CN105940484B - Pad conditioner manufacturing method and pad conditioner - Google Patents
Pad conditioner manufacturing method and pad conditioner Download PDFInfo
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- CN105940484B CN105940484B CN201480074561.4A CN201480074561A CN105940484B CN 105940484 B CN105940484 B CN 105940484B CN 201480074561 A CN201480074561 A CN 201480074561A CN 105940484 B CN105940484 B CN 105940484B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000002245 particle Substances 0.000 claims abstract description 162
- 238000005498 polishing Methods 0.000 claims abstract description 154
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 126
- 229910052737 gold Inorganic materials 0.000 claims abstract description 124
- 239000010931 gold Substances 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000005530 etching Methods 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000000227 grinding Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 208000007578 phototoxic dermatitis Diseases 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The manufacturing method and pad conditioner of pad conditioner of the present invention, including：Photosensitive film (23) is laminated on base substrate (21), and by etch process the step of forming multiple mounting holes (25) on the photosensitive film (23)；Polishing particles (27) are inserted into the mounting hole (25), and the step of upper side of the Gold plated Layer (31) to cover the photosensitive film (23) and the polishing particles (27) is formed at the mounting hole top；The step of removing the base substrate (21) and the photosensitive film (23)；And part the step of melting the Gold plated Layer (31).The present invention has the advantages that the height of the top for the polishing particles that polishing particles can be made equably to expose in Gold plated Layer and can adjust the top for protruding from Gold plated Layer.
Description
Technical field
The present invention relates to a kind of manufacturing methods of pad conditioner, in particular to a kind of CMP in planarization chip
The manufacturing method and pad conditioner of the pad conditioner used in device.
The present invention advocates that Korean Patent Application No. filed in 25 days March in 2014 is No. 10-2014-0034834 excellent
It first weighs, all the contents of the application come under the present invention.
Background technology
CMP devices are to be ground the device of processing for making semiconductor wafer obtain flatness.
As shown in Figure 1, the basic principle of CMP devices is, polishing pad 2, support are pasted on the top of rotatable face plate 1
Frame clamps grinding charge chip, and face supplies lapping liquid and applies stressed state to the bracket 3 for clamping chip 4 on the liner
Under, make face plate 1 and 3 relative motion of bracket and grinds.
In the CMP devices of flatness for obtaining semiconductor wafer, the uniformity of wafer grinding is important feature.And
And in the lot of essential factors in order to improve the uniformity of wafer grinding, the surface state of liner is particularly important.However, in liner
Due to applying with pressure and speed in process of lapping, with the progress of processing, pad surfaces become inhomogenous, and grind residue
The micropore on liner is blocked, to make liner lose function.
Therefore, when the surface state of liner deforms, the surface of the liner of deformation is carried out using adjuster 10 thin
Micro- grinding and the adjusting operation for making new Minute pores reappear.
As shown in Fig. 2, adjuster 10 is by regulator substrate 11 and the multiple polishing particles 7 being arranged in regulator substrate 11
And the Gold plated Layer 8 for the polishing particles 7 to be fixed in regulator substrate 7 is constituted.
Plating, welding or sintering side can be used in fixed form of the manufacturing method of this adjuster based on polishing particles
Formula, polishing particles then use diamond.
However, the modes such as plating, welding, sintering be by way of mold or coated abrasive particle, therefore with
Lower problem, that is, the distance between polishing particles is not easy free adjusting, and the polishing particles formed are not easy the protrusion height for having uniform
The position and.
No. 2002-0046471 (publication date of (patent document 1) South Korea Publication：On 06 21st, 2002, title：Change
The manufacturing method of mode-mechanical system polishing pad adjuster)
Invention content
The object of the present invention is to provide a kind of manufacturers of the pad conditioner used in CMP devices adjusting liner
Method, this method makes polishing particles protrude from a plane using reversed plating mode, and has uniform protrusion height and position.
In order to realize the purpose, the manufacturing method of pad conditioner of the present invention, including：It is thin that photonasty is laminated
Film is on base substrate, and by etch process the step of forming multiple mounting holes on the photosensitive film；In the peace
It is inserted into polishing particles in dress hole, and Gold plated Layer is formed to cover the photosensitive film and the grinding on the mounting hole top
The step of upper side of particle；The step of removing the base substrate and the photosensitive film；And the plating is melted in part
Layer gold, the step of making the polishing particles partly expose.
It further include the steps that the upper side smearing corrosion-resistant coating in the Gold plated Layer.
There is the Gold plated Layer that the polishing particles partly expose to be fixed on the processing of regulator substrate by adhesive
On face.
The mounting hole is formed with the shape of the maximum gauge more than or equal to the polishing particles.
The upper side of the Gold plated Layer is parallel with the surface of the base substrate.
