JP2004082323A - Grinding tool and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding tool which can be easily fabricated at low cost and obtain stably an extremely superior scratch-free mirror surface of a nanometer order by inducing a chip and a worn-out abrasive grain into a concavity on a film surface and securely discharging them and a manufacturing method therefor. <P>SOLUTION: The grinding tool has a grinding layer which is formed by preparing minute particles being primary particles composed of ultrafine particles, combining them partially with space each other to form secondary particles, and then fixing the secondary particles in a granular shape as the abrasive grains 2 on a base material 12 by a binder. The grinding layer is divided into a large number of blocks having a certain shape at regular intervals, and has a lattice shape pattern with concave grooves between the blocks. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a polishing tool for finishing hard brittle materials such as silicon and glass and metal materials such as steel and aluminum and a method of manufacturing the same, and particularly, guarantees high quality processing of a large-diameter processing object, The present invention relates to a polishing tool for improving processing efficiency and a method for manufacturing the same.
[0002]
[Prior art]
Polishing using an abrasive slurry has been used for the final finishing of components made of various hard and brittle materials and metal materials, including silicon wafers and glass disks. However, this polishing requires a large amount of an abrasive slurry, and a large amount of waste liquid is discharged, so that the burden on the environment is extremely high, and there is a limit in improving the processing efficiency. For this reason, development of fixed abrasive processing tools capable of obtaining excellent finished surface roughness equivalent to polishing finish has been actively conducted in various fields. In order to obtain good machined surface roughness in abrasive grain machining, it is usually advantageous to use fine abrasive grains, as is the case with fixed abrasive machining tools.
[0003]
However, in order to obtain an excellent machined surface such as a mirror surface, if abrasive grains with a grain size of several μm or less are used in a fixed-abrasive machining tool, contact between the abrasive binder and the workpiece tends to occur during machining, and as a result Then, a sharp increase in the processing resistance, the drop of the abrasive grains, etc. occur, and in the worst case, the state falls into a state where the processing is impossible. Further, clogging due to chips or the like not only lowers the processing efficiency, but also causes scratches, scratches, and the like on the obtained mirror surface again.
[0004]
In order to solve the above problem, there is the following prior art.
There is a fixed abrasive processing tool that uses agglomerated powder as abrasive grains by granulating fine abrasive grains, and there is a polishing tool in which the aggregated abrasive grains are fixed on a base material with a binder resin. In the abrasive grain machining tool, excellent machining surface roughness is obtained by the action of fine abrasive grains, and at the same time, high machining efficiency is achieved by the aggregated abrasive grains.
Further, in the aggregated abrasive grains, since the wear of the abrasive grains gradually progresses, the chips are also discharged at the same time as the wear of the abrasive grains, so as to avoid clogging (see Patent Document 1).
[0005]
FIG. 12 is an enlarged cross-sectional view of a conventional polishing tool.
As shown in FIG. 12, the polishing tool has a configuration in which the abrasive grains 2 are fixed on the base material 12 by the binder 11, but the abrasive grains 2 are securely fixed on the base material 12, and are still projected from the binder 11. You need to guarantee the quantity. In addition, the portion of the binder around the abrasive grains serves as a storage location for the discharged chips 21 and the worn abrasive grains 2.
[0006]
In response to this issue, especially regarding the solution of the chip emission problem,
The present invention relates to an invention in which an uneven portion such as on a plurality of donut is provided, a polishing layer is formed on the convex portion, and the concave portion is made into a chip pocket for chip discharge. A dome, donut or block shape having irregularities is formed by a convection cell generated in a process of evaporating a solvent in a dryer (see Patent Document 2).
