缘的虚线段，作为线段（S）间断地显出从导电性粒子（4）间所面临的两对准标记（21、22）的外侧缘。

Description

对准方法、电子部件的连接方法、连接体的制造方法、连接体、各向异性导电膜
技术领域
本发明涉及电子部件与电路基板的对准方法，特别涉及经由含有导电性粒子的粘接剂将电子部件连接到电路基板时的电子部件与电路基板的对准方法、电子部件的连接方法、连接体的制造方法、连接体及各向异性导电膜。本申请以在日本于2014年2月7日申请的日本申请号特愿2014－022861为基础主张优先权，通过参照该申请，引用至本申请。
背景技术
一直以来，作为电视机、PC监视器、便携电话、智能手机、便携式游戏机、平板终端、可穿戴终端、或者车载用监视器等的各种显示单元，采用液晶显示装置或有机EL面板。近年来，在这样的显示装置中，出于微细间距化、轻薄型化等的观点，采用将驱动用IC直接安装于显示面板的玻璃基板上的所谓COG(chip on glass，玻璃上覆晶)。
例如采用COG安装方式的液晶显示面板中，如图8（A）（B）所示，在由玻璃基板等构成的透明基板101形成有多个由ITO（氧化铟锡）等构成的透明电极102，在这些透明电极102上连接有液晶驱动用IC103等的电子部件。液晶驱动用IC103在安装面对应于透明电极102形成有多个连接端子104，经由各向异性导电膜105热压接到透明基板101上，从而连接连接端子104与透明电极102。
各向异性导电膜105向粘合剂树脂中混入导电性粒子而制成膜状，在两个导体间通过加热压接而以导电性粒子取得导体间的电导通，以粘合剂树脂保持导体间的机械连接。作为构成各向异性导电膜105的粘接剂，通常，会使用可靠性高的热固化性的粘合剂树脂，但是也可以为光固化性的粘合剂树脂或光热并用型的粘合剂树脂。
经由这样的各向异性导电膜105将液晶驱动用IC103向透明电极102连接的情况下，首先，通过未图示的临时压接单元将各向异性导电膜105临时贴在透明基板101的透明电极102上。接着，经由各向异性导电膜105将液晶驱动用IC103搭载在透明基板101上，形成临时连接体后，通过热压接头106等的热压接单元将液晶驱动用IC103与各向异性导电膜105一起向透明电极102侧加热按压。通过利用该热压接头106进行的加热，各向异性导电膜105引起热固化反应，由此液晶驱动用IC103粘接到透明电极102上。
在此，当对透明基板101搭载液晶驱动用IC103时，为了正确连接形成在透明基板101的透明电极102和形成在液晶驱动用IC103的安装面的连接端子104，预先进行对准。
对准是这样进行的，即通过设在透明基板101的背面侧的照相机，对分别设在透明基板101及液晶驱动用IC103的安装面的对准标记进行摄像，基于摄像的图像检测位置，基于检测结果移动基板或电子部件。对准标记被预先登记，通过利用灰度搜索法（Gray Search）、2值法等的图像处理来使摄像的图像和登记图像匹配，从而进行识别并能够取得位置信息。
现有技术文献
专利文献
专利文献1：日本特开2005－26577号公报。
发明内容
发明要解决的课题
随着近年来液晶显示装置和其他电子设备的小型化、高功能化，电子部件也小型化、高功能化，并且也进行电路基板的金属线间距或电子部件的连接端子的微细间距化。在利用各向异性导电膜来将IC芯片等的电子部件COG连接在电极端子被微细间距化的电路基板上的情况下，为了在窄小化的电极端子间中也可靠地夹持导电性粒子，从而确保导通，需要以高密度填充导电性粒子。
然而，若以高密度填充导电性粒子，则对电子部件的电路基板进行对准时，难以通过设在电路基板的背面侧的照相机来读取经由各向异性导电膜而设在电路基板的表面或电子部件的安装面的对准标记，有可能降低对准的精度。这是因为以高密度填充的导电性粒子在膜的一部分集聚等而给对准标记的识别带来不一致，因此对准标记一般以避开粘贴各向异性导电膜的部位的方式设置。这样，在将电路基板侧的对准标记形成在各向异性导电膜的粘着位置之外的情况下，会离开电极端子的连接位置，要提高微细间距化的电极端子间的对准精度是不充分的，另外，若将对准标记设在电路基板的安装位置之外则会限制图案设计。
另外，在对准精度较低的情况下，对置的电极端子间的各向异性连接中，因为在平面方向出现位置偏移，还出现会减少通过夹持导电性粒子而有助于导通的电极端子的面积及导电性粒子数的问题。进而，因微细间距化而与邻接的电极端子的端子间空间也被窄小化，因此在对准精度较低的情况下，也担心与打算的电极端子邻接的电极端子发生连接（短路）等的问题。
