CN107443264A - It is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method - Google Patents
It is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method Download PDFInfo
- Publication number
- CN107443264A CN107443264A CN201710647476.8A CN201710647476A CN107443264A CN 107443264 A CN107443264 A CN 107443264A CN 201710647476 A CN201710647476 A CN 201710647476A CN 107443264 A CN107443264 A CN 107443264A
- Authority
- CN
- China
- Prior art keywords
- abrasive particle
- cover layer
- paper
- temporary cover
- curing agent
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention provides it is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, comprise the steps of：1) joint thickness according to needed for determines the thickness of temporary cover layer；2) hollow processing is carried out to temporary cover layer according to the distribution of abrasive particle pattern；3) temporary cover layer is covered on grinding disc substrate；4) abrasive particle and curing agent are filled into hollow part, including following three kinds of methods：4.1) hollow part is filled into after abrasive particle mixes with curing agent；4.2) curing agent is first filled into hollow part, refills abrasive particle afterwards；4.3) abrasive particle is first implanted into hollow part, refills curing agent afterwards；5) abrasive particle is fixed on matrix, including following two methods：5.1) temporary cover layer is first removed, abrasive particle is being fixed on by matrix by curing process.5.2) abrasive particle is fixed on matrix by curing process, then temporary cover layer is removed.
Description
Technical field
Originally it is related to grinding field, more particularly to thickness can be determined based on temporary cover layer and prepares abrasive particle group arrangement mill
Method.
Background technology
Grinding is the main processing mode that machine components precise forming obtains with high-quality surface, is widely used in
The high-efficiency and precision processing of the materials such as metal, ceramics, optical crystal.For grinding, after emery wheel is to process and processing
Workpiece surface quality and processing cost are particularly important, are to form the efficient, key of accurate grinding technology.Because grinding skill is real
Be on border by abrasive particle in numerous abrasive materials of grinding wheel surface to the micro removal of material so as to realizing that the whole removing of workpiece material is removed
Processing, therefore the distribution of grinding wheel surface abrasive particle is huge to emery wheel performance impact.All the time, people are making great efforts how to cause
Abrasive material or micro- abrasive particle group energy are enough distributed in grinding wheel surface according to certain mode, to ensure uniformly undertake between abrasive particle
Chip-load, so as to effectively improve the grinding performance of abrasive particle, as disclosed in Chinese invention patent publication number CN1528565A
A kind of abrasive material technology of preparing with pattern optimization based on shell membrane cloth, Chinese invention patent CN101073882 disclose one
Kind optimized controllable arranged electroplating tool of three-dimensional abrasive laminated preparation method etc..These methods are directed to abrasive particle figure from different aspect
The arrangement implementation issue of abrasive material during case arrangement emery wheel makes is broken through, but made instrument still with expected design
Purpose differs greatly.To find out its cause, being existing method mostly just for abrasive grain placement mode, and it have ignored high-performance mill
Another major issue --- the emery wheel contour accuracy problem of wheel.The high accuracy of emery wheel profile is the base of high-precision workpiece shaping
This guarantee, but influenceed by curing agent thickness degree very big.CN105965408A discloses a kind of making side of single layer of abrasive particles emery wheel
Method, its core point be by runout compensation mechanism indirect control bonding agent even application to solve the high sex chromosome mosaicism such as abrasive particle, but
It is its equipment complexity, it is cumbersome.On the other hand, existing mesh screen, orifice plate, template material are mainly metal, ceramics etc.,
Cost is high and hardly possible is processed, and arrangement patterns are few, and is only to play a part of dynamic abrasive grain locations limitation, does not play
Control the effect of bonding agent thickness.
The content of the invention
Present invention aims at provide one kind can convenient and efficient realize abrasive particle positioning and can realize curing agent thickness control
Abrasive particle pattern distribution mill prepare method.