A kind of pad conditioner, is equably protruding with multiple polishing particles in Gold plated Layer, the upper side of the Gold plated Layer with
It is formed with protrusion on the part of the polishing particles contact.
A kind of manufacturing method of pad conditioner, including：Photosensitive film is laminated on base substrate, and by etching work
Skill on the photosensitive film the step of forming multiple mounting holes；It is inserted into polishing particles in the mounting hole and carries out first
It is secondary gold-plated and form the step of filled layer is to fill the mounting hole；By second of gold-plated formation Gold plated Layer to cover the sense
The step of upper side of photosensitiveness film, the filled layer and the polishing particles；It removes the base substrate and removes the sense
After photosensitiveness film, the step of removing the filled layer, the polishing particles made partly to expose.
There is the Gold plated Layer that the polishing particles partly expose to be fixed on the processing of regulator substrate by adhesive
On face.
The filled layer is different substances from the Gold plated Layer.
A kind of pad conditioner, is equably protruding with multiple polishing particles in Gold plated Layer, the upper side of the Gold plated Layer with
It is formed with protrusion on the part of the polishing particles contact.
A kind of manufacturing method of pad conditioner, including：Photosensitive film is laminated on base substrate and by etching work
Skill on the photosensitive film the step of forming multiple mounting holes；It is inserted into polishing particles in the mounting hole and carries out first
It is secondary gold-plated and form filled layer to fill the rapid of the mounting hole；The step of removing the photosensitive film；It is plated by second
Gold, formed supporting layer with cover the base substrate upper side and the polishing particles surface the step of；Pass through
It is gold-plated three times, the step of forming upper side of the Gold plated Layer to cover the supporting layer and the polishing particles；Remove the pedestal
Substrate, the supporting layer and the filled layer, the step of making the polishing particles partly expose.
There is the Gold plated Layer that the polishing particles partly expose to be fixed on the processing of regulator substrate by adhesive
On face.
The supporting layer and the filled layer are identical substances.
The Gold plated Layer is different substance with the supporting layer and filled layer.
A kind of pad conditioner, is equably protruding with multiple polishing particles in Gold plated Layer, the upper side of the Gold plated Layer with
It is formed with recessed portion on the part of the polishing particles contact.
By carrying out further surface gold-plating in the upper side of the Gold plated Layer and removing the recessed portion.
The present invention forms the Gold plated Layer for fixing polishing particles by reversed plating mode, to which polishing particles are not only equal
One ground protrudes from Gold plated Layer, and the top of polishing particles protrudes from the top of Gold plated Layer with consistent height.
In addition, the present invention can adjust the height that polishing particles protrude from the top of Gold plated Layer by photosensitive film.
In addition, the present invention uses mold using photosensitive film substitution, it can manufacture and configure polishing particles with various patterns
Pad conditioner.
Therefore, compared with existing mould profile, production efficiency is high, has the effect of shortening manufacturing time, polishing particles
The top be fixed in Gold plated Layer with consistent height, therefore adjust operation when, can equably to liner be adjusted, from
And have the effect of that the stability of CMP process can be improved.
Description of the drawings
Fig. 1 is the skeleton diagram for illustrating CMP apparatus structures.
Fig. 2 is the schematic diagram for illustrating existing pad conditioner.
Fig. 3 is the sectional view for the manufacturing method for illustrating the pad conditioner that one embodiment of the invention is related to.
Fig. 4 is the sectional view for the manufacturing method for illustrating the pad conditioner that another embodiment of the present invention is related to.
Fig. 5 is the sectional view for the manufacturing method for illustrating the pad conditioner that further embodiment of this invention is related to.
Reference sign
10：Pad conditioner 11：Regulator substrate
21：Base substrate 23：Photosensitive film
25：Mounting hole 27：Polishing particles
28：Filled layer 29：Supporting layer
31：Gold plated Layer 33：Protrusion
34：Protrusion 35：Recessed portion
Specific implementation mode
The embodiment of the present invention is described in detail referring to the drawings.
The manufacturing method of pad conditioner of the present invention has carries out reversed plating side by using photosensitive film
Formula and form electroplated layer to fix the feature of polishing particles, and respectively to based on this method an embodiment, another embodiment and
Three kinds of methods of another embodiment illustrate.
[embodiment]
As shown in figure 3, the manufacturing method of pad conditioner of the present invention, including：Photosensitive film 23 is laminated the bottom of at
On seat substrate 21, and the step S11 of multiple mounting holes 25 is formed by etch process on the photosensitive film 23；Described
It is inserted into polishing particles 27 in mounting hole 25, and Gold plated Layer 31 is formed to cover the photosensitive film 23 on the mounting hole top
With the step S12 of the upper side of the polishing particles 27；The step of removing the base substrate 21 and the photosensitive film 23
S13；And the step S14 of the Gold plated Layer 31 is melted in part, to form the Gold plated Layer 31 for fixing polishing particles 27.