因此，本发明目的在于提供一种在利用以高密度填充导电性粒子的各向异性导电膜来进行COG连接的工序中，将对准标记设在与粘着各向异性导电膜的区域重叠的位置，并且利用以照相机进行的摄像图像来高精度进行对准的对准方法、电子部件的连接方法、连接体的制造方法、连接体、各向异性导电膜。
用于解决课题的方案
为了解决上述课题，本发明所涉及的对准方法，在设有基板侧对准标记的透明基板的表面，经由含有导电性粒子的粘接剂搭载设有部件侧对准标记的电子部件，从上述透明基板的背面侧对上述基板侧对准标记及上述部件侧对准标记进行摄像，从上述摄像的图像调整上述基板侧对准标记及上述部件侧对准标记的位置，对齐上述电子部件相对于上述透明基板的搭载位置，在上述对准方法中，上述粘接剂中在俯视下有规则地排列有上述导电性粒子，在上述摄像的图像中，沿着上述基板侧对准标记或上述部件侧对准标记的外侧缘的虚线段，作为线段间断地显出从上述导电性粒子间所面临的上述基板侧对准标记或上述部件侧对准标记的外侧缘。
另外，本发明所涉及的电子部件的连接方法，在设有基板侧对准标记的透明基板的表面，经由含有导电性粒子的粘接剂搭载设有部件侧对准标记的电子部件，从上述透明基板的背面侧对上述基板侧对准标记和上述部件侧对准标记进行摄像，从上述摄像的图像调整上述基板侧对准标记及上述部件侧对准标记的位置，对齐上述电子部件相对于上述透明基板的搭载位置后，连接上述电子部件，在上述电子部件的连接方法中，上述粘接剂中在俯视下有规则地排列有上述导电性粒子，在上述摄像的图像中，沿着上述基板侧对准标记或上述部件侧对准标记的外侧缘的虚线段，作为线段间断地显出从上述导电性粒子间所面临的上述基板侧对准标记或上述部件侧对准标记的外侧缘。
另外，本发明所涉及的连接体的制造方法，在设有基板侧对准标记的透明基板的表面，经由含有导电性粒子的粘接剂搭载设有部件侧对准标记的电子部件，从上述透明基板的背面侧对上述基板侧对准标记和上述部件侧对准标记进行摄像，从上述摄像的图像调整上述基板侧对准标记及上述部件侧对准标记的位置，对齐上述电子部件相对于上述透明基板的搭载位置后，对连接上述电子部件的上述透明基板连接上述电子部件，在上述连接体的制造方法中，上述粘接剂中在俯视下有规则地排列有上述导电性粒子，在上述摄像的图像中，沿着上述基板侧对准标记或上述部件侧对准标记的外侧缘的虚线段，作为线段间断地显出从上述导电性粒子间所面临的上述基板侧对准标记或上述部件侧对准标记的外侧缘。
另外，本发明所涉及的连接体是通过上述方法制造的。
另外，本发明所涉及的各向异性导电膜，在俯视下导电性粒子有规则地排列，在上述各向异性导电膜中，每单位面积的上述导电性粒子的面积密度小于50％。
发明效果
依据本发明，由于导电性粒子在俯视下有规则地排列，所以在导电性粒子重叠在虚线段上的情况下，也作为线段间断地显出从导电性粒子间所面临的对准标记的外侧缘。因此，能够以该间断地显出的线段为界精度良好地识别对比度差、色差等而捕捉对准标记的外侧缘，在既定图像处理中能够在坐标上高精度地确定电子部件对透明基板的位置。由此，在隔着以高密度填充导电性粒子的粘接剂对对准标记进行摄像的情况下，也能精度良好地进行位置检测。
附图说明
图1是作为连接体的一个例子而示出的液晶显示面板的截面图。
图2是示出液晶驱动用IC和透明基板的对准工序的截面图。
图3是示出取得对准的状态下的IC侧对准标记与基板侧对准标记的图。
图4是示出各向异性导电膜的截面图。
图5是示出导电性粒子以点阵状规则排列的各向异性导电膜的平面图。
图6是示出本发明所涉及的对准方法中的摄像照相机的图像的图。
图7是示出利用随机配置导电性粒子的各向异性导电膜的对准方法中的摄像照相机的图像的图。
图8是示出对液晶显示面板的透明基板连接IC芯片的工序的截面图。
具体实施方式
以下，参照附图，对适用本发明的对准方法、电子部件的连接方法、连接体的制造方法、连接体、各向异性导电膜进行详细说明。此外，本发明并不仅限于以下的实施方式，显然在不脱离本发明的主旨的范围内能够进行各种变更。此外，附图是示意性的，各尺寸的比例等有不同于现实的情况。具体尺寸等应该参考以下的说明进行判断。此外，应当理解到附图相互之间也包含彼此尺寸的关系或比例不同的部分。
[连接体：液晶显示面板]
以下，作为利用适用本发明的对准方法对透明基板上COG连接电子部件的连接体，以在液晶显示面板的玻璃基板安装液晶驱动用的IC芯片作为电子部件的情况为例进行说明。该液晶显示面板10如图1所示，对置配置由玻璃基板等构成的两块透明基板11、12，并通过框状的密封13来互相粘合这些透明基板11、12。而且，液晶显示面板10通过向由透明基板11、12围绕的空间内封入液晶14而形成面板显示部15。