The present invention is achieved by the following technical solutions：
A kind of based on temporary cover layer to determine thickness and prepare abrasive particle group to arrange the method for mill, described mill is to include but not
It is limited to emery wheel, emery wheel, drill bit, end-face grinding plate, roller, trimmer, CMP pad dresser, mill pad, comprises the steps of：
1) joint thickness according to needed for determines the thickness of temporary cover layer；
2) hollow processing is carried out to temporary cover layer according to the distribution of abrasive particle pattern；
3) temporary cover layer is covered on grinding disc substrate；
4) abrasive particle and curing agent are filled into hollow part, including following three kinds of methods：
4.1) hollow part is filled into after abrasive particle mixes with curing agent；
4.2) curing agent is first filled into hollow part, refills abrasive particle afterwards；
4.3) abrasive particle is first implanted into hollow part, refills curing agent afterwards；
5) abrasive particle is fixed on matrix, including following two methods：
5.1) temporary cover layer is first removed, abrasive particle is being fixed on by matrix by curing process.
5.2) abrasive particle is fixed on matrix by curing process, then temporary cover layer is removed.
In a preferred embodiment：The curing agent is containing the photosensitive resin containing 1-20% light triggers；Described
Under ultraviolet irradiation curing action can occur for photosensitive resin；Described photosensitive resin includes but is not limited to acryloxy,
Methacryloxy, acrylic, epoxide group, vinyl ethers.
In a preferred embodiment：The curing agent is heat-sensitive resin；Described heat-sensitive resin includes but is not limited to phenol
Urea formaldehyde, Lauxite, melamine formaldehyde resin, epoxy resin, unsaturated-resin, polyurethane, polyimides, furans
Resin, polybutadiene, organic siliconresin；After being heated up curing action can occur for described heat-sensitive resin.
In a preferred embodiment：The curing process is ultraviolet light solidification or is heating and curing.
In a preferred embodiment：Described matrix includes but is not limited to metal, or ceramics, or rubber, or plastics, or nothing
Spin cloth, or textile cloth, or composite.
In a preferred embodiment：The temporary cover layer is made up of plane materiel, not dry mucigel, and base stock.
In a preferred embodiment：The facestock material includes but is not limited to：Art paper, PVC, PET, laser paper, heatproof
Paper, polypropylene, makrolon, brown paper, fluorescent paper, gold-plated paper, silver-plated paper, synthetic paper, aluminium-foil paper, fragile paper, cheque paper,
U.S. line paper, cloth millimeter paper, iridescent paper, sandwich art paper, heat-sensitive paper, plastic sheeting, polyester film, one kind in nylon film；Institute
It is 25-500um to state plane materiel thickness；
The not dry mucigel has an adhesive, and the adhesive can be acrylic based emulsion, or PUR, or rubber-based
Class latex, or solvent-type acrylic；
Scribble silicon protective layer outside the base stock, described base stock include but is not limited to Ge Laxin paper, garlic skin paper, brown paper,
Polyester pet, art paper, polyethylene, plastic sheeting.
In a preferred embodiment：The material of the abrasive particle includes being not limited to diamond, cubic boron, zirconium oxide, oxygen
Change aluminium, hard alloy, silicon nitride, carborundum.
In a preferred embodiment：A diameter of 0.01-2000um of the abrasive particle.
Beneficial effects of the present invention are：1) the hollow processing cost of temporary cover layer and its pattern is low and speed is fast.2)
Abrasive particle surface pattern is changed freely, efficiently realizes component difficulty pattern.3) after being determined according to the thickness of temporary cover layer
The thickness of continuous curing agent filling, so as to control the contour of binder course.
Brief description of the drawings
Fig. 1 is temporary cover layer cross-sectional view in the preferred embodiment of the present invention 1；
Fig. 2 is the temporary cover layer cross-sectional view after hollow out in the preferred embodiment of the present invention 1；
Fig. 3 is that the temporary cover layer in the preferred embodiment of the present invention 1 after hollow out is adhered to cross-sectional view on matrix；
Fig. 4 is that the temporary cover layer in the preferred embodiment of the present invention 1 after hollow out has filled curing agent and abrasive particle cross section shows
It is intended to；
Fig. 5 is that temporary cover layer schematic diagram is removed in the preferred embodiment of the present invention 1；
Fig. 6 is temporary cover layer cross-sectional view in the preferred embodiment of the present invention 2；
Fig. 7 is the temporary cover layer cross-sectional view after hollow out in the preferred embodiment of the present invention 2；
Fig. 8 is the temporary cover layer adhesive matrix cross-sectional view after hollow out in the preferred embodiment of the present invention 2；
Fig. 9 is that the temporary cover layer in the preferred embodiment of the present invention 2 after hollow out fills curing agent schematic diagram；
Figure 10 is that the temporary cover layer in the preferred embodiment of the present invention 2 after hollow out fills abrasive particle schematic diagram；
Figure 11 is that schematic diagram after temporary cover layer is removed in the preferred embodiment of the present invention 2.