[0007]
[Patent Document 1]
Japanese Patent Application No. 2000-190228
[Patent Document 2]
Japanese Patent No. 30121261
[0008]
[Problems to be solved by the invention]
However, in the conventional polishing tool, as shown in FIG. 12, the area of the chip pockets between the abrasive grains is small, and when the chips overflow with the progress of the processing, scratches or the like are again applied to the workpiece. There is a risk of having an adverse effect. In particular, if the workpiece has a large diameter, it becomes more difficult to discharge chips, and this adverse effect becomes more remarkable. As another problem, when the processing pressure applied to the processing surface of the processing target needs to be set to a constant value, if the processing target becomes larger in diameter, the applied load is set higher. Therefore, it is necessary to increase the size of the processing machine itself.
[0009]
Furthermore, in the convection cell described in Patent Literature 2, it is difficult to connect the chip pockets like grooves, and it is very difficult for chips to accumulate in the pockets and be discharged out of the polishing tool or tape. Conceivable. Therefore, the chips and the like accumulated in the pockets are very likely to cause processing damage such as scratches on the surface of the workpiece again. Further, it is difficult to control the height, shape, size, and the like of the unevenness only by the method of manufacturing the convection cell.
[0010]
The present invention has been made in view of such a problem, and a polishing layer fixed on a base material with a binder is divided into a plurality of blocks having a constant shape at regular intervals, and the polishing is performed in a lattice shape. Focusing on the polishing characteristics of the tool, chips and worn abrasive grains are reliably discharged from the processing point to obtain a scratch-free and excellent surface quality of nanometer order, It is an object of the present invention to provide a polishing tool that can achieve extremely high processing efficiency without increasing the size of a processing apparatus for an object, and that can be manufactured inexpensively and easily, and a method of manufacturing the same.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the polishing tool according to claim 1, wherein the secondary particles formed by aggregating a large number of primary particles are subjected to heat treatment at a temperature at which a neck is formed at a bonding point between the primary particles, Polishing in which a large number of primary particles are fixed partially on a base material with a binder by using abrasive grains made of a granular porous material that are bonded together in a state where voids are formed therebetween A polishing tool having a layer, wherein a polishing layer fixed with a binder on a substrate is divided into a large number of blocks having a certain shape at a certain interval, and a grid-like pattern having grooves that are concave between the blocks. It is characterized by having.
[0012]
The invention according to claim 2 is the polishing tool according to claim 1, wherein the block is rectangular (including square), circular, or elliptical.
[0013]
The invention according to claim 3 is the polishing tool according to claim 1 or 2, wherein the thickness of the substantial part of the binder for fixing the abrasive grains to the surface of the base material is smaller than the maximum diameter of the abrasive grains. I do.
[0014]
The invention according to claim 4 is the polishing tool according to any one of claims 1 to 3, wherein the content of abrasive grains is 10% by volume or more and 90% by volume or less. .
[0015]
According to a fifth aspect of the present invention, there is provided the polishing tool according to the fourth aspect, wherein the abrasive grains are arranged on the convex portions of the concave and convex portions forming the lattice pattern.
[0016]
The method for manufacturing a polishing tool according to claim 6 is provided by: an installation step of installing a sheet having through-hole patterns arranged at predetermined intervals corresponding to a desired block shape on a base material in advance; and an installation step. Having a coating step of applying a coating liquid containing abrasive grains on a sheet having a through-hole pattern, and a peeling step of peeling off the sheet having the through-hole pattern after the coating step, to obtain a desired block shape on the substrate. Is formed.
[0017]
The method for manufacturing a polishing tool according to claim 7, wherein a mixing step of mixing powder and / or fiber with the abrasive grains and an installation step of setting a sheet having a through-hole pattern corresponding to a desired polishing layer block shape on the base material. A coating step of applying a coating liquid obtained by mixing abrasive grains and a binder onto a substrate provided with a sheet having a through-hole pattern, and a peeling step of peeling the sheet having a through-hole pattern after performing the coating step Thus, a polishing layer divided into blocks is formed on the base material.