透明基板11、12以使由ITO（氧化铟锡）等构成的条纹状的一对透明电极16、17互相交叉的方式形成在互相对置的两内侧表面。而且，两透明电极16、17成为通过这两透明电极16、17的该交叉部位构成作为液晶显示的最小单位的像素。
两透明基板11、12之中，一个透明基板12形成为平面尺寸大于另一个透明基板11，在该形成为较大的透明基板12的边缘部12a，设有安装液晶驱动用IC18作为电子部件的COG安装部20。在COG安装部20形成有与设在液晶驱动用IC18的IC侧对准标记22重叠的基板侧对准标记21。
此外，液晶驱动用IC18通过对像素选择性地施加液晶驱动电压，局部改变液晶的取向，以能进行既定液晶显示。另外，如图2所示，液晶驱动用IC18在对透明基板12的安装面18a，形成有与透明电极17的端子部17a导通连接的电极端子19。而且，液晶驱动用IC18在安装面18a形成有通过与基板侧对准标记21重叠而进行对于透明基板12的对准的IC侧对准标记22。
[对准标记]
基板侧对准标记21及IC侧对准标记22例如由外侧标记及与该外侧标记内对位的内侧标记构成。如图3所示，透明基板12作为基板侧对准标记21形成有例如具有四边形的开口部的四边形状的外侧标记21a，液晶驱动用IC18作为IC侧对准标记22形成有由收入外侧标记21a的开口部的大小的四边形构成的内侧标记22a。
而且，在后述的对准工序中，以使四边形的内侧标记22a收入外侧标记21a的开口部内的方式移动液晶驱动用IC18，从而使形成在透明基板12的透明电极17的端子部17a与形成在液晶驱动用IC18的安装面18a的电极端子19对位。
此外，基板侧对准标记21及IC侧对准标记22，除了外侧标记及内侧标记之外，还能够使用通过组合来取得透明基板12与液晶驱动用IC18的对准的各种标记。另外，基板侧对准标记21及IC侧对准标记22的大小无特别限定，能够以例如100～300μm见方的尺寸形成。
另外，根据重叠后进行识别来看，基板侧对准标记21及IC侧对准标记22的形状也没有特别限制，可以使用各种公知的形状。而且，为了高精度地进行前后左右对位，基板侧对准标记21及IC侧对准标记22也可以分别为多个。该多个对准标记也可以不是同一形状。因为不同形状时容易进行识别。进而，基板侧对准标记21及IC侧对准标记22也可以通过颜色搭配来提高视觉辨认性。
在COG安装部20形成有透明电极17的端子部17a。在端子部17a上，利用各向异性导电膜1作为电路连接用粘接剂而连接液晶驱动用IC18。各向异性导电膜1含有导电性粒子4，用来经由导电性粒子4电连接液晶驱动用IC18的电极端子19与在透明基板12的缘部12a形成的透明电极17的端子部17a。该各向异性导电膜1因被热压接头33热压接而粘合剂树脂流动，从而导电性粒子4在端子部17a与液晶驱动用IC18的电极端子19之间压碎，在该状态下粘合剂树脂固化。由此，各向异性导电膜1将透明基板12和液晶驱动用IC18电气、机械地连接。
另外，在两透明电极16、17上，形成有实施了既定摩擦处理的取向膜24，以通过该取向膜24规定液晶分子的初始取向。而且，在两透明基板11、12的外侧配置有一对偏振光板25、26，以通过这两偏振光板25、26规定来自背光灯等的光源（未图示）的透射光的振动方向。
[各向异性导电膜]
接着，对各向异性导电膜1进行说明。各向异性导电膜（ACF：Anisotropic Conductive Film）1如图4所示，通常，在成为基体材料的剥离膜2上形成含有导电性粒子4的粘合剂树脂层（粘接剂层）3。各向异性导电膜1为热固化型或者紫外线等的光固化型粘接剂，粘着在液晶显示面板10的在透明基板12形成的透明电极17上并且搭载有液晶驱动用IC18，通过用热压接头33来热加压而流动，从而导电性粒子4在相对置的透明电极17的端子部17a与液晶驱动用IC18的电极端子19之间压碎，通过加热或者紫外线照射，在导电性粒子压碎的状态下固化。由此，各向异性导电膜1连接透明基板12与液晶驱动用IC18，从而能够使之导通。
另外，各向异性导电膜1在含有膜形成树脂、热固化性树脂、潜伏性固化剂、硅烷偶联剂等的普通粘合剂树脂层3中以既定图案规则排列有导电性粒子4。
支撑粘合剂树脂层3的剥离膜2，例如，在PET（聚对苯二甲酸乙二醇酯：Poly Ethylene Terephthalate）、OPP（定向聚丙烯：Oriented Polypropylene）、PMP（聚4－甲基戊烯－1：Poly－4－methylpentene－1）、PTFE（聚四氟乙烯：Polytetrafluoroethylene）等上涂敷硅酮等的剥离剂而成，不仅防止各向异性导电膜1的干燥，而且维持各向异性导电膜1的形状。