Embodiment
In order that technical solution of the present invention is clearer, now the present invention is done further in detail with accompanying drawing in conjunction with the embodiments
Explanation：
Embodiment 1
As Figure 1-5, the present invention is a kind of side that thickness can be determined based on temporary cover layer and prepares abrasive particle group arrangement mill
Method, main process are as follows：
As shown in Figure 1, it is first determined temporary cover layer 1, in the present embodiment, temporary cover layer are formed by 3 layers, respectively
It is plane materiel 11, its material is art paper, and not dry mucigel 12 has an adhesive, and material is acrylic based emulsion, base stock 13, to apply
There is the Ge Laxin paper of silicon protective layer, in other embodiments, plane materiel 11 can be but be not limited to PVC, PET, laser paper, heatproof
Paper, polypropylene, makrolon, brown paper, fluorescent paper, gold-plated paper, silver-plated paper, synthetic paper, aluminium-foil paper, fragile paper, cheque paper,
U.S. line paper, cloth millimeter paper, iridescent paper, sandwich art paper, one kind in heat-sensitive paper；The thickness of the plane materiel 11 is 25~500um；
The adhesive of the not dry mucigel 12 can be PUR in other embodiments, or rubber base class latex, or molten
Formulation acrylic acid；
The base stock 13 can be garlic skin paper, brown paper, polyester pet, art paper, polyethylene, plastics in other embodiments
One kind in film.
The thickness of the temporary cover layer 1 is that the thickness of according to needed for follow-up solidification oxidant layer determines, in the present embodiment
In, the plane materiel thickness of temporary cover layer 1 is 0.125mm.
Afterwards as shown in Fig. 2 carrying out hollow processing on temporary cover layer 1, hollow space 2 penetrates plane materiel 11, not dry glutinous
Glue-line 12, base stock 13.Then as shown in figure 3, base stock 13 is removed, then the temporary cover layer 1 Jing Guo hollow processing is adhered to
On abrasive wheel substrate 3, in the present embodiment, the abrasive wheel substrate 3 is No. 45 steel, in other embodiments, the material of abrasive wheel substrate 3
Material can be ceramics, rubber, plastics, non-woven fabrics, textile cloth, composite.
Afterwards as shown in figure 4, inserting hollow part 2 after curing agent 41 is mixed with abrasive particle 42, packed layer is formed, and make
Packed layer it is concordant with the outer of temporary cover layer 1, so as to realize abrasive particle pattern be distributed and can be by temporary cover layer thickness
To control the effect of curing agent thickness degree, the curing agent 41 is the photosensitive resin containing 1-20% light triggers；Described light
For quick resin in ultraviolet light curable, its component includes but is not limited to acryloxy, or methacryloxy or
Acrylic or epoxide group or vinyl ethers.In the present embodiment, the curing agent 41 is acryloxy photosensitive resin.
Abrasive particle 42 is diamond particles in the present embodiment, and a diameter of 250-350um, in other embodiments, abrasive particle 42 can be side
Boron carbide, zirconium oxide, aluminum oxide, hard alloy, silicon nitride, carborundum, a diameter of 1-2000um.
As shown in figure 5, after the packed layer of hollow part is dried, temporary cover layer 1 is removed, by the emery wheel with packed layer
Matrix 3 carries out ultraviolet radiation-curable processing, and abrasive particle is securely attached into abrasive wheel substrate by the solidification process of curing agent 41
On 3, the mill of abrasive particle pattern arrangement so as to obtain.Mill abrasive particle contour according to obtained by this method compares conventional method
Improve at least 35%.