Pad conditioner 10 includes regulator substrate 11, and polishing particles 27 are fixed on regulator substrate 11 by Gold plated Layer 31
Upper side on.
Regulator substrate 11 is the component for having circular shape, and the central part of substrate is combined with another rotary unit, from
And it can rotate.Based on the surface of 11 adjustable cushion of rotatable regulator substrate, liner being capable of maximum limit as a result,
Degree ground maintains initial conditions.
In step S11, photosensitive film 23 is layered on base substrate 21.
Photosensitive film 23 can be pasted onto on base substrate 21 by adhesive film.It can also be in base substrate 21 and photonasty
Adhesive film is added between film 23 and so that photosensitive film 23 is layered on base substrate 21 by pressurized, heated and fusing.
In the photosensitive film 23 that the upper side of base substrate 21 is formed, the hole pair for being inserted into polishing particles 27 is etched
Answer the photosensitive film 23 of position.
The etching of photosensitive film 23 preferably carries out photoetching by covering light shield into irradiation ultraviolet light.
That is, light shield can be with multiple regular hexagons, circle or quadrangle form hole, and in exposed photosensitive film
Ultraviolet light passes through the photosensitive film of light shield hole irradiation position, and the part not exposed by etching removal.
Therefore, etched photosensitive film 23 forms the space of positive six side property, circle or quadrangle form, to
Multiple mounting holes 25 are formed on photosensitive film 23.
Preferably, mounting hole 25 is regularly arranged.
Preferably, mounting hole 25 has the shape of the maximum gauge more than or equal to polishing particles 27.It mounting hole 25 and grinds
When the size of abrasive grain 27 is identical, polishing particles 27 can easily, equably maintain the state for being inserted in mounting hole 25.
The pore size of mounting hole 25 is reduced, polishing particles 27 can be exposed with line/point mode.
That is, point or threadiness is presented by the top portion for the polishing particles 27 for making to be fixed in Gold plated Layer 31, to adjust
When saving operation, polishing particles 27 are equably worn away, so as to extend the service life of polishing particles 27.
On the contrary, the pore size for increasing mounting hole 25 is larger than the maximum gauge of polishing particles 27, then exposed in a manner of face
The quantity of polishing particles 27 will increase.
The mounting hole 25 formed on photosensitive film 23 can form one by the pattern in the hole formed on control light shield
A above pattern.
Stainless steel substrate can be used in base substrate 21.Base substrate is in addition to stainless steel substrate that can be used can also use such as gold
Belong to, the substrate that alloy or ceramics manufacture.
Base substrate 21 has material identical with regulator substrate 11, and is used to form Gold plated Layer 31 to fix abrasive grains
Son 27.Moreover, the thickness by adjusting photosensitive film 23, to adjust the upper side that polishing particles 27 protrude from Gold plated Layer 31
Height.
In step S12, polishing particles 27 are inserted in mounting hole 25.A polishing particles are inserted into one mounting hole 25
27。
The thickness of mounting hole 25 is less than the height of polishing particles 27.Therefore, the polishing particles being inserted in mounting hole 25
27 more protrude relative to photosensitive film 23 to top.
After being inserted into polishing particles 27, by gold-plated processing for the first time, Gold plated Layer 31 is formed to cover 23 He of photosensitive film
The upper side of polishing particles 27.
Gold plated Layer 31 is preferably made of nickel.There is metal-like to make beautiful appearance for nickel plating, and be easy to adjust thickness and
With heat resistance and wearability, and can easily adjust thickness keeps it uniform.
Polishing particles 27 can be fixed by Gold plated Layer 31.Polishing particles 27 are preferably diamond particles.Polishing particles in addition to
Except diamond particles, other types such as cubic boron nitride, polycrystalline cubic boron nitride, super hard crystalline particle can also be used.
In step S13, base substrate 21 is removed.Then, remaining photosensitive film 23 in whole etching step S11.That is,
By etching all and removing the photosensitive film 23 between Gold plated Layer 31 and Gold plated Layer 31.
After etching photosensitive film 23, spinning upside down makes Gold plated Layer 31 positioned at lower part and polishing particles 27 are located at top.
By step S13, protrusion 33 is formed at certain intervals in Gold plated Layer 31, abrasive grain 27 be embedded in be formed it is convex
Go out on the position in portion 33.
Being embedded in the polishing particles 27 of protrusion 33, to have certain height its height identical.