[0018]
The invention according to claim 8 is the method for manufacturing a polishing tool according to claim 6 or 7, wherein the thickness of the sheet having the through-hole pattern is at least smaller than the average particle diameter of the abrasive grains.
[0019]
According to a ninth aspect of the present invention, there is provided the polishing tool manufacturing method according to any one of the sixth to eighth aspects, wherein the pattern shape of the through hole pattern is rectangular (including square), circular, or elliptical. There is a feature.
[0020]
According to a tenth aspect of the present invention, there is provided the polishing tool manufacturing method according to the sixth or seventh aspect, wherein the applying step includes an adding step of adding and dispersing an inorganic powder and / or an organic powder to the abrasive grains. And applying it to a sheet having a through-hole pattern.
[0021]
The invention according to claim 11 is the method for manufacturing a polishing tool according to claim 6 or 7, wherein the coating step includes an addition step of adding and dispersing inorganic fibers and / or organic resin fibers to the abrasive grains. And applying it to a sheet having a through-hole pattern.
[0022]
According to a twelfth aspect of the present invention, there is provided the polishing tool manufacturing method according to the tenth or eleventh aspect, wherein the adding step includes adding an inorganic powder and / or an organic powder, an inorganic fiber, and / or an organic resin fiber to the abrasive grains. Thereby, the hardness and the brittleness of the polishing tool can be adjusted.
[0023]
According to a thirteenth aspect of the present invention, a polishing tool is manufactured by the polishing tool manufacturing method according to any one of the sixth to twelfth aspects.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a plan view of a polishing tool application device. FIG. 2 is a plan view of a sheet with a rectangular through-hole pattern. FIG. 3 is a plan view of a sheet with a rectangular through-hole pattern. FIG. 4 is a plan view of a sheet with a circular through-hole pattern. FIG. 5 is a plan view of the sheet with the elliptical through-hole pattern. 6A and 6B are cross-sectional views of a sheet with a through-hole pattern. FIG. 7 is a cross-sectional view of the polishing tool. FIG. 8 is a diagram showing a configuration of the polishing apparatus. 9 and 10 are diagrams showing photographs of the polishing tool product. FIG. 11 is an enlarged view showing a surface change state of the tool after polishing by the polishing tool. FIG. 12 is a cross-sectional view after a conventional polishing tool is processed.
[0025]
In the polishing tool of the present invention, as shown in FIG. 7, the polishing layer containing abrasive grains on one surface of the base material 12 is divided into blocks, and a certain interval is provided between the blocks. This is a configuration in which a lattice pattern having grooves is formed. Chips and worn abrasive grains are guided and trapped in the convex portions 32a formed by the abrasive grains 2 and the binder 11 and the grooves (concave portions) 32b between the blocks to ensure discharge. Also, by dividing the polishing layer into blocks, the working pressure at the working point can be adjusted without increasing the size of the working equipment by adjusting the dimensions of the blocks or the spacing between the blocks under a certain set load. And achieve higher processing efficiency. By performing polishing using a polishing tool having such features, even for large-diameter workpieces, it is possible to more reliably obtain a scratch-free and extremely good mirror surface, and at the same time, even with a small processing machine. Extremely high processing efficiency can be obtained with a small applied load.
[0026]
When the polishing tool is manufactured, a sheet 3 having a through-hole pattern 31 (rectangular hole pattern) is spread on the base material 12 in advance as shown in the plan view of the polishing tool application apparatus shown in FIG. After applying the coating liquid containing abrasive grains from above, the sheet 3 is peeled off to form a striped rectangular polishing layer block on the base material 12, and the gap between the polishing layer blocks becomes concave. Grooves are also formed and blocks are provided at regular intervals.
