CN107336148A - A kind of quick method for preparing abrasive particle pattern distribution mill - Google Patents

A kind of quick method for preparing abrasive particle pattern distribution mill Download PDF

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Publication number
CN107336148A
CN107336148A CN201710647441.4A CN201710647441A CN107336148A CN 107336148 A CN107336148 A CN 107336148A CN 201710647441 A CN201710647441 A CN 201710647441A CN 107336148 A CN107336148 A CN 107336148A
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CN
China
Prior art keywords
abrasive particle
paper
cover layer
mill
temporary cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201710647441.4A
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Chinese (zh)
Inventor
黄国钦
刘琼
穆德魁
黄辉
郭桦
徐西鹏
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Huaqiao University
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Huaqiao University
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Publication date
Application filed by Huaqiao University filed Critical Huaqiao University
Priority to CN201710647441.4A priority Critical patent/CN107336148A/en
Publication of CN107336148A publication Critical patent/CN107336148A/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The invention provides a kind of quick method for preparing abrasive particle pattern distribution mill, and described mill is including but not limited to emery wheel, emery wheel, drill bit, end-face grinding plate, roller, trimmer, CMP pad dresser, mill pad, is comprised the steps of:1) the bonding agent thickness according to needed for determines the thickness of temporary cover layer;2) hollow processing is carried out to temporary cover layer according to the distribution of abrasive particle pattern;3) temporary cover layer is overlying on grinding disc substrate;4) abrasive particle and bonding agent are filled into hollow part;5) abrasive particle is fixed on matrix, including following two methods:5.1) temporary cover layer is first removed, heating makes abrasive particle be fixed on matrix;5.2) temporary cover layer together heats with abrasive particle, after abrasive particle is fixed on matrix, removes temporary cover layer.