作为粘合剂树脂层3中含有的膜形成树脂，优选平均分子量为10000～80000左右的树脂。作为膜形成树脂，能举出环氧树脂、改性环氧树脂、尿烷树脂、苯氧基树脂等的各种树脂。其中，出于膜形成状态、连接可靠性等的观点特别优选苯氧基树脂。
作为热固化性树脂，无特别限定，能够举出例如市售的环氧树脂、丙烯树脂等。
作为环氧树脂，无特别限定，但是能举出例如萘型环氧树脂、联苯型环氧树脂、酚醛清漆型环氧树脂、双酚型环氧树脂、芪型环氧树脂、三酚甲烷型环氧树脂、酚醛芳烷基型环氧树脂、萘酚型环氧树脂、二聚环戊二烯型环氧树脂、三苯基甲烷型环氧树脂等。这些既可以单独也可以组合2种以上而使用。
作为丙烯树脂，无特别限制，能够根据目的适宜选择丙烯化合物、液态丙烯酸酯等。能够举出例如丙烯酸甲酯、丙烯酸乙酯、丙烯酸异丙酯、丙烯酸异丁酯、环氧丙烯酸酯、二丙烯酸乙二醇酯、二丙烯酸二乙二醇酯、三羟甲基丙烷三丙烯酸酯、二羟甲基三环葵烷二丙烯酸酯、1,4－丁二醇四丙烯酸酯、2－羟基－1,3－二丙烯酰氧基丙烷、2,2－双［4－(丙烯酰氧基甲氧基)苯基］丙烷、2,2－双［4－(丙烯酰氧基乙氧基)苯基］丙烷、二环戊烯基丙烯酸酯、三环葵基丙烯酸酯、树状(丙烯酰氧基乙基)异氰脲酸酯、尿烷丙烯酸酯、环氧丙烯酸酯等。此外，也能使用丙烯酸酯为甲基丙烯酸酯的材料。这些既可以单独使用1种，也可以并用2种以上。
作为潜伏性固化剂，无特别限定，但是能举出例如加热固化型、UV固化型等的各种固化剂。潜伏性固化剂通常不会反应，通过热、光、加压等的根据用途而选择的各种引发条件来激活，并开始反应。热活性型潜伏性固化剂的激活方法有：以利用加热的离解反应等生成活性种（阳离子、阴离子、自由基）的方法；在室温附近稳定地分散到环氧树脂中而在高温与环氧树脂相溶/熔化，并开始固化反应的方法；在高温熔出分子筛封入型的固化剂并开始固化反应的方法；利用微囊进行的熔出/固化方法等。作为热活性型潜伏性固化剂，有咪唑类、酰肼类、三氟化硼－胺络合物、锍盐、胺化酰亚胺、聚胺盐、双氰胺等或它们的改性物，这些既可以单独使用，也可为2种以上的混合体。其中，优选微囊型咪唑类潜伏性固化剂。
作为硅烷偶联剂，无特别限定，但是能够举出例如环氧类、氨类、巯基/硫化物类、脲化物类等。通过添加硅烷偶联剂，提高有机材料和无机材料的界面中的粘接性。
[导电性粒子]
作为导电性粒子4，能够举出各向异性导电膜1中使用的公知的任意导电性粒子。作为导电性粒子4，能举出例如镍、铁、铜、铝、锡、铅、铬、钴、银、金等的各种金属或金属合金的粒子；在金属氧化物、碳、石墨、玻璃、陶瓷、塑料等的粒子的表面镀敷金属的粒子；或者，在这些粒子的表面进一步镀敷绝缘薄膜的粒子等。在向树脂粒子的表面镀敷金属的粒子的情况下，作为树脂粒子，能举出例如环氧树脂、酚醛树脂、丙烯树脂、丙烯腈苯乙烯（AS）树脂、苯代三聚氰胺树脂、二乙烯基苯类树脂、苯乙烯类树脂等的粒子。
[导电性粒子的规则排列]
各向异性导电膜1中，导电性粒子4在俯视下以既定排列图案有规则地排列，例如如图5所示，以点阵状且均匀地排列。由于导电性粒子4在俯视下有规则地排列，所以各向异性导电膜1中导电性粒子4以高密度填充，也能通过摄像照相机30进行对准标记的识别。导电性粒子4的均匀排列图案能够任意设定为俯视下四方点阵、六方点阵等。导电性粒子4以不阻碍视觉辨认性即透射性的方式在同一层内单一地分散也可，但是从确保视觉辨认性来看优选排列的。关于对准工序将在后面详细叙述。
另外，各向异性导电膜1因导电性粒子4有规则地排列而在粘合剂树脂层3以高密度填充的情况下，也防止导电性粒子4的集聚造成的粗密的发生。因而，依据各向异性导电膜1，在微细间距化的端子部17a、电极端子19中也能捕捉导电性粒子4，另外，即便进行邻接的端子间距离的窄小化也能防止导电性粒子4的集聚体造成的端子间短路。
另外，各向异性导电膜1使每单位面积的导电性粒子4的面积密度小于50％，优选为45％以下，更优选为40％以下，进一步优选为35％以下。因为导电性粒子4的面积密度成为这以上高密度时，因导电性粒子4而透射率变差，无法确保隔着各向异性导电膜1进行的对准标记21、22的视觉辨认性。
这样的各向异性导电膜1能够通过例如在基板上以既定排列图案排列导电性粒子4后，对被剥离膜2支撑的粘合剂树脂层3转印导电性粒子4的方法；或者对被剥离膜2支撑的粘合剂树脂层3上，经由设有与排列图案对应的开口部的排列板而供给导电性粒子4等来制造。