[0027]
Further, in the polishing layer, the substantial thickness of the binder 11 for fixing the abrasive grains on the base material is smaller than the average grain size of the abrasive grains 2, so that the abrasive grains maintain a state of protruding from the binder during the polishing process. And improve the finishing system. The abrasive grains 2 are generally hard inorganic materials having an average particle size of about 5 μm or less, and a fine powder of primary particles is agglomerated to have an average particle size of about 10 to 300 μm, although it depends on the object to be processed. More preferably, those having a secondary particle diameter of about 40 to 100 μm are suitable. The material provided for the normal abrasive grains 2 is silica, ceria, diamond, CBN, alumina, silicon carbide, iron oxide, zirconium oxide, or the like. Agglomerates can be produced by means such as a sol-gel method or a spray dryer (also commonly used non-agglomerated single particle abrasives are possible).
[0028]
Next, the polishing tool of the present invention can be manufactured by adding and dispersing an inorganic powder and / or an organic powder to the abrasive grains 2 and applying the inorganic powder and the organic powder together with the abrasive grains 2 to the equipment 12 via the sheet 3.
The polishing tool 1 can be manufactured by adding and dispersing an inorganic fiber and / or an organic fiber, and applying the inorganic fiber and / or the organic fiber onto the base material 12 via the sheet 3 together with the abrasive grains 2.
[0029]
According to the polishing tool manufactured by the above-described manufacturing method, the abrasive tool 2 can reliably fix the abrasive grains 2 on the base material 12, and at the same time, the polishing layer containing the abrasive grains is formed in a block shape at a constant interval. By this, the worn abrasive grains and chips are discharged into the grooves, the scratches can be suppressed, and an excellent machined surface quality of the order of nanometer can be obtained with high efficiency.
[0030]
Next, the present invention will be described with reference to examples.
[Example 1]
First, ultra-fine ZrO of 50-60 nm ₂ The powder (ultrafine particles) is sludged with water and sprayed with a spray dryer to have the desired size. For example, secondary particles (granules) having an average particle size of 50 μm are obtained (generally, a size of 1 to 300 μm is obtained. When the particle size distribution is not sharp, a classification process is added). The average particle size was measured by a dry method using a laser diffraction / scattering type particle size distribution analyzer LA-920 manufactured by Horiba, Ltd. As the value of the average particle size, the particle size at a frequency integration of 50% was used (usually also referred to as a median size).
[0031]
However, the bonding force between the primary particles of the granules usually produced by a spray dryer may be too weak. Therefore, if necessary, ZrO ₂ The granules were placed in an electric furnace and fired. In some cases, the firing is performed in a pressurized state in order to shorten the firing time or to further increase the hardness. Although the primary particles grow by the heat treatment, not only the primary particles grow due to the mass transfer of the constituent material, but also the bonding points between the particles become thicker due to the mass transfer of the constituent material of the particle, and there are no discontinuities. It becomes a gentle curved surface, and becomes a so-called "neck" shape constricted into a one-leaf hyperboloidal surface (a drum shape).
[0032]
The growth of primary particles and the formation of a “neck” due to mass transfer during this heat treatment are described in 2.3 of “Ceramic Materials Technology Gathering” (published first edition of the first edition on April 10, 1979) issued by the Industrial Technology Center. Mass transfer mechanism and sintering model ". In this firing step, by controlling the superheating temperature and the holding time, a neck is formed at a bonding point between the primary particles, and a large number of the primary particles are partially formed, and a gap is formed therebetween. To form a granular porous body that was bonded.
[0033]
Next, after adding a solvent to the liquid urethane resin to adjust the solution viscosity, a desired polishing layer block shape and dimensions corresponding to a desired polishing layer block shape on a base material (for example, a PET film having a thickness of about 75 μm) as shown in FIG. A sheet on which a through-hole pattern was formed was laid, and a coating solution containing abrasive grains was applied from above the sheet using a wire bar coater. Regarding the coating method, a gravure coater, a reverse roll coater, a knife coater or the like can be used in addition to the wire bar coater. As shown in FIGS. 2 to 5 and FIGS. 6A and 6B, the sheet has a through-hole pattern with a bottom hole.
