CN105940484B - 衬垫调节器制造方法及衬垫调节器 - Google Patents
衬垫调节器制造方法及衬垫调节器 Download PDFInfo
- Publication number
- CN105940484B CN105940484B CN201480074561.4A CN201480074561A CN105940484B CN 105940484 B CN105940484 B CN 105940484B CN 201480074561 A CN201480074561 A CN 201480074561A CN 105940484 B CN105940484 B CN 105940484B
- Authority
- CN
- China
- Prior art keywords
- polishing particles
- layer
- gold
- gold plated
- plated layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000002245 particle Substances 0.000 claims abstract description 162
- 238000005498 polishing Methods 0.000 claims abstract description 154
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 126
- 229910052737 gold Inorganic materials 0.000 claims abstract description 124
- 239000010931 gold Substances 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000005530 etching Methods 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000000227 grinding Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 208000007578 phototoxic dermatitis Diseases 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140034834A KR101558449B1 (ko) | 2014-03-25 | 2014-03-25 | 패드 컨디셔너 제조방법 및 패드 컨디셔너 |
| KR10-2014-0034834 | 2014-03-25 | ||
| PCT/KR2014/010798 WO2015147401A1 (ko) | 2014-03-25 | 2014-11-11 | 패드 컨디셔너 제조방법 및 패드 컨디셔너 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105940484A CN105940484A (zh) | 2016-09-14 |
| CN105940484B true CN105940484B (zh) | 2018-10-16 |
Family
ID=54195877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480074561.4A Active CN105940484B (zh) | 2014-03-25 | 2014-11-11 | 衬垫调节器制造方法及衬垫调节器 |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101558449B1 (ko) |
| CN (1) | CN105940484B (ko) |
| MY (1) | MY187700A (ko) |
| SG (1) | SG11201606279YA (ko) |
| WO (1) | WO2015147401A1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107336148A (zh) * | 2017-08-01 | 2017-11-10 | 华侨大学 | 一种快速制备磨粒图案分布磨盘的方法 |
| CN107336150A (zh) * | 2017-08-01 | 2017-11-10 | 华侨大学 | 一种沉积制备磨粒图案分布磨盘的方法 |
| KR102013386B1 (ko) * | 2018-01-29 | 2019-08-22 | 새솔다이아몬드공업 주식회사 | 역도금 패드 컨디셔너 제조방법 및 패드 컨디셔너 |
| CN112189062A (zh) | 2018-05-22 | 2021-01-05 | 帝国离子株式会社 | 耐磨损性涂膜、耐磨损性构件及耐磨损性涂膜的制造方法以及滑动机构 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040094914A (ko) * | 2003-05-06 | 2004-11-12 | (주)디디다이아 | 세라믹 물질을 사용하여 화학기계적 연마 패드 콘디셔너를제조하는 방법 및 그에 의해 제조된 화학기계적 연마 패드콘디셔너 |
| KR20090078647A (ko) * | 2008-01-15 | 2009-07-20 | 이화다이아몬드공업 주식회사 | Ｃｍｐ 패드용 컨디셔너 |
| KR20120011713A (ko) * | 2010-07-30 | 2012-02-08 | 신한다이아몬드공업 주식회사 | Ｃｍｐ 패드 컨디셔너 및 그 제조방법 |
| JP2013123771A (ja) * | 2011-12-14 | 2013-06-24 | Ｄ．Ｎ．Ａ．メタル株式会社 | Ｃｍｐパッドコンディショナおよび当該ｃｍｐパッドコンディショナの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007260886A (ja) * | 2006-03-30 | 2007-10-11 | Mitsubishi Materials Corp | Ｃｍｐコンディショナおよびその製造方法 |
| KR20110124988A (ko) * | 2010-05-12 | 2011-11-18 | 신한다이아몬드공업 주식회사 | Ｃｍｐ 패드 컨디셔너 및 그 제조방법 |
-
2014
- 2014-03-25 KR KR1020140034834A patent/KR101558449B1/ko active IP Right Grant
- 2014-11-11 CN CN201480074561.4A patent/CN105940484B/zh active Active
- 2014-11-11 SG SG11201606279YA patent/SG11201606279YA/en unknown
- 2014-11-11 WO PCT/KR2014/010798 patent/WO2015147401A1/ko active Application Filing
- 2014-11-11 MY MYPI2016702816A patent/MY187700A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040094914A (ko) * | 2003-05-06 | 2004-11-12 | (주)디디다이아 | 세라믹 물질을 사용하여 화학기계적 연마 패드 콘디셔너를제조하는 방법 및 그에 의해 제조된 화학기계적 연마 패드콘디셔너 |
| KR20090078647A (ko) * | 2008-01-15 | 2009-07-20 | 이화다이아몬드공업 주식회사 | Ｃｍｐ 패드용 컨디셔너 |
| KR20120011713A (ko) * | 2010-07-30 | 2012-02-08 | 신한다이아몬드공업 주식회사 | Ｃｍｐ 패드 컨디셔너 및 그 제조방법 |
| JP2013123771A (ja) * | 2011-12-14 | 2013-06-24 | Ｄ．Ｎ．Ａ．メタル株式会社 | Ｃｍｐパッドコンディショナおよび当該ｃｍｐパッドコンディショナの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015147401A1 (ko) | 2015-10-01 |
| KR101558449B1 (ko) | 2015-10-07 |
| CN105940484A (zh) | 2016-09-14 |
| MY187700A (en) | 2021-10-12 |
| KR20150111202A (ko) | 2015-10-05 |
| SG11201606279YA (en) | 2016-09-29 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |