CN205817622U - A kind of electroplated diamond napping sheet of band chip-removal hole - Google Patents
A kind of electroplated diamond napping sheet of band chip-removal hole Download PDFInfo
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- CN205817622U CN205817622U CN201620358669.2U CN201620358669U CN205817622U CN 205817622 U CN205817622 U CN 205817622U CN 201620358669 U CN201620358669 U CN 201620358669U CN 205817622 U CN205817622 U CN 205817622U
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- China
- Prior art keywords
- layer
- removal hole
- cloth matrix
- diamond
- described cloth
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Abstract
The utility model discloses the electroplated diamond napping sheet of a kind of band chip-removal hole, include cloth matrix, described cloth matrix is circular, metal gauze and diamond particles grinding layer it is disposed with on the upside of described cloth matrix, wherein said diamond particles grinding layer is included several grinding layer basic units and is posted in metal gauze so that the even compartment of terrain of plating mode is viscous by binding agent, it is provided with flocking layer of cloth on the downside of described cloth matrix, on described cloth matrix, direct chip discharging hole is distributed；This napping sheet passes through direct chip discharging hole gold conjugate hard rock particulate abrasive layer, the design of metal gauze, grinding heat can be reduced in bruting process, improve grinding efficiency, machining accuracy and service life, during particularly with difficult-to-machine materials such as hard alloy, electronics, stone material, engineering ceramics, glass, gem, building materials, rustless steel, hardened steel, high-speed tool steel, high temperature alloy and composites, it is removed material capability and is far superior to bonded abrasive products, improves working (machining) efficiency.
Description
Technical field
This utility model relates to grinding technology field, a kind of coated napping sheet grinding tool for superhard material.
Background technology
Napping sheet, is by the big back side flocking rolling up sand paper also known as napping disk sand paper, thread gluing sand paper, then by punching
Press coordinates various types of cutting die punching presses product to be out referred to as napping sheet.Along with super hard abrasive is at hard alloy, stone material, pottery
The unique advantage that the difficult-to-machine material such as porcelain, ferrous alloy has, superhard material coated abrasive tool obtains development and application widely, electricity
Although gold-plated hard rock coated abrasive tool has low processing heat and a chip removal function, but continuing to increase along with processing capacity, if chip removal thing
Can not drain in time and can affect crudy, it is therefore necessary to developing a kind of grindstone dust that reduces affects the coated mill of diamond of grinding
Tool.
Summary of the invention
In order to overcome the deficiencies in the prior art, this utility model provides the electroplated diamond napping sheet of a kind of band chip-removal hole.
This utility model solves its technical problem and be the technical scheme is that
The electroplated diamond napping sheet of a kind of band chip-removal hole, includes cloth matrix, and described cloth matrix is circular, described fabricbase
Being disposed with metal gauze and diamond particles grinding layer on the upside of body, wherein said diamond particles grinding layer includes some
Individual grinding layer basic unit is posted in metal gauze so that the even compartment of terrain of plating mode is viscous by binding agent, is provided with on the downside of described cloth matrix
Flocking layer of cloth, is distributed direct chip discharging hole on described cloth matrix.
As a preference, described flocking layer of cloth has lower chip-removal hole.
As a preference, diadust particle diameter 10～15 μm of described diamond particles grinding layer.
As a preference, described bonding agent is epoxy resin.
As a preference, described metal gauze is 200～325 mesh.
The beneficial effects of the utility model are: this napping sheet passes through direct chip discharging hole gold conjugate hard rock particulate abrasive layer, metal
The design of gauze, can reduce grinding heat in bruting process, improve grinding efficiency, machining accuracy and service life, particularly with
Hard alloy, electronics, stone material, engineering ceramics, glass, gem, building materials, rustless steel, hardened steel, high-speed tool steel, high temperature alloy
During with the difficult-to-machine material such as composite, it is removed material capability and is far superior to bonded abrasive products, improves working (machining) efficiency.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is top view of the present utility model；
Fig. 2 is enlarged section of the present utility model.