In step S14, Gold plated Layer 31 is melted by part and removes protrusion, one of 27 top of polishing particles can be made
Point to exposing outside.That is, the part by etching the Gold plated Layer 31 that removal is not necessarily to, to make the one of 27 top of polishing particles
Expose to outside part.
The polishing particles 27 in Gold plated Layer 31 are manufactured and be fixed on through step S14, and abrasive grains are supported based on base substrate 21
The mode of the bottom of son 27 manufactures, and therefore, after removing base substrate 21, it is identical with position to expose the protrusion height being exposed on the external.
Therefore, when operation is adjusted, liner can equably be adjusted.
When 31 bottom surfaces of Gold plated Layer are flat, can integrally it be fixed in regulator substrate 11 using adhesive.Gold plated Layer 31
Bottom surfaces unevenness when, plane lapping manufacturing procedure can be increased to form flat plane.
That is, the upper side of the bottom surfaces for the Gold plated Layer 31 for being fixed with polishing particles 27 and regulator substrate 11 is passed through bonding
Agent is pasted, to which polishing particles 27 is fixed in regulator substrate 11.
It, can be by last gold-plated resistance to improve after Gold plated Layer 31 is fixed on regulator substrate 11 using adhesive
Corrosivity.For the purpose for improving corrosion resistance, finally gold-plated it is preferable to use cadmium plating (Cr).
In addition, Gold plated Layer 31 is medium using the metallic bond layer for the material being different from, it is pasted onto adjuster base
On plate 11.
The pad conditioner 10 of manufacturing method manufacture based on pad conditioner as described above, as described in step S15,
The upper side of regulator substrate 11 is formed with Gold plated Layer 31, and multiple polishing particles are equably protruded with more than one pattern and shape
At in Gold plated Layer 31.
In addition, the height for protruding from the top of the polishing particles 27 on the top of Gold plated Layer 31 is identical.
The upper side of Gold plated Layer 31 is formed with protrusion 34, and the protrusion 34 is critical positioned at being contacted with polishing particles
Part.Protrusion 34 is formed during Gold plated Layer 31 is melted in part and removes protrusion 33.
In one embodiment, polishing particles 27 are diamond particles, and Gold plated Layer 31 is nickel coating, and regulator substrate 11 is stainless steel
Substrate.
The pad conditioner manufacturing method that one embodiment is related to, based on using single metal operation and formed gold-plated
Layer, therefore, it is possible to simplify working space and effect technique.
[another embodiment]
As shown in figure 4, the manufacturing method of pad conditioner of the present invention, including：Photosensitive film 23 is laminated the bottom of at
On seat substrate 21, and the step S21 of multiple mounting holes 25 is formed by etch process on the photosensitive film 23；Described
It is inserted into polishing particles 27 in mounting hole 25 and carries out gold-plated for the first time and forms the step of filled layer 28 is to fill the mounting hole
S22；By second of gold-plated formation Gold plated Layer 31 to cover the photosensitive film 23, the filled layer 28 and the abrasive grains
The step S23 of the upper side of son 27；After removing the base substrate 21 and removing the photosensitive film 23, the filling is removed
Layer 28, the step S24 for making 27 part of the polishing particles expose.To form the Gold plated Layer 31 for fixing polishing particles 27.
Another embodiment compared with an embodiment difference lies in：Do not include the step S14 that Gold plated Layer 31 is melted in part, and
Process including forming and removing filled layer 28, to the polishing particles 27 with the upper side for enabling to protrude from Gold plated Layer 31
Equably protrude.
In step S21, photosensitive film 23 is layered on base substrate 21.It is formed in the upper side of base substrate 21
In photosensitive film 23, the photosensitive film 23 of the hole corresponding position for being inserted into polishing particles 27 is etched.
The etching of photosensitive film 23 preferably carries out photoetching by covering light shield into irradiation ultraviolet light.
That is, light shield can be with multiple regular hexagons, circle or quadrangle form hole, and in exposed photosensitive film
Ultraviolet light passes through the photosensitive film of light shield hole irradiation position, and the part not exposed by etching removal.
Therefore, etched photosensitive film 23 forms the space of positive six side property, circle or quadrangle form, to feel
Multiple mounting holes 25 are formed on photosensitiveness film 23.
Preferably, mounting hole 25 has the shape of the maximum gauge more than or equal to polishing particles 27.
When mounting hole 25 is identical with the size of polishing particles 27, polishing particles 27 easily, equably can maintain to be inserted into
In the state of mounting hole 25.
In addition, when reducing the pore size of mounting hole 25, polishing particles 27 can be exposed with line/point mode.
That is, point or threadiness is presented by the top portion for the polishing particles 27 for making to be fixed in Gold plated Layer 31, to adjust
When saving operation, polishing particles 27 are equably worn away, so as to extend the service life of polishing particles 27.