Description

A kind of quick method for preparing abrasive particle pattern distribution mill
Technical field
The present invention relates to grinding-material field, more particularly to the method that can quickly prepare abrasive particle pattern distribution mill.
Background technology
Grinding is the main processing mode that machine components precise forming obtains with high-quality surface, is widely used in gold The high-efficiency and precision processing of the materials such as category, ceramics, optical crystal.For grinding, emery wheel is to work after process and processing Part surface quality and processing cost are particularly important, are to form the efficient, key of accurate grinding technology.Due to grinding skill actually It is that the micro removal of material is processed so as to realize that the whole removing of workpiece material is removed by being fixed on numerous abrasive materials of grinding wheel surface, Therefore the distribution of grinding wheel surface abrasive particle is huge to emery wheel performance impact.All the time, people all make great efforts how cause abrasive material or The micro- abrasive particle group energy of person is enough to be distributed in grinding wheel surface according to certain mode, to ensure uniformly undertake cutting load between abrasive particle Lotus, so as to effectively improve the grinding performance of abrasive particle, as disclosed a kind of base in Chinese invention patent publication number CN1528565A In the abrasive material technology of preparing with pattern optimization of shell membrane cloth, Chinese invention patent CN101073882 discloses a kind of abrasive material three Tie up optimized controllable arranged plating tool preparation method of multilayer etc..These methods are from different aspect for abrasive particle pattern arrangement emery wheel The arrangement implementation issue of abrasive material in making is broken through, but made instrument still differs very with expected purpose of design Far.To find out its cause, be existing method mostly just for abrasive grain placement mode, and have ignored high-performance emery wheel another is heavy Want problem --- emery wheel contour accuracy problem.The high accuracy of emery wheel profile is the basic guarantee of high-precision workpiece shaping, but is tied The influence of mixture layer thickness is very big.CN105965408A discloses a kind of preparation method of single layer of abrasive particles emery wheel, and its core point exists In by runout compensation mechanism indirect control bonding agent even application, to solve the high sex chromosome mosaicism such as abrasive particle, but its equipment is complicated, It is cumbersome.On the other hand, existing mesh screen, orifice plate, template material are mainly metal, ceramics etc., and cost is high and hardly possible is processed, Patterns of arranging are few, and are only to play a part of dynamic abrasive grain locations limitation, do not play control bonding agent thickness Effect.
The content of the invention
Present invention aims at provide one kind can convenient and efficient realize abrasive particle positioning and can realize bonding agent thickness control Abrasive particle pattern distribution mill prepare method.
The present invention is achieved by the following technical solutions:
A kind of quick method for preparing abrasive particle pattern distribution mill, comprises the following steps:
1) thickness of bonding agent layer determines the thickness of temporary cover layer needed for first;
2) hollow out is carried out to temporary cover layer according to abrasive grain placement pattern, i.e., the position of abrasive particle will be being set to carry out hollow out Processing;
3) temporary cover layer after hollow processing is adhered on abrasive wheel substrate;
4) hollow part of temporary cover layer is inserted after being sufficiently mixed bonding agent and abrasive particle, is formed and abrasive grain placement pattern one The hollow out packed layer of cause, and make it that packed layer is concordant with temporary cover layer outer, to reach by temporary cover layer thickness to control The effect of packed layer thickness processed, bonding agent first can also be inserted into hollow part and form bonding agent layer, then in abrasive particle is packed into, Abrasive particle first can be inserted into hollow part, then by bonding agent insert to;
5) after the drying of hollow out packed layer, temporary cover layer is removed, the matrix with hollow out packed layer is carried out at heating Abrasive particle, is securely attached on matrix by reason by bonding agent, stops heating and required abrasive material pattern arrangement is obtained after cooling down Mill;Matrix with temporary cover layer can also be heated, during this period, on the one hand will be ground by bonding agent Grain is securely attached on matrix, and another aspect temporary cover layer disappears or softened in heating process ablation, is stopped heating and is removed Temporary cover layer obtains required abrasive particle pattern arrangement mill
Among a preferred embodiment, the abrasive particulate material include be not limited to diamond, cubic boron, zirconium oxide, Aluminum oxide, hard alloy, silicon nitride, carborundum, a diameter of 1-2000um.
Among a preferred embodiment, the bonding agent is the fusible metal alloy solder of heating, and its component is at least Including one kind in chromium (Cr), cobalt (Co), titanium (Ti), iron (Fe), aluminium (Al) metallic element;The metal alloy solder include but It is not limited to NiCrP, NiCrBSi, AgCuTi, CuSnTi, FeCoNi, SnTi.
Among a preferred embodiment, described matrix is metal, or ceramics, or composite.
Among a preferred embodiment, the temporary cover layer is made up of plane materiel, not dry mucigel, and base stock.
In a preferred embodiment, the facestock material includes but is not limited to:Art paper, PVC, PET, laser paper are resistance to Warm paper, polypropylene, makrolon, brown paper, fluorescent paper, gold-plated paper, silver-plated paper, synthetic paper, aluminium-foil paper, fragile paper, cheque paper, U.S. line paper, cloth millimeter paper, iridescent paper, sandwich art paper, heat-sensitive paper;The plane materiel thickness is 25-500um;
The viscose has an adhesive layer by layer, and the adhesive can be acrylic based emulsion, or PUR, or rubber base class breast Glue, or solvent-type acrylic;