[0034]
Then, after being applied on the sheet, the sheet was peeled off again before the abrasive layer was not yet dried. Therefore, after the sheet was peeled off, the abrasive layer was left only in the through hole pattern of the bottom, and a block-shaped polishing layer pattern having a desired shape was formed on the polishing tool surface. In Example 1, the sheet shown in FIG. 2 was used. The width (minor axis direction) of the rectangular hole part of the bottom was 1 to 10 mm, and the depth was 40 μm.
Finally, the applied polishing tool was dried at about 60 ° C. in a thermostat (Yamato Kagaku) for about 1 hour to prepare a polishing tool.
[0035]
The polishing tool thus produced was mounted on a polishing machine (shown in FIG. 8) platen, and a BK7 optical glass disk adjusted to a surface roughness of about 2 μmRy was processed (processing conditions: platen rotation speed 60 rpm, processing pressure 30 kPa). ) A processing mark (scratch, processing scratch, etc.) free and a mirror surface of 30 nmRy or less could be obtained in 3 minutes. (Evaluation of the surface roughness was performed by using Talysurf S4C manufactured by Taylor Hopson Co.) Further, scratching was not observed even when 10 glass disks were continuously processed. As can be seen from FIG. 11, as the machining progresses, the abrasive grains wear gradually advances, but the worn abrasive grains and chips of the workpiece are dropped into the grooves of the concave portions, and the polishing tool is rotated by centrifugal force caused by the rotation of the platen. As a result, the problem of clogging, which had been difficult until now, and the resulting problems of scratching and reduction in processing efficiency could be solved.
[0036]
[Example 2]
By the same manufacturing method as in Example 1, a polishing tool having a polishing layer having a square block shape was produced. In Example 2, the sheet shown in FIG. 3 was used. The length of the side of the square was 13 mm, the groove width was 5 mm, and the thickness of the sheet was 25 μm. FIG. 9 shows an actual photograph of a polishing tool manufactured using this sheet. In the same manner as in Example 1, the polishing tool manufactured in this manner was mounted on a platen of a polishing apparatus shown in FIG. 8, and a BK7 optical glass disk of φ150 mm adjusted to a surface roughness of about 2 μmRy was processed (processing conditions). : Surface mark rotation speed 60 rpm, processing pressure 30 kPa), processing mark (scratch, processing scratch, etc.) free and a mirror surface of 30 nmRy or less were obtained in 2.5 minutes (surface roughness was evaluated by Taylor Hopson foam) Performed at Talysurf S4C.) Further, even when ten glass disks were processed, no scratch was observed.
[0037]
Similarly, a polishing tool having a polishing layer (not shown) having a circular block shape (a real photograph is shown in FIG. 10) and an elliptical block shape was produced. As a result of performing the polishing process under the same conditions as above, the same effect as that of the polishing tool having the square or rectangular block polishing layer was confirmed.
[0038]
Further, by adjusting the dimensions of the blocks and the intervals between the blocks, the machining efficiency and the life of the tool could be adjusted. For example, if the interval between blocks is increased, the number of blocks is reduced, and if the same load is applied, the processing pressure applied to each block is increased, and the processing efficiency is improved. In other words, the working pressure at the working point could be increased by adjusting the dimensions of the blocks and the spacing between the blocks even with a small working load.
[0039]
[Example 3]
In the same manner as in Example 1, fine silica and particles (average particle diameter: 30 μm) composed of primary particles having an average particle diameter of 40 nm were produced by a sol-gel method. It is mixed with a liquid urethane resin, and methyl ethyl ketone is further added to adjust the solution viscosity. Then, the mixture is mixed and stirred for about 10 minutes using a stirrer. Then, a polishing sheet was produced in the same manner as in Example 1 above. The polishing tool thus manufactured was mounted on a polishing apparatus, and a silicon wafer ground with a grindstone equivalent to # 2000 was polished. As a result, a mirror surface having a scratched surface and a processed surface roughness of 30 nm Ry or less was obtained in a processing time of 10 minutes. I got it. Even when five silicon wafers were subsequently polished, no scratch was observed.