此外，各向异性导电膜1的形状没有特别限定，但是能够制成例如如图4所示，能够卷绕到卷取盘（reel）6的长尺带形状，并切断成既定长度而使用。
另外，上述实施方式中，作为各向异性导电膜1，以将在粘合剂树脂层3规则排列导电性粒子4的热固化性树脂组合物成形为膜状的粘接膜为例进行了说明，但本发明所涉及的粘接剂并不局限于此，可以为例如层叠仅由粘合剂树脂3构成的绝缘性粘接剂层和由含有导电性粒子4的粘合剂树脂3构成的导电性粒子含有层的结构。另外，各向异性导电膜1只要导电性粒子4在俯视下规则排列，则除了如图2所示那样单层排列之外，也可以使导电性粒子4遍及多个粘合剂树脂层3而排列并且俯视下规则排列。另外，各向异性导电膜1也可以在多层结构的至少一个层内以既定距离单一地分散。
[连接体的制造方法]
接着，对液晶驱动用IC18经由各向异性导电膜1连接到透明基板12的透明电极17上的连接体的制造工序进行说明。首先，在透明电极17上临时压接各向异性导电膜1。将各向异性导电膜1临时压接的方法中，在透明基板12的透明电极17上，以使粘合剂树脂层3成为透明电极17侧的方式配置各向异性导电膜1。
而且，将粘合剂树脂层3配置在透明电极17上后，以临时粘贴用的加热按压头从剥离膜2侧对粘合剂树脂层3进行加热及加压，将加热按压头从剥离膜2分离，将剥离膜2从透明电极17上的粘合剂树脂层3剥离，从而只有粘合剂树脂层3临时粘贴在透明电极17上。用加热按压头进行的临时压接是通过以一点压力（例如0.1MPa～2MPa左右）在透明电极17侧按压剥离膜2的上表面的同时进行加热（例如70～100℃左右）而进行的。
[对准方法]
接着，临时粘贴粘合剂树脂层3的透明基板12承载于透明平台31上，以使透明基板12的透明电极17与液晶驱动用IC18的电极端子19隔着粘合剂树脂层3对置的方式进行透明基板12与液晶驱动用IC18的对准。
对准是通过利用设在透明基板12的背面侧的摄像照相机30来对分别设在透明基板12及液晶驱动用IC18的安装面18a的对准标记21、22进行摄像，基于摄像的图像检测位置，并根据检测结果移动液晶驱动用IC18而进行的。各对准标记21、22预先登记，通过利用灰度搜索法、2值法等的图像处理使摄像的图像和登记图像匹配，从而进行识别，能够取得位置信息。
基板侧对准标记21被隔着承载透明基板12的透明平台31及透明基板12而摄像，IC侧对准标记22被隔着透明平台、透明基板12及以高密度排列导电性粒子4的粘合剂树脂层3而摄像。为了高精度地进行对准，需要高精度地检测各对准标记21、22的位置，为此需要能够识别摄像图像中各对准标记21、22的边界即外侧缘。若对对准标记21、22进行摄像，则以外侧缘为界在对准标记侧和未设置对准标记的一侧产生对比度差，因此基于该对比度差能够检测出对准标记的位置，即液晶驱动用IC18相对于透明基板12的位置。
本发明所涉及的对准工序中，如图6所示，通过摄像照相机30摄像的基板侧对准标记21及IC侧对准标记22，在摄像图像中，沿着构成其外侧缘的虚线段，作为线段S而间断地显出从导电性粒子4间所面临的基板侧对准标记21或IC侧对准标记22的外侧缘。另外，如上所述，各向异性导电膜1通过使规则排列的导电性粒子4的每单位面积的面积密度小于50％，确保各向异性导电膜1的透射率，并确保对准标记21、22的视觉辨认性。
此外，该情况下的每一个导电粒子的单位面积优选为0.7～1300μm2，更优选为1.8～750μm2，进一步优选为4.2～350μm2。
导电粒子的个数密度优选为50～450000个/mm2，更优选为300～300000个/mm2，进一步优选为500～120000个/mm2。
该情况下的单位面积是能够充分地视觉辨认对准标记的范围，因此优选为0.7mm×0.7mm或大致相等的面积，更优选为1mm×1mm，进一步优选为2mm×2mm或大致相等的面积。
构成各对准标记21、22的外侧缘的虚线段是指显现在形成对准标记21、22的部位和不形成的部位之间的由对比度之差导出的构成对准标记21、22的外侧缘的线段。摄像图像中，若高密度排列的导电性粒子4重叠在虚线段上，则根据该导电性粒子4的轮廓也能产生对比度之差，因此不能以连续的线捕捉对准标记21、22的外侧缘，而仅用虚线段不能检测正确的位置。特别是，如图7所示，在利用导电性粒子4随机分散在粘合剂树脂层3的各向异性导电膜1的情况下，还有导电性粒子4局部集聚的情况，当该粒子集聚体与对准标记21、22的外侧缘重叠的情况下，也难以识别虚线段。