The base stock be scribble silicon protection base stock, can be Ge Laxin paper, garlic skin paper, brown paper, polyester pet, art paper, Polyethylene, plastic sheeting.
Beneficial effects of the present invention are:1) the hollow processing cost of temporary cover layer and its pattern is low and speed is fast.2) Abrasive particle surface pattern is changed freely.3) thickness subsequently filled can be determined according to the thickness of temporary cover layer, so as to control The contour of bonding agent.
Brief description of the drawings
Fig. 1 is temporary cover layer cross-sectional view;
Fig. 2 is hollow out temporary cover layer cross-sectional view;
Fig. 3 is adhered to cross-sectional view on matrix for temporary cover layer after hollow out;
Fig. 4 is that filling finishes mixture and abrasive particle cross-sectional view;
Fig. 5 is removal temporary cover layer schematic diagram;
Fig. 6 is another embodiment temporary cover layer cross-sectional view;
Fig. 7 is another embodiment hollow out temporary cover layer cross-sectional view;
Fig. 8 is another embodiment hollow out temporary cover layer adhesive matrix cross-sectional view;
Fig. 9 is that another embodiment fills bonding agent schematic diagram;
Figure 10 is that another embodiment fills abrasive particle schematic diagram;
Figure 11 is that another embodiment removes schematic diagram after temporary cover layer.
Embodiment
In order that technical solution of the present invention is clearer, now the present invention is done further specifically with accompanying drawing in conjunction with the embodiments It is bright:
As Figure 1-5, the present invention is a kind of method that can quickly prepare abrasive particle pattern and be distributed mill to embodiment one, main Want process as follows:
As shown in Figure 1, it is first determined temporary cover layer 1, in the present embodiment, temporary cover layer are formed by 3 layers, are respectively Plane materiel 11, its material are art paper, and glue-line 12 has an adhesive, and material is acrylic based emulsion, base stock 13, to scribble silicon coating Lattice Racine paper, in other embodiments, plane materiel 11 can be PVC, PET, laser paper, heatproof paper, polypropylene, makrolon, ox Mulberry paper, fluorescent paper, gold-plated paper, silver-plated paper, synthetic paper, aluminium-foil paper, fragile paper, cheque paper, U.S. line paper, cloth millimeter paper, iridescent paper, folder Heart art paper, heat-sensitive paper;The plane materiel thickness is 25-500um;
The adhesive of the mucigel 12 can be PUR in other embodiments, or rubber base class latex, or solvent-borne type Acrylic acid;
The base stock 13 can be garlic skin paper, brown paper, polyester pet, art paper, polyethylene, plastics in other embodiments Film.
The thickness of the temporary cover layer 1 is that the thickness of the bonding agent layer according to needed for follow-up determines, in the present embodiment In, the plane materiel thickness of temporary cover layer 1 is 0.125mm.
Afterwards as shown in Fig. 2 carrying out hollow processing on temporary cover layer 1, the insertion plane materiel 11 of hollow space 2, glue-line 12, Base stock 13.Then as shown in figure 3, base stock 13 is removed, the temporary cover layer 1 Jing Guo hollow processing is then adhered to emery wheel base On body 3, in the present embodiment, the abrasive wheel substrate 3 is No. 45 steel, in other embodiments, the material of matrix 3 can be ceramics or Composite.
Afterwards as shown in figure 4, inserting hollow part 2 after bonding agent 41 is mixed with abrasive particle 42, packed layer is formed, and cause Packed layer is concordant with the outer of temporary cover layer 1, so as to realize the distribution of abrasive particle pattern and can be controlled by temporary cover layer The effect of bonding agent layer thickness, the bonding agent 41 are the metal alloy solder that can melt of heating, its component comprise at least chromium, One kind in cobalt, titanium, iron, Al metal alloy, in the present embodiment, the bonding agent 41 are NiCrP.Abrasive particle 42 is in the present embodiment In be diamond particles, a diameter of 250-350um, in other embodiments, abrasive particle can be square boron carbide, zirconium oxide, aluminum oxide, Hard alloy, silicon nitride, carborundum, a diameter of 1-2000um.
As shown in figure 5, after the packed layer of hollow part is dried, temporary cover layer 1 is removed, the matrix with packed layer is entered Row is heated to 970-1050 degrees Celsius and is incubated 5-10 minutes, and abrasive particle is securely attached on matrix by bonding agent, stops Heat and the mill of institute's abrasive particle pattern arrangement is obtained after cooling down.Mill abrasive particle contour according to obtained by this method is than tradition Method improves at least 23%.
As illustrated in figs. 6-11, in the present embodiment, the plane materiel 11 of temporary cover layer 1 is polyester film (PET) to embodiment two, other With embodiment one;Matrix material is 40CrMo steel.
Such as Fig. 6, shown in Fig. 7, temporary cover layer 1 is taken to carry out hollow processing, the thickness of temporary cover layer plane materiel 11 is 0.150mm, laser engraving hollow processing is carried out to temporary cover layer 1 according to the arrangement of default abrasive particle pattern, afterwards such as Fig. 8 institutes Show, remove base stock 13 and the temporary cover layer 1 after hollow out is adhered on matrix 3.
As shown in figure 9, bonding agent 41 is first inserted into hollow part, and form the hollow out filling consistent with abrasive grain placement pattern Layer, and outer is concordant with temporary cover layer 1, and in the present embodiment, bonding agent 41 is AgCuTi, afterwards as Figure 10 covers abrasive particle 42 Cover on populated bonding agent 41, in the present embodiment, abrasive particle 42 is CBN, a diameter of 140-255um.
After last layer to be filled is dried, temporary cover layer 1 will be carried, the matrix of bonding agent 41 and the packed layer of abrasive particle 42 enters Row is heated to 890 degrees Celsius and is incubated processing in 15 minutes, and abrasive particle is securely attached on matrix by bonding agent, stops heating And just obtain mill such as Figure 11 that required pattern is arranged after temporary cover layer 1 is removed after cooling down.