The present invention is not limited to the above-described embodiment in the type of abrasive grains as primary particles, the method of agglomeration and aggregation, the type of additive, the type of binder for a polishing tool, and the shape of a processing tool.
[0040]
[Comparative example]
Using the same applicator as in the above example, a polishing tool was produced in the same manner as the polishing tool described in the prior art, without using a sheet with a through-hole pattern. That is, the polishing layer on the surface of the polishing tool is continuous and is not divided into blocks, but all other configurations are the same. Then, as in Example 2, the result of processing a BK7 optical glass disk of φ150 mm adjusted to a surface roughness of about 2 μmRy (processing conditions: platen rotation speed 60 rpm, processing pressure 30 kPa), and a processing mark (scratch) in 5 minutes , Processing scratches, etc.) and a mirror surface of 30 nmRy or less could be obtained. However, when five sheets were continuously processed, generation of scratches was confirmed.
[0041]
From the comparative example and Example 2, by dividing into a polishing layer block shape, a scratch-free high surface quality was obtained, and at the same time, under the same processing conditions, higher processing was performed by a polishing tool without polishing layer block division. Efficiency was obtained. This is because, as in the polishing tool shown in the second embodiment, when the polishing layer is divided into blocks, a substantially high processing pressure is applied to the polishing layer of the block under the same processing conditions. Therefore, high processing efficiency can be obtained with a smaller load without increasing the size of the processing apparatus.
[0042]
From the above embodiments, the polishing tool of the present invention is characterized in that the polishing layer fixed on a base material with a binder is divided into a large number of blocks at regular intervals, and has a lattice shape. In this way, chips and worn abrasive grains can be guided to the grooves in the concave portions between the blocks on the surface of the polishing tool, and can be more reliably discharged, and the occurrence of scratches due to clogging can be suppressed, and the height can be more reliably increased. At the same time that the processing surface quality is obtained, the polishing layer is divided into a large number of blocks having a certain shape at a certain interval and is in a lattice shape, so that the processing machine does not become large, that is, even with a small load. High processing pressure can be applied to the blocked polishing layer, and extremely high processing efficiency can be obtained.
[0043]
In addition, since the divided blocks of the polishing layer are rectangular (including square), circular, or elliptical, concave grooves can be more reliably provided between the blocks, and the grooves can be more reliably cut during polishing. Scraps and the like can be guided and discharged from the processing point, clogging and the like can be avoided, and a very good scratch-free surface quality can be obtained.
[0044]
Also, since the thickness of the binder that fixes the abrasive grains to the surface of the base material is smaller than the maximum diameter of the abrasive grains, the state in which the abrasive grains protrude from the binder during polishing is maintained, and the workpiece can be more reliably and stably. High-efficiency and high-precision finishing, and a long tool life.
[0045]
On the other hand, if the addition ratio of the composite particles is less than 10% by volume, the effect of the addition is ineffective. I can't. Therefore, when the content of the abrasive grains is 10% by volume or more and 90% by volume or less, it is possible to particularly effectively achieve obtaining a highly efficient and high-quality processed surface.
[0046]
Further, in the method for manufacturing a polishing tool of the present invention, a polishing layer can be applied (transferred) on a substrate at a constant interval and at a constant interval without requiring a special mold, and at the same time, a through-hole is formed. By using a sheet with a pattern, by changing the shape of the through-holes and the spacing between them, it is possible to easily and reliably adjust the block shape and spacing of the coating layer on the base material and at a very low cost. A polishing tool can be manufactured.