该点，本发明所涉及的对准工序中，如上所述，导电性粒子4在俯视下规则排列，因此在导电性粒子4重叠在虚线段上的情况下，也作为线段S间断地显出从导电性粒子4间所面临的基板侧对准标记21或IC侧对准标记22的外侧缘。
这在两对准标记21、22的摄影中的分辨率，因为导电性粒子4没有集聚而成为能够视觉辨认，换言之，能够透过各向异性导电膜1而视觉辨认IC侧对准标记22。即，在能够视觉辨认两对准标记21、22的倍率下，各向异性导电膜1在比两对准标记21、22更宏观的状态下，整个面上确保导电性粒子4排列等散布的状态。
由此，在本发明所涉及的对准工序中，能够以间断地显出的线段S为界识别对比度差而捕捉基板侧对准标记21或IC侧对准标记22的外侧缘，在灰度搜索法、2值法等的既定图像处理中能够在坐标上高精度地确定液晶驱动用IC相对于透明基板12的位置。然后，参照透明基板12的透明电极17与液晶驱动用IC18的电极端子19对置的坐标数据，调整液晶驱动用IC18相对于透明基板12的位置。
由此，在隔着各向异性导电膜1对IC侧对准标记22进行摄像的情况下，也能精度良好地检测液晶驱动用IC的位置。另外，能够将基板侧对准标记21设置在与IC侧对准标记22大致重叠的位置，以使两对准标记21、22成为既定位置关系的方式进行对准。因而，能够高精度地进行窄小化、微细间距化的透明电极17的端子部17a与液晶驱动用IC的电极端子19的对位。
此外，只要从导电性粒子4之间间断地显出所面临的对准标记21、22的外侧缘的线段S，长度也可以分别不相同。另外，对两对准标记进行摄像的摄像照相机30能采用CCD等的固体摄像元件。摄像照相机30的分辨率在与导电性粒子4的平均粒径相等以下的情况下，导电性粒子4与对准标记21、22的外侧缘重叠时，也能从它们之间捕捉所面临的外侧缘的线段。此外，在摄像照相机30的分辨率为与导电性粒子4的平均粒径相等以上的情况下，因为排列有导电性粒子4，在面视野下无法识别导电性粒子4，对得到识别对准标记21、22所需要的分辨率不会产生影响。
根据有关分辨率检测对准标记21、22，从而依据本发明所涉及的对准工序，也能够将对准标记21、22极小化至数十μm级的尺寸，透明基板12、液晶驱动用IC18的各电极图案设计因对准标记而所受到的限制较小，也能提高电极图案的设计自由度。
[从导电性粒子间所面临的线段长度]
在此，在摄像照相机30的摄像图像中，从导电性粒子4之间所面临的对准标记21、22的外侧缘的线段S成为数十～数百μm左右。另外，从导电性粒子4间所面临的两对准标记21、22的外侧缘的线段S具有作为线段而能够识别的长度，如果总长为摄像图像中的虚线段的长度的25％以上、优选为33％以上的长度，则能作为对准标记21、22的外侧缘而进行捕捉。这是因为排列有导电性粒子4，所以间断的线段处于其延长线上，从而实质上能够识别为线。在同一层内，即同一平面内以既定距离单一地存在导电性粒子4也能带来同样的效果，但是有排列的能够预计到上述识别，因此具有软件上的处理变得容易这一有利的效果。而且，利用该摄像图像进行既定图像处理，从而能够在坐标上高精度地确定液晶驱动用IC相对于透明基板12的位置。
[大于导电性粒子间区域50％/小于导电性粒子的面积占有率50％]
另外，在摄像照相机30的摄像图像中，最好使导电性粒子4间的区域大于50％，优选为55％以上，更优选为60％以上，进一步优选为65％以上，即，使导电性粒子4的面积占有率小于50％，优选为45％以下，更优选为40％以下，进一步优选为35％以下。若导电性粒子4以这以上高密度排列，则在摄像照相机30的摄像图像中，难以以从导电性粒子4间所面临的线段S为界识别对比度之差，从而作为对准标记21、22的外侧缘而加以捕捉，不能高精度地进行位置检测。
[正式压接工序]
在对准工序之后，通过加热至使粘合剂树脂层3固化的既定温度的热压接头33，以既定压力、时间从液晶驱动用IC18上进行热加压。由此，各向异性导电膜1的粘合剂树脂显示流动性，从液晶驱动用IC18的电极端子19与透明基板12的端子部17a之间流出，并且粘合剂树脂层3中的导电性粒子4被夹持在电极端子19及端子部17a间而压碎。
其结果，液晶驱动用IC18的电极端子19与透明基板12的端子部17a经由导电性粒子4电连接，在该状态下通过压接工具来加热的粘合剂树脂3固化。不在电极端子19及端子部17a之间的导电性粒子4，分散在粘合剂树脂中，维持电绝缘的状态。由此，能够仅在电极端子19与端子部17a之间谋求电导通。