Claims (10)

1. a kind of quick method for preparing abrasive particle pattern distribution mill, described mill is including but not limited to emery wheel, emery wheel, brill Head, end-face grinding plate, roller, trimmer, CMP pad dresser, mill pad, it is characterised in that comprise the steps of:
1) the bonding agent thickness according to needed for determines the thickness of temporary cover layer;
2) hollow processing is carried out to temporary cover layer according to the distribution of abrasive particle pattern;
3) temporary cover layer is overlying on grinding disc substrate;
4) abrasive particle and bonding agent are filled into hollow part;
5) abrasive particle is fixed on matrix, including following two methods:
5.1) temporary cover layer is first removed, heating makes abrasive particle be fixed on matrix;
5.2) temporary cover layer together heats with abrasive particle, after abrasive particle is fixed on matrix, removes temporary cover layer.
2. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:Ground in step 4) Grain is filled into hollow part after being mixed with bonding agent, volume is 0-50% after abrasive particle accounts for mixing.
3. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:In step 4), Bonding agent is first filled into hollow part, afterwards in filling abrasive particle.
4. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:In step 4), Abrasive particle is first implanted into hollow part, refills into bonding agent.
5. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:The bonding agent is Fusible metal alloy solder is heated, its component comprises at least chromium (Cr), cobalt (Co), titanium (Ti), iron (Fe), aluminium (Al) metal One kind in element;The metal alloy solder includes but is not limited to NiCrP, NiCrBSi, AgCuTi, CuSnTi, FeCoNi, SnTi。
6. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:Described matrix is gold Category, or ceramics, or composite.
7. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:The interim covering Layer is made up of plane materiel, not dry mucigel, and base stock.
8. the method as claimed in claim 7 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:The facestock material Including but not limited to:Art paper, PVC, PET, laser paper, heatproof paper, polypropylene, makrolon, brown paper, fluorescent paper are gold-plated Paper, silver-plated paper, synthetic paper, aluminium-foil paper, fragile paper, cheque paper, U.S. line paper, cloth millimeter paper, iridescent paper, sandwich art paper, heat-sensitive paper; The plane materiel thickness is 25-500um;
The viscose has an adhesive layer by layer, and the adhesive can be acrylic based emulsion, or PUR, or rubber base class latex, Or solvent-type acrylic;
The base stock is the base stock for scribbling silicon protection, can be Ge Laxin paper, garlic skin paper, brown paper, polyester pet, art paper, poly- second Alkene, plastic sheeting.
9. the method as claimed in claim 1 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:The abrasive particulate material Including being not limited to diamond, cubic boron, zirconium oxide, aluminum oxide, hard alloy, silicon nitride, carborundum.
10. the method as claimed in claim 9 for quickly preparing abrasive particle pattern distribution mill, it is characterised in that:The abrasive particle is straight Footpath is 1-2000um.
CN201710647441.4A 2017-08-01 2017-08-01 A kind of quick method for preparing abrasive particle pattern distribution mill Withdrawn CN107336148A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022106040A1 (en) * 2020-11-23 2022-05-27 August Rüggeberg Gmbh & Co. Kg Method for producing a grinding tool, and grinding tool