[0047]
If the thickness of the sheet having the through-hole pattern corresponding to the block shape is larger than the average particle size of the abrasive grains, the sheet is applied to form an overcoat on the polishing layer. In other words, the abrasive grains are buried in the binder, the protrusion amount of the abrasive grains in the polishing layer cannot be sufficiently secured, and during polishing, clogging and the like are likely to occur, and not only a high quality processed surface is not obtained. In the worst case, there is a possibility that the polishing itself cannot be performed and the polishing tool does not function. Therefore, in the present invention, the block shape of the coating layer can be easily and reliably formed on the base material, and at the same time, the thickness of the binder for securely fixing the abrasive particles on the base material is set to the maximum diameter of the abrasive particles. Can be smaller.
[0048]
Further, since the polishing layer is divided into blocks, the load applied to each block during the polishing process increases, and the addition of powder and fiber allows the hardness and brittleness of the polishing tool to be adjusted as desired. In addition to being able to have abrasion properties, it is possible to ensure that the abrasive grains protrude from the binding material portion, and it is also possible to improve heat resistance. Further, it is also possible to make the dispersion of abrasive grains uniform during the production of the polishing tool.
[0049]
The polishing tool and the method of manufacturing the same according to the present invention include the shapes described in the above embodiments, combinations with other elements, for example, the width of the sheet with the through-hole pattern, the circular size of the through-hole pattern, and the size of the block. The present invention is not limited to the requirements shown here, but can be changed within a range that does not impair the gist of the present invention, and can be appropriately determined according to the application form.
[0050]
【The invention's effect】
As is clear from the above description, the polishing tool of the present invention is subjected to overheat treatment at a temperature at which a secondary particle formed by agglomeration of a large number of primary particles forms a neck at a bonding point between the primary particles. Assuming that abrasive particles composed of a granular porous material in which a large number of primary particles are partially and bonded together with voids formed therebetween, abrasive particles are formed on a base material. The polishing layer fixed by the binder is divided into a large number of blocks having a constant shape at regular intervals, and is a grid-like polishing tool, which removes chips and worn abrasive grains during polishing. It can be guided to the groove of the concave portion between the blocks on the surface of the surface, and can be discharged more reliably, and the occurrence of scratches due to clogging or the like can be suppressed.
[0051]
In addition, the polishing layer is divided into a large number of blocks having a constant shape at regular intervals and has a lattice shape, so that the size of the processing machine can be increased. In other words, a high processing pressure can be applied to the blocked polishing layer even with a small load, and an extremely high processing efficiency can be obtained.
[0052]
Further, the method of manufacturing a polishing tool of the present invention is a method of laying a sheet having a through-hole pattern in which a desired shape is arranged in advance on a base material at a certain interval, and polishing the sheet having a through-hole pattern. After applying the coating solution containing the particles, the sheet is peeled off, and the applied polishing layer is formed in a desired block shape and interval like a through hole pattern of the sheet, so that a special mold is not required and polishing is performed. The layer can be applied (transferred) on the base material in a constant shape and at a constant interval, and at the same time, since the sheet having the through-hole pattern is used, the shape of the through-hole and the interval between them can be changed. In addition, it is possible to easily and surely adjust the block shape and interval of the coating layer on the base material, and at the same time, it is possible to manufacture the polishing tool at extremely low cost.
[Brief description of the drawings]
FIG. 1 is a plan view of a polishing tool application device according to an embodiment of the present invention.
FIG. 2 is a plan view of a sheet with a rectangular through-hole pattern according to the embodiment of the present invention.
FIG. 3 is a plan view of a sheet with a rectangular through-hole pattern according to the embodiment of the present invention.
FIG. 4 is a plan view of a sheet with a circular through-hole pattern according to the embodiment of the present invention.
FIG. 5 is a plan view of the sheet with an elliptical through-hole pattern according to the embodiment of the present invention.
FIGS. 6A and 6B are cross-sectional views of a sheet with a through-hole pattern.
FIG. 7 is a cross-sectional view of the polishing tool according to the embodiment of the present invention.
FIG. 8 is a diagram showing a configuration of a polishing apparatus according to the embodiment of the present invention.