Embodiment 2
As illustrated in figs. 6-11, in the present embodiment, the material of plane materiel 11 of temporary cover layer 1 is polyester film (PET), and other are same
Embodiment one；The material of abrasive wheel substrate 3 is 40CrMo steel.Curing agent 41 uses thermosetting resin, and its component can be but be not limited to phenol
Urea formaldehyde, Lauxite, melamine formaldehyde resin, epoxy resin, unsaturated-resin, polyurethane, polyimides, furans
Resin, polybutadiene, organic siliconresin.
Such as Fig. 6, shown in Fig. 7, temporary cover layer 1 is taken to carry out hollow processing, the thickness of the plane materiel 11 of temporary cover layer 1 is
0.150mm, laser engraving hollow processing is carried out to temporary cover layer 1 according to the arrangement of default abrasive particle pattern, afterwards such as Fig. 8 institutes
Show, remove base stock 13 and the temporary cover layer 1 after hollow out is adhered on abrasive wheel substrate 3.
As shown in figure 9, curing agent 41 is first inserted into hollow part, and form the hollow out consistent with abrasive grain placement pattern and fill out
Fill layer, and outer is concordant with temporary cover layer 1, so as to realize the distribution of abrasive particle pattern and can by temporary cover layer come
The effect of bonding agent layer thickness is controlled, in the present embodiment, curing agent 41 be epoxy resin, and such as Figure 10 covers abrasive particle 42 afterwards
On populated curing agent 41, in the present embodiment, abrasive particle 42 is CBN, a diameter of 140-255um.
After last layer to be filled is dried, by the emery wheel of the packed layer with temporary cover layer 1, curing agent 41 and abrasive particle 42
Matrix 3 is heated, and abrasive particle is securely attached on matrix by the curing process of curing agent 41, stops heating
The mill that required pattern is arranged just is obtained after removing temporary cover layer 1 afterwards.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited to
This, any one skilled in the art the invention discloses technical scope in, the change that can readily occur in or replace
Change, should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection of claim
Scope is defined.
Claims (9)
1. it is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, described mill for include but is not limited to
Emery wheel, emery wheel, drill bit, end-face grinding plate, roller, trimmer, CMP pad dresser, mill pad, it is characterised in that comprise the steps of：
1) joint thickness according to needed for determines the thickness of temporary cover layer；
2) hollow processing is carried out to temporary cover layer according to the distribution of abrasive particle pattern；
3) temporary cover layer is covered on grinding disc substrate；
4) abrasive particle and curing agent are filled into hollow part, including following three kinds of methods：
4.1) hollow part is filled into after abrasive particle mixes with curing agent；
4.2) curing agent is first filled into hollow part, refills abrasive particle afterwards；
4.3) abrasive particle is first implanted into hollow part, refills curing agent afterwards；
5) abrasive particle is fixed on matrix, including following two methods：
5.1) temporary cover layer is first removed, abrasive particle is being fixed on by matrix by curing process.
5.2) abrasive particle is fixed on matrix by curing process, then temporary cover layer is removed.
2. as claimed in claim 1 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
The curing agent is the photosensitive resin containing 1-20% light triggers；Described photosensitive resin can occur solid under ultraviolet irradiation
Change behavior；Described photosensitive resin includes but is not limited to acryloxy, methacryloxy, acrylic, epoxide group,
Vinyl ethers.
3. as claimed in claim 1 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
The curing agent is heat-sensitive resin；Described heat-sensitive resin includes but is not limited to phenolic resin, Lauxite, and melamine-
Formaldehyde resin, epoxy resin, unsaturated-resin, polyurethane, polyimides, furane resins, polybutadiene, organosilicon tree
Fat；After being heated up curing action can occur for described heat-sensitive resin.
4. as claimed in claim 1 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
The curing process is ultraviolet light solidification or is heating and curing.
5. as claimed in claim 1 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
Described matrix includes but is not limited to metal, or ceramics, or rubber, or plastics, or non-woven fabrics, or textile cloth, or composite.
6. as claimed in claim 1 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
The temporary cover layer is made up of plane materiel, not dry mucigel, and base stock.