此外，作为粘合剂树脂，使用自由基聚合反应类的速固化型的粘合剂树脂，从而在短的加热时间内也能使粘合剂树脂速固化。另外，作为各向异性导电膜1，不限于热固化型，只要能进行加压连接，也可以使用光固化型或光热并用型的粘接剂。
实施例
接着，对本发明的实施例进行说明。在本实施例中，利用导电性粒子规则排列的各向异性导电膜、和导电性粒子随机分散的各向异性导电膜，制成向评价用玻璃基板连接评价用IC的连接体样品，测定了电极间的位置偏移及本来连接的端子与邻接的端子的短路发生率。
[各向异性导电膜]
评价用IC的连接所使用的各向异性导电膜的粘合剂树脂层，通过调制在溶剂中加入苯氧基树脂（商品名 YP50，新日铁（鐵）化学公司制）60质量份、环氧树脂（商品名 jER828，三菱化学公司制）40质量份、固化剂（商品名 SI－60L，三新化学工业公司制）2质量份的粘合剂树脂组合物，并将该粘合剂树脂组合物涂敷在剥离膜上、并加以烧成。在实施例1～3、比较例1、2中，以成为既定面积占有率的方式点阵状规则排列导电性粒子（商品名 AUL704，积水化学工业公司制）后，将它转印到被剥离膜支撑的粘合剂树脂层，从而得到了导电性粒子规则排列的各向异性导电膜（参照图5）。另外，比较例3中，使导电性粒子分散在粘合剂树脂组合物中，涂敷在剥离膜上、并加以烧成，从而得到导电性粒子随机分散的各向异性导电膜。
[评价用IC]
作为评价元件，使用了外形：1.5mm×13mm、厚度0.5mm；凸块：25μm×140μm；凸块间空间：7.5μm；凸块高度：15μm（Au－plated，金镀敷）的评价用IC。
[评价用玻璃基板]
作为连接有评价用IC的评价用玻璃基板，使用了外形为30mm×50mm、厚度0.5mm、形成有与评价用IC的凸块同尺寸同间距的梳齿状的电极图案的ITO图案玻璃。
在该评价用玻璃基板临时粘贴各向异性导电膜后，进行评价用IC的凸块与评价用玻璃基板的布线电极的对准的同时搭载评价用IC，利用热压接头在180℃、80MPa、5sec的条件下进行热压接而制成了连接体样品。关于各连接体样品，测定了电极间的位置偏移及本来连接的端子和邻接的端子的短路发生率。电极间的位置偏移是测定了以同尺寸形成的评价用IC的凸块及评价用玻璃基板的电极的偏移量。另外，与邻接端子的短路发生率是测定了在评价用IC的全凸块与评价用玻璃基板的全电极端子间，与邻接端子的短路的发生率。
[实施例1]
实施例1中，利用了以使面积占有率成为1％的方式规则排列导电性粒子的各向异性导电膜。另外，实施例1中，设在评价用IC的安装面的IC侧对准标记、和设在评价用玻璃基板的基板侧对准标记，俯视下形成在大致相同的位置。
[实施例2]
实施例2中，除了使用以使面积占有率成为15％的方式规则排列导电性粒子的各向异性导电膜之外，采用与实施例1相同的条件。
[实施例3]
实施例3中，除了使用以使面积占有率成为35％的方式规则排列导电性粒子的各向异性导电膜之外，采用与实施例1相同的条件。
[比较例1]
比较例1中，除了将基板侧对准标记设在各向异性导电膜的转贴区域外的与IC侧对准标记分离的位置之外，采用与实施例2相同的条件。
[比较例2]
比较例2中，除了使用以使面积占有率成为50％的方式规则排列导电性粒子的各向异性导电膜之外，采用与实施例1相同的条件。
[比较例3]
比较例3中，除了使用以使面积占有率成为35％的方式随机分散导电性粒子的各向异性导电膜之外，采用与实施例1相同的条件。
[表1]
如表1所示，实施例1～3中，位置偏移全都收入1～1.3μm，能精度良好地对准。这是因为实施例1～3中，使用导电性粒子在俯视下以成为面积占有率35％以下的方式规则排列的各向异性导电膜，因此隔着各向异性导电膜对对准标记进行摄像，使导电性粒子与对准标记的外侧缘重叠的情况下，对准标记的外侧缘的线段也从导电性粒子之间所面临，通过以该线段为界捕捉对比度差，能够精度良好地检测对准标记的位置。
另外，实施例1～3中，电极端子间的短路发生率也低到30ppm或70ppm。这认为是随着对准精度的提高，评价用IC的凸块与评价用玻璃基板的布线电极的侧缘部的偏移被最小化，难以出现处于该区域的导电性粒子与处于凸块间空间的导电性粒子的不必要的接触，从而抑制了与邻接端子的短路的发生。即，若在对置的凸块及布线电极间的对置位置产生偏移，则本来连接的凸块及端子与邻接的凸块及端子的距离变短。在该情况下，要担心发生与邻接的（倾斜的）凸块及布线电极间的导电粒子造成的导通即短路，但是在实施例1～3中，随着对准精度的提高而本来连接的凸块及布线电极间的偏移被最小化，从而能够类推出这样的现象难以产生。