FIG. 9 is a view showing a photograph of a polishing tool product according to the embodiment of the present invention.
FIG. 10 is a view showing a photograph of a polishing tool product according to the embodiment of the present invention.
FIG. 11 is an enlarged view showing a surface change state of the polishing tool after polishing by the polishing tool according to the embodiment of the present invention.
FIG. 12 is a diagram showing a cross section of a conventional polishing tool.
[Explanation of symbols]
1 polishing tool
2 abrasive
3 Sheet with through hole pattern
4 Wire bar
5 Work
6 surface plate
11 binder
12 Substrate
21 Chips and worn abrasive grains
31 Through hole
32a convex
32b recess

Claims (13)

Secondary particles formed by aggregating a large number of primary particles are subjected to heat treatment at a temperature at which a neck is formed at the junction between the primary particles, and a large number of the primary particles are partially formed and voids are formed therebetween. Abrasive tool having a polishing layer fixed with a binder on a base material, using abrasive grains made of a granular porous material bonded in a state where
The polishing layer fixed on the base material with a binder is divided into a large number of blocks having a constant shape at regular intervals, and has a grid-like pattern having grooves that are concave between the blocks. Utensils. The polishing tool according to claim 1, wherein the block is a rectangle (including a square), a circle, or an ellipse. The polishing tool according to claim 1, wherein a thickness of the substantial part of the binder that fixes the abrasive grains to a surface of the base material is smaller than a maximum diameter of the abrasive grains. 4. The polishing tool according to claim 1, wherein a content of the abrasive grains in the polishing layer is 10% by volume or more and 90% by volume or less. 5. 5. The polishing tool according to claim 4, wherein the abrasive grains are arranged on a convex portion of the concave / convex portion forming the lattice pattern. 6. An installation step of installing a sheet having through-hole patterns arranged at predetermined intervals corresponding to a desired block shape in advance on the base material,
A coating step of applying a coating liquid containing abrasive grains on a sheet having the through-hole pattern set by the setting step,
A method for manufacturing a polishing tool, comprising: forming a desired block shape on a substrate by providing a peeling step of peeling a sheet having the through hole pattern after the applying step. A mixing step of mixing powder and / or fiber with the abrasive,
An installation step of installing a sheet having a through-hole pattern corresponding to a desired polishing layer block shape on a substrate,
An application step of applying the coating liquid obtained by mixing the abrasive grains and the binder onto the base material on which the sheet having the through hole pattern is installed,
A method for manufacturing a polishing tool, comprising: forming a polishing layer divided into blocks on the base material by a peeling step of peeling the sheet having the through hole pattern after performing the applying step. The polishing tool manufacturing method according to claim 6, wherein a thickness of the sheet having the through-hole pattern is smaller than at least an average particle diameter of the abrasive grains. The method according to any one of claims 6 to 8, wherein a pattern shape of the through hole pattern is rectangular (including square), circular, or elliptical. 8. The method according to claim 6, wherein the applying step includes an adding step of adding and dispersing an inorganic powder and / or an organic powder to the abrasive grains, and applying the abrasive grains together with the abrasive grains to a sheet having the through hole pattern. A method for producing the polishing tool according to the above. 7. The method according to claim 6, wherein the applying step includes an adding step of adding and dispersing an inorganic fiber or / and an organic resin fiber to the abrasive grains, and applying the abrasive grains to the sheet having the through-hole pattern together with the abrasive grains. 8. The method for producing the polishing tool according to 7. The said addition process can adjust the hardness and brittleness of the said polishing tool by adding the said inorganic powder and / or an organic powder, an inorganic fiber, and / or an organic resin fiber to the said abrasive grain. Item 12. The method for producing a polishing tool according to Item 10 or 11. A polishing tool, wherein the polishing tool is manufactured by the method for manufacturing a polishing tool according to any one of claims 6 to 12.

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