On the contrary, when the pore size for increasing mounting hole 25 is larger than the maximum gauge of polishing particles 27, then revealed in a manner of face
The quantity of the polishing particles 27 gone out will increase.
The mounting hole 25 formed on photosensitive film 23 can form one by the pattern in the hole formed on control light shield
A above pattern.
Stainless steel substrate can be used in base substrate 21.
Stainless steel substrate is used to form Gold plated Layer 31 and is fixed polishing particles 27 with material identical with regulator substrate 11.
In addition, the thickness by adjusting photosensitive film 23, to adjust the height that polishing particles 27 protrude from the upper side of Gold plated Layer 31
Degree.
In step S22, polishing particles 27 are inserted in mounting hole 25.It is inserted into after polishing particles 27, is plated by first time
Gold forms filled layer 28 to fill mounting hole 25.
Filled layer 28 is the position for fixing polishing particles 27.
Preferably, the thickness of filled layer 28 is no more than the thickness of mounting hole 25.
Filled layer 28 is preferably made of copper.Using copper facing only because its with aftermentioned Gold plated Layer 31 not jljl each other
Matter, but, filled layer 28 is not limited to copper.
The position of polishing particles 27 can be fixed by filled layer 28.It is preferable to use diamond particles for polishing particles 27.
In step S23, by second of gold-plated formation Gold plated Layer 31 to cover photosensitive film 23, filled layer 28 and grinding
The upper side of particle 27.
Gold plated Layer 31 is preferably made of nickel.There is metal-like to make beautiful appearance for nickel plating, and be easy to adjust thickness and
With heat resistance and wearability, and can easily adjust thickness keeps it uniform.
In step S24, base substrate 21 is removed.Then, remaining photosensitive film 23 in whole etching step S21.So
After etch and remove filled layer 28.
That is, removing base substrate 21, photosensitive film 23 and filled layer 28 successively.
After removing filled layer 28, spinning upside down makes Gold plated Layer 31 positioned at lower part and polishing particles 27 are located at top.
By step S24, protrusion 33 is formed at certain intervals in Gold plated Layer 31, and polishing particles 27 are fixed on to be formed
The position of protrusion 33.The polishing particles 27 for being fixed on protrusion 33 have certain height and its height identical.
The upper side of Gold plated Layer 31 is formed with protrusion 31a, and the protrusion 31a is located at and faces with what polishing particles 27 contacted
The part on boundary.Protrusion 31a is formed due to being filled with part Gold plated Layer 31 in mounting hole 25.
When 31 bottom surfaces of Gold plated Layer are flat, can integrally it be fixed in regulator substrate 11 using adhesive.Gold plated Layer 31
Bottom surfaces unevenness when, plane lapping manufacturing procedure can be increased to form flat plane.
That is, the upper side of the bottom surfaces for the Gold plated Layer 31 for being fixed with polishing particles 27 and regulator substrate 11 is passed through bonding
Agent is pasted, to which polishing particles 27 is fixed in regulator substrate 11.
It, can be by last gold-plated resistance to improve after Gold plated Layer 31 is fixed on regulator substrate 11 using adhesive
Corrosivity.For the purpose for improving corrosion resistance, finally gold-plated it is preferable to use cadmium plating (Cr).
Based on pad conditioner as described above manufacturing method manufacture pad conditioner 10, regulator substrate 11 it is upper
Portion face is formed with Gold plated Layer 31, and multiple polishing particles are equably protruded with more than one pattern and are formed in Gold plated Layer 31.
Moreover, the height for protruding from the top of the polishing particles 27 on 31 top of Gold plated Layer is identical.
[another embodiment]
As shown in figure 5, the manufacturing method of pad conditioner of the present invention, including：Photosensitive film 23 is laminated the bottom of at
On seat substrate 21, and the step S31 of multiple mounting holes 25 is formed by etch process on the photosensitive film 23；Described
It is inserted into polishing particles 27 in mounting hole 25, and carries out step that is gold-plated for the first time and forming the filled layer 28 for filling the mounting hole 25
Rapid S32；The step of removing the photosensitive film 23；It is gold-plated by second, supporting layer 29 is formed to cover the pedestal base
The step S33 of the surface of the upper side of plate 31 and the polishing particles 27；By third time it is gold-plated, formed Gold plated Layer 31 with
Cover the step S34 of the upper side of the supporting layer 29 and the polishing particles 27；Remove the base substrate 21, the support
Layer 29 and the filled layer 28, the step S35 for making the polishing particles 27 partly expose.To be formed for fixing abrasive grains
The Gold plated Layer 31 of son 27.
Difference lies in remove photosensitive film 23 to another embodiment before forming Gold plated Layer 31 compared with another embodiment
Afterwards, it is further formed for after the supporting layer 29 to extend filled layer 28, forming the Gold plated Layer 31 for fixing polishing particles 27.