另一方面，比较例1中，由于将基板侧对准标记设在各向异性导电膜的粘着区域外，所以基板侧对准标记与IC侧对准标记相分离，对准精度变差。因此，评价用IC的凸块与评价用玻璃基板的电极的位置偏移大到4μm。另外，随着对准偏差，与邻接的电极端子的短路发生率增加到500ppm。
另外，比较例2中，由于使导电性粒子的面积占有率为50％，所以无法用照相机捕捉对准标记的外侧缘，对准精度变差。因此，评价用IC的凸块与评价用玻璃基板的电极的位置偏移大到4μm。另外，随着对准偏差，与邻接的电极端子的短路发生率增加到500ppm。
另外，比较例3中，使导电性粒子随机分散，因此发生导电性粒子的集聚体，从而损害对准标记的外侧缘的视觉辨认性，对准精度变差。因此，评价用IC的凸块与评价用玻璃基板的电极的位置偏移大到3μm。另外，随着对准偏差，与邻接的电极端子的短路发生率增大到400ppm。
标号说明
1　各向异性导电膜；2　剥离膜；3　粘合剂树脂层；4　导电性粒子；10　液晶显示面板；11、12　透明基板；12a　边缘部；13　密封材料；14　液晶；15　面板显示部；16、17　透明电极；17a　端子部；18　液晶驱动用IC；18a　安装面；19　电极端子；20　COG安装部；21　基板侧对准标记；22　IC侧对准标记；30　摄像照相机；33　热压接头。

Claims (11)

1. 一种对准方法，在设有基板侧对准标记的透明基板的表面，经由含有导电性粒子的粘接剂搭载设有部件侧对准标记的电子部件，
从所述透明基板的背面侧对所述基板侧对准标记及所述部件侧对准标记进行摄像，
从所述摄像的图像调整所述基板侧对准标记及所述部件侧对准标记的位置，对齐所述电子部件相对于所述透明基板的搭载位置，在所述对准方法中，
所述粘接剂中在俯视下有规则地排列有所述导电性粒子，
在所述摄像的图像中，沿着所述基板侧对准标记或所述部件侧对准标记的外侧缘的虚线段，作为线段间断地显出从所述导电性粒子间所面临的所述基板侧对准标记或所述部件侧对准标记的外侧缘。
2. 如权利要求1所述的对准方法，其中，沿着所述虚线段，从所述导电性粒子间所面临的所述线段以所述虚线段的25％以上的长度显出。
3. 如权利要求1或2所述的对准方法，其中，在所述摄像的图像中，所述粘接剂的所述导电性粒子间区域为65％以上。
4. 如权利要求1或2所述的对准方法，其中，在所述摄像的图像中，所述导电性粒子的面积占有率为35％以内。
5. 如权利要求1或2所述的对准方法，其中，对所述基板侧对准标记及所述部件侧对准标记进行摄像的摄像照相机的分辨率为所述导电性粒子的平均粒径以下。
6. 如权利要求3所述的对准方法，其中，对所述基板侧对准标记及所述部件侧对准标记进行摄像的摄像照相机的分辨率为所述导电性粒子的平均粒径以下。
7. 如权利要求1或2所述的对准方法，其中，所述基板侧对准标记形成在设有所述粘接剂的位置。
8. 一种电子部件的连接方法，在设有基板侧对准标记的透明基板的表面，经由含有导电性粒子的粘接剂搭载设有部件侧对准标记的电子部件，
从所述透明基板的背面侧对所述基板侧对准标记和所述部件侧对准标记进行摄像，
从所述摄像的图像调整所述基板侧对准标记及所述部件侧对准标记的位置，对齐所述电子部件相对于所述透明基板的搭载位置后，连接所述电子部件，在所述电子部件的连接方法中，
所述粘接剂中在俯视下有规则地排列有所述导电性粒子，
在所述摄像的图像中，沿着所述基板侧对准标记或所述部件侧对准标记的外侧缘的虚线段，作为线段间断地显出从所述导电性粒子间所面临的所述基板侧对准标记或所述部件侧对准标记的外侧缘。
9. 一种连接体的制造方法，在设有基板侧对准标记的透明基板的表面，经由含有导电性粒子的粘接剂搭载设有部件侧对准标记的电子部件，
从所述透明基板的背面侧对所述基板侧对准标记和所述部件侧对准标记进行摄像，
从所述摄像的图像调整所述基板侧对准标记及所述部件侧对准标记的位置，对齐所述电子部件相对于所述透明基板的搭载位置后，对连接所述电子部件的所述透明基板连接所述电子部件，在所述连接体的制造方法中，
所述粘接剂中在俯视下有规则地排列有所述导电性粒子，
在所述摄像的图像中，沿着所述基板侧对准标记或所述部件侧对准标记的外侧缘的虚线段，作为线段间断地显出从所述导电性粒子间所面临的所述基板侧对准标记或所述部件侧对准标记的外侧缘。
10. 一种连接体，利用权利要求9所述的方法来制造。
11. 一种各向异性导电膜，在俯视下导电性粒子有规则地排列，在所述各向异性导电膜中，
每单位面积的所述导电性粒子的面积密度小于50％。
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