7. as claimed in claim 6 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
The facestock material includes but is not limited to：Art paper, PVC, PET, laser paper, heatproof paper, polypropylene, makrolon, brown paper,
Fluorescent paper, gold-plated paper, silver-plated paper, synthetic paper, aluminium-foil paper, fragile paper, cheque paper, U.S. line paper, cloth millimeter paper, iridescent paper, sandwich copper
Millboard, heat-sensitive paper, plastic sheeting, polyester film, one kind in nylon film；The plane materiel thickness is 25-500um；
The not dry mucigel has an adhesive, and the adhesive can be acrylic based emulsion, or PUR, or rubber base class breast
Glue, or solvent-type acrylic；
Silicon protective layer is scribbled outside the base stock, described base stock includes but is not limited to Ge Laxin paper, garlic skin paper, brown paper, polyester
Pet, art paper, polyethylene, plastic sheeting.
8. as claimed in claim 1 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
The material of the abrasive particle includes being not limited to diamond, cubic boron, zirconium oxide, aluminum oxide, hard alloy, silicon nitride, carbonization
Silicon.
9. as claimed in claim 8 based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method, it is characterised in that：
A diameter of 0.01-2000um of the abrasive particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710647476.8A CN107443264A (en) | 2017-08-01 | 2017-08-01 | It is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710647476.8A CN107443264A (en) | 2017-08-01 | 2017-08-01 | It is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method |
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| CN107443264A true CN107443264A (en) | 2017-12-08 |
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| CN201710647476.8A Pending CN107443264A (en) | 2017-08-01 | 2017-08-01 | It is a kind of based on temporary cover layer determine thickness prepare abrasive particle group arrange mill method |
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Citations (9)
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|---|---|---|---|---|
| JPH06114741A (en) * | 1992-10-01 | 1994-04-26 | Komatsu Ltd | Electrodeposition method |
| EP1331064A1 (en) * | 2002-01-25 | 2003-07-30 | WENDT GmbH | Method to manufacture a grinding tool with galvanically bonded abrasive bodies |
| JP2004082323A (en) * | 2002-06-26 | 2004-03-18 | Ricoh Co Ltd | Grinding tool and manufacturing method therefor |
| WO2004094111A1 (en) * | 2003-04-24 | 2004-11-04 | Empa Eidgenössische Materialprüfungs- Und Forschungsanstalt | Method for the production of an abrasive tool |
| JP2005349538A (en) * | 2004-06-11 | 2005-12-22 | Nikon Corp | Manufacturing method for particle array substrate |
| US20060156634A1 (en) * | 2002-07-26 | 2006-07-20 | 3M Innovative Properties Company | Method of using abrasive product |
| CN201074216Y (en) * | 2007-08-08 | 2008-06-18 | 陈鹏 | Multi-component scotch tape products |
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| KR100868658B1 (en) * | 2007-05-18 | 2008-11-12 | 조희철 | Method for fabricating polishing tool |
-
2017
- 2017-08-01 CN CN201710647476.8A patent/CN107443264A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06114741A (en) * | 1992-10-01 | 1994-04-26 | Komatsu Ltd | Electrodeposition method |
| EP1331064A1 (en) * | 2002-01-25 | 2003-07-30 | WENDT GmbH | Method to manufacture a grinding tool with galvanically bonded abrasive bodies |
| JP2004082323A (en) * | 2002-06-26 | 2004-03-18 | Ricoh Co Ltd | Grinding tool and manufacturing method therefor |
| US20060156634A1 (en) * | 2002-07-26 | 2006-07-20 | 3M Innovative Properties Company | Method of using abrasive product |
| WO2004094111A1 (en) * | 2003-04-24 | 2004-11-04 | Empa Eidgenössische Materialprüfungs- Und Forschungsanstalt | Method for the production of an abrasive tool |
| JP2005349538A (en) * | 2004-06-11 | 2005-12-22 | Nikon Corp | Manufacturing method for particle array substrate |
| KR100868658B1 (en) * | 2007-05-18 | 2008-11-12 | 조희철 | Method for fabricating polishing tool |
| CN201074216Y (en) * | 2007-08-08 | 2008-06-18 | 陈鹏 | Multi-component scotch tape products |
| CN101205446A (en) * | 2007-08-08 | 2008-06-25 | 陈鹏 | Multi-component scotch tape products |
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| Title |
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| 袁和平: "磨料群可控排布技术及其砂轮的研制", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
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Application publication date: 20171208 |