In step S31, photosensitive film 23 is layered on base substrate 21.It is formed in the upper side of base substrate 21
In photosensitive film 23, the photosensitive film 23 of the hole corresponding position for being inserted into polishing particles 27 is etched.
The etching of photosensitive film 23 preferably carries out photoetching by covering light shield into irradiation ultraviolet light.
That is, light shield can be with multiple regular hexagons, circle or quadrangle form hole, and in exposed photosensitive film
Ultraviolet light passes through the photosensitive film of light shield hole irradiation position, and the part not exposed by etching removal.
Therefore, etched photosensitive film 23 forms the space of positive six side property, circle or quadrangle form, to feel
Multiple mounting holes 25 are formed on photosensitiveness film 23.
Preferably, mounting hole 25 has the shape of the maximum gauge more than or equal to polishing particles 27.
When mounting hole 25 is identical with the size of polishing particles 27, polishing particles 27 easily, equably can maintain to be inserted into
In the state of mounting hole 25.
When reducing the pore size of mounting hole 25, polishing particles 27 can be exposed with line/point mode.
That is, point or threadiness is presented by the top portion for the polishing particles 27 for making to be fixed in Gold plated Layer 31, to adjust
When saving operation, polishing particles 27 are equably worn away, so as to extend the service life of polishing particles 27.
On the contrary, the pore size for increasing mounting hole 25 is larger than the maximum gauge of polishing particles 27, then exposed in a manner of face
The quantity of polishing particles 27 will increase.
The mounting hole 25 formed on photosensitive film 23 can form one by the pattern in the hole formed on control light shield
A above pattern.
Stainless steel substrate can be used in base substrate 21.
Stainless steel substrate is used to form Gold plated Layer 31 and is fixed polishing particles 27 with material identical with regulator substrate 11.
In addition, the thickness by adjusting photosensitive film 23, to adjust the height that polishing particles 27 protrude from 31 upper side of Gold plated Layer.
In step S32, polishing particles 27 are inserted in mounting hole 25.It is inserted into after polishing particles 27, is plated by first time
Gold forms filled layer 28 to fill mounting hole 25.
Filled layer 28 is preferably made of copper.It is gold-plated using copper only because its with aftermentioned Gold plated Layer 31 not jljl each other
Matter, but, the material of filled layer 28 is not limited to copper.
The position of polishing particles 27 can be fixed by filled layer 28.It is preferable to use diamond particles for polishing particles 27.
In step S33, etches and remove photosensitive film 23.
In step S34, by second of gold-plated formation supporting layer 29 with the upper side and abrasive grains of covering base substrate 21
A part for the side of son 27.
Supporting layer 29 is by carrying out expansion formation to filled layer 28.Supporting layer 29 preferably uses identical as filled layer 28
Copper and constitute.
By adjusting the thickness of filled layer 28 and supporting layer 29, the grinding for the upper side for protruding from Gold plated Layer 31 can be adjusted
The protrusion height of particle 27.The thickness of supporting layer 29 is equivalent to the estimated protrusion height of polishing particles 27.
Supporting layer 29 is layered on filled layer 28 and is formed two-layer structure and facing positioned at polishing particles 27 and supporting layer 29
Therefore boundary position compared to other positions of supporting layer 29, has thicker thickness.Thicker critical position makes aftermentioned gold-plated
31 upper side of layer form recessed portion 35.
In step S35, by the gold-plated formation Gold plated Layer 31 of third time to cover the top of supporting layer 29 and polishing particles 27
Face.
Gold plated Layer 31 is different material with supporting layer 29.
Gold plated Layer 31 is preferably made of nickel.There is metal-like to make beautiful appearance for nickel plating, and be easy to adjust thickness and
With heat resistance and wearability, and can easily adjust thickness keeps it uniform.
In step S36, base substrate 21 is removed.
After removing base substrate 21, spinning upside down makes Gold plated Layer 31 positioned at lower part and supporting layer 29 and filled layer 28 are located at
Top.
In step S37, etches and remove supporting layer 29 and filled layer 28.Supporting layer 29 and filled layer 28 are same substance,
Therefore it can disposably be removed by etching.
By step S37, polishing particles 27 are protruded and are fixed in Gold plated Layer 31 at certain intervals.It is fixed on Gold plated Layer 31
Polishing particles 27 have certain height and its height identical.
The protrusion degree of state based on 31 bottom surfaces of Gold plated Layer and the polishing particles 27 being fixed in Gold plated Layer 31, can be into
Row is further gold-plated to expand Gold plated Layer 31.It is further gold-plated that substance identical with Gold plated Layer 31 can be used, it can also use
Different material is to improve durability.