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JP2004082323A (en) * 2002-06-26 2004-03-18 Ricoh Co Ltd Grinding tool and manufacturing method therefor
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US20130267154A1 (en) * 1997-04-04 2013-10-10 Chien-Min Sung Diamond tools and methods for making the same
CN103465155A (en) * 2013-09-06 2013-12-25 蓝思科技股份有限公司 Epoxy resin type diamond grinding pad and manufacturing method thereof
CN104128880A (en) * 2014-07-21 2014-11-05 蓝思科技股份有限公司 Grinding pad special for modified epoxy resin type ceramic and preparation method thereof
CN205439485U (en) * 2016-01-08 2016-08-10 北京格灵深瞳信息技术有限公司 Install template fast
CN105940484A (en) * 2014-03-25 2016-09-14 谢索尔钻石工业株式会社 Method for manufacturing pad conditioner and pad conditioner
CN106826601A (en) * 2017-01-26 2017-06-13 北京清烯科技有限公司 The method of CMP pad dresser of the manufacture with bitellos monocrystalline
CN106826600A (en) * 2017-01-26 2017-06-13 福建自贸试验区厦门片区展瑞精芯集成电路有限公司 The manufacture method of the big diamond monocrystalline cmp trimmer of combined type

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DD142310A1 (en) * 1979-03-08 1980-06-18 Manfred Auerswald DIAMOND-COATED CUTTING TOOL AND METHOD FOR THE PRODUCTION THEREOF
DE2918103A1 (en) * 1979-05-04 1980-11-13 Sia Schweizer Schmirgel & Schl ABRASIVES ON A FLEXIBLE BASE
US20130267154A1 (en) * 1997-04-04 2013-10-10 Chien-Min Sung Diamond tools and methods for making the same
CN1196518A (en) * 1997-04-11 1998-10-21 王智信 Manufacturing method for computer mouse with colour or pattern
EP1331064A1 (en) * 2002-01-25 2003-07-30 WENDT GmbH Method to manufacture a grinding tool with galvanically bonded abrasive bodies
JP2004082323A (en) * 2002-06-26 2004-03-18 Ricoh Co Ltd Grinding tool and manufacturing method therefor
CN1586917A (en) * 2004-09-23 2005-03-02 上海复旦天臣新技术有限公司 Composite film with reflecting holographic and angular color change information double property
CN101124066A (en) * 2004-12-20 2008-02-13 3M创新有限公司 Abrasive product, method of making and using the same, and apparatus for making the same
KR20060108328A (en) * 2005-04-12 2006-10-17 신한다이아몬드공업 주식회사 Diamond tool manufacturing method and diamond tool made of the method
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CN103465155A (en) * 2013-09-06 2013-12-25 蓝思科技股份有限公司 Epoxy resin type diamond grinding pad and manufacturing method thereof
CN105940484A (en) * 2014-03-25 2016-09-14 谢索尔钻石工业株式会社 Method for manufacturing pad conditioner and pad conditioner
CN104128880A (en) * 2014-07-21 2014-11-05 蓝思科技股份有限公司 Grinding pad special for modified epoxy resin type ceramic and preparation method thereof
CN205439485U (en) * 2016-01-08 2016-08-10 北京格灵深瞳信息技术有限公司 Install template fast
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022106040A1 (en) * 2020-11-23 2022-05-27 August Rüggeberg Gmbh & Co. Kg Method for producing a grinding tool, and grinding tool

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Application publication date: 20171110