When 31 bottom surfaces of Gold plated Layer are flat, can integrally it be fixed in regulator substrate 11 using adhesive.Gold plated Layer 31
Bottom surfaces unevenness when, plane lapping manufacturing procedure can be increased to form flat plane.
That is, the upper side of the bottom surfaces for the Gold plated Layer 31 for being fixed with polishing particles 27 and regulator substrate 11 is passed through bonding
Agent is pasted, to which polishing particles 27 is fixed in regulator substrate 11.
The manufacturing method for the pad conditioner that another embodiment is related to, by the thickness for adjusting filled layer 28 and supporting layer 29
Degree, can adjust the height that polishing particles 27 protrude from the top of Gold plated Layer 31.
Based on pad conditioner as described above manufacturing method manufacture pad conditioner 10, regulator substrate 11 it is upper
Portion face is formed with Gold plated Layer 31, and multiple polishing particles are equably protruded with more than one pattern and are formed in Gold plated Layer 31.
It is formed with recessed portion 35 on the critical position that the upper side of Gold plated Layer 31 is contacted with polishing particles 27.
By the further surface gold-plating of the upper side progress in Gold plated Layer 31, the sunk part of recessed portion 35 can be filled
To remove recessed portion 35.
In addition, the height of the top of polishing particles 27 is consistent, and protruded to 31 top of Gold plated Layer.
The manufacturing method of the pad conditioner of one embodiment, another embodiment and another embodiment, passes through adjusting
The thickness of 23 thickness of photosensitive film or filled layer 28, supporting layer 29 can adjust polishing particles 27 and protrude from Gold plated Layer 31
The height on top.
In addition, being formed in the sectional hole patterns on light shield by control, the installation being formed on photosensitive film 23 can be controlled
The pattern in hole 25, and the polishing particles 27 for protruding from the upper side of Gold plated Layer 31 is made to can make up more than one pattern.
In addition, the protrusion height for the polishing particles 27 being separately fixed in respective Gold plated Layer 31 is identical.
In addition, the height for protruding from the top of the polishing particles 27 on 31 top of Gold plated Layer is identical.
In addition, being separately fixed at the polishing particles 27 of respective Gold plated Layer 31, it is of the same size and with identical
Every arrangement.
Based on foregoing description the surface of liner can be equably adjusted when carrying out liner adjusting operation.
The scope of the present invention is not limited to the above embodiment, and from the definition of its claims.The present invention
The technical staff with common sense of technical field can based on claims record right in into
Row various changes and modifications, this is obvious.
Claims (10)
1. a kind of manufacturing method of pad conditioner, including：
Stacking photosensitive film forms multiple mounting holes on base substrate, and by etch process on the photosensitive film
The step of；
It is inserted into polishing particles in the mounting hole, and carries out gold-plated for the first time and forms filled layer to fill the mounting hole
Step；
By second of gold-plated formation Gold plated Layer to cover the upper of the photosensitive film, the filled layer and the polishing particles
The step of portion face；
After removing the base substrate and removing the photosensitive film, the filled layer is removed, makes the part polishing particles
The step of exposing.
2. the manufacturing method of pad conditioner as described in claim 1, which is characterized in that
There is the Gold plated Layer that the part polishing particles expose to be fixed on the machined surface of regulator substrate by adhesive.
3. the manufacturing method of pad conditioner as described in claim 1, which is characterized in that
The filled layer and the Gold plated Layer are different materials.
4. a kind of pad conditioner manufactured by method described in claim 1, which is characterized in that
Multiple polishing particles are equably protruding in the Gold plated Layer, the upper side of the Gold plated Layer connects with the polishing particles
It is formed with protrusion on tactile part.
5. a kind of manufacturing method of pad conditioner, including：
Stacking photosensitive film forms multiple mounting holes on base substrate, and by etch process on the photosensitive film
The step of；
It is inserted into polishing particles in the mounting hole, and carries out gold-plated for the first time and forms the filled layer for filling the mounting hole
Step；
The step of removing the photosensitive film；
It is gold-plated by second, supporting layer is formed to cover the upper side of the base substrate and the part side of the polishing particles
The step of face；
It is gold-plated by third time, the step of forming upper side of the Gold plated Layer to cover the supporting layer and the polishing particles；
The step of removing the base substrate, the supporting layer and the filled layer, the polishing particles made partly to expose.
6. the manufacturing method of pad conditioner as claimed in claim 5, which is characterized in that
The Gold plated Layer that the polishing particles partly expose is fixed on by adhesive on the machined surface of regulator substrate.
7. the manufacturing method of pad conditioner as claimed in claim 5, which is characterized in that
The supporting layer and the filled layer are identical substances.
8. the manufacturing method of pad conditioner as claimed in claim 5, which is characterized in that
The Gold plated Layer is different substance with the supporting layer and filled layer.
9. the adjuster that a kind of method by described in claim 5 manufactures, which is characterized in that
Multiple polishing particles are equably protruding in the Gold plated Layer, the upper side of the Gold plated Layer is contacted with the polishing particles
Part on be formed with recessed portion.
10. adjuster as claimed in claim 9, which is characterized in that
Further surface gold-plating is carried out in the upper side of the Gold plated Layer, and removes the recessed portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140034834A KR101558449B1 (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of pad conditioner |
| KR10-2014-0034834 | 2014-03-25 | ||
| PCT/KR2014/010798 WO2015147401A1 (en) | 2014-03-25 | 2014-11-11 | Method for manufacturing pad conditioner and pad conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105940484A CN105940484A (en) | 2016-09-14 |
| CN105940484B true CN105940484B (en) | 2018-10-16 |
Family
ID=54195877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480074561.4A Active CN105940484B (en) | 2014-03-25 | 2014-11-11 | Pad conditioner manufacturing method and pad conditioner |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101558449B1 (en) |
| CN (1) | CN105940484B (en) |
| MY (1) | MY187700A (en) |
| SG (1) | SG11201606279YA (en) |
| WO (1) | WO2015147401A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107336148A (en) * | 2017-08-01 | 2017-11-10 | 华侨大学 | A kind of quick method for preparing abrasive particle pattern distribution mill |
| CN107336150A (en) * | 2017-08-01 | 2017-11-10 | 华侨大学 | A kind of method that deposition prepares abrasive particle pattern distribution mill |
| KR102013386B1 (en) * | 2018-01-29 | 2019-08-22 | 새솔다이아몬드공업 주식회사 | Manufacturing method of pad conditioner by reverse plating and pad conditioner thereof |
| CN112189062A (en) | 2018-05-22 | 2021-01-05 | 帝国离子株式会社 | Wear-resistant coating film, wear-resistant member, method for producing wear-resistant coating film, and sliding mechanism |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040094914A (en) * | 2003-05-06 | 2004-11-12 | (주)디디다이아 | Method of fabricating a chemical mechanical polishing pad conditioner using ceramic material and chemical mechanical polishing pad conditioner fabricated thereby |
| KR20090078647A (en) * | 2008-01-15 | 2009-07-20 | 이화다이아몬드공업 주식회사 | Conditioner for chemical mechanical planarization pad. |
| KR20120011713A (en) * | 2010-07-30 | 2012-02-08 | 신한다이아몬드공업 주식회사 | Cmp pad conditioner and its manufacturing method |
| JP2013123771A (en) * | 2011-12-14 | 2013-06-24 | Ｄ．Ｎ．Ａ．メタル株式会社 | Cmp pad conditioner, and method for manufacturing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007260886A (en) * | 2006-03-30 | 2007-10-11 | Mitsubishi Materials Corp | Cmp conditioner and manufacturing method therefor |
| KR20110124988A (en) * | 2010-05-12 | 2011-11-18 | 신한다이아몬드공업 주식회사 | Cmp pad conditioner and its manufacutring method |
-
2014
- 2014-03-25 KR KR1020140034834A patent/KR101558449B1/en active IP Right Grant
- 2014-11-11 CN CN201480074561.4A patent/CN105940484B/en active Active
- 2014-11-11 MY MYPI2016702816A patent/MY187700A/en unknown
- 2014-11-11 WO PCT/KR2014/010798 patent/WO2015147401A1/en active Application Filing
- 2014-11-11 SG SG11201606279YA patent/SG11201606279YA/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040094914A (en) * | 2003-05-06 | 2004-11-12 | (주)디디다이아 | Method of fabricating a chemical mechanical polishing pad conditioner using ceramic material and chemical mechanical polishing pad conditioner fabricated thereby |
| KR20090078647A (en) * | 2008-01-15 | 2009-07-20 | 이화다이아몬드공업 주식회사 | Conditioner for chemical mechanical planarization pad. |
| KR20120011713A (en) * | 2010-07-30 | 2012-02-08 | 신한다이아몬드공업 주식회사 | Cmp pad conditioner and its manufacturing method |
| JP2013123771A (en) * | 2011-12-14 | 2013-06-24 | Ｄ．Ｎ．Ａ．メタル株式会社 | Cmp pad conditioner, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| MY187700A (en) | 2021-10-12 |
| KR20150111202A (en) | 2015-10-05 |
| KR101558449B1 (en) | 2015-10-07 |
| SG11201606279YA (en) | 2016-09-29 |
| WO2015147401A1 (en) | 2015-10-01 |
| CN105940484A (en) | 2016-09-14 |
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