Detailed description of the invention
In order to make the purpose of the application, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
This utility model is further elaborated.For the thorough explanation present invention, following description can relate to some special
Determine details.And when not having these specific detail, the present invention then may still can realize, i.e. technical staff in art uses
Herein these describe and statement others skilled in the art in art effectively introduce their work essence.This external demand
Be noted that the direction that the word " upside " used in describing below and " downside " refer in accompanying drawing, word " interior " and
" outward " refers respectively to the direction towards or away from particular elements geometric center, and letter is being made in above-mentioned direction by person skilled
Singly, the adjustment that need not creativeness should not be construed as the technology beyond the application protection domain.Should be appreciated that described herein
Specific embodiment, only in order to explain the application, is not used to limit real protection scope.And be the mesh of the present invention of avoiding confusion
, owing to the technology of the manufacture method known, material prescription etc. is not it will be understood that therefore they are described in detail.
With reference to Fig. 1, Fig. 2, the electroplated diamond napping sheet of a kind of band chip-removal hole, including cloth matrix 1, described cloth matrix 1 is circular, institute
State and on the upside of cloth matrix 1, be disposed with metal gauze 2 and diamond particles grinding layer 3, wherein said diamond particles grinding layer 3
Include several grinding layer basic units to be posted in metal gauze 2 so that the even compartment of terrain of plating mode is viscous by binding agent, described fabricbase
It is provided with flocking layer of cloth 4 on the downside of body 1, direct chip discharging hole 5 is distributed on described cloth matrix 1, by metal gauze 2 and diamond particles
Grinding layer 3 coordinates, and substantially increases grinding capacity and working (machining) efficiency, coordinates direct chip discharging hole 5 to design, and plays receiving grindstone dust and dissipates
Heat effect.
Further embodiment, with reference to the electroplated diamond napping sheet of a kind of band chip-removal hole of Fig. 1, Fig. 2, the most referred to herein
" embodiment " refer to may be included in special characteristic, structure or the characteristic at least one implementation of the application.In this explanation
In book, different local " in the embodiments " occurred not refer both to same embodiment, are not single or selective and other
The embodiment that embodiment is mutually exclusive.Embodiment includes cloth matrix 1, and described cloth matrix 1 is circular, on the upside of described cloth matrix 1
Being disposed with metal gauze 2 and diamond particles grinding layer 3, wherein said diamond particles grinding layer 3 includes several
Grinding layer basic unit is posted in metal gauze 2 so that the even compartment of terrain of plating mode is viscous by binding agent, is distributed straight on described cloth matrix 1
Chip-removal hole 5, is provided with flocking layer of cloth 4 on the downside of described cloth matrix 1, described flocking layer of cloth 4 has lower chip-removal hole 6, wherein fabricbase
The direct chip discharging hole 5 of body 1 connects with the chip-removal hole 6 of flocking layer of cloth 4, and the chip removal of polishing napping sheet can be made to improve further, grinds
Ability is strong, and surface can make polishing pad surface clean and consistency of performance without blocking flocking layer of cloth 4 simultaneously.Described diamond particles
Diadust particle diameter 10 μm of grinding layer 3, described metal gauze 2 is 200 mesh.
Further embodiment, with reference to the electroplated diamond napping sheet of a kind of band chip-removal hole of Fig. 1, Fig. 2, includes cloth matrix
1, described cloth matrix 1 is circular, is disposed with metal gauze 2 and diamond particles grinding layer 3 on the upside of described cloth matrix 1, its
Described in diamond particles grinding layer 3 include several grinding layer basic units and glue note by binding agent with the even compartment of terrain of plating mode
In metal gauze 2, direct chip discharging hole 5 is distributed on described cloth matrix 1, on the downside of described cloth matrix 1, is provided with flocking layer of cloth 4, institute
Stating bonding agent is that epoxy resin is to ensure bonding stable degree.Diadust particle diameter 15 μm of described diamond particles grinding layer 3,
Described metal gauze 2 is 325 mesh.
According to above-mentioned principle, this utility model can also carry out suitable change and amendment to above-mentioned embodiment.Therefore,
This utility model is not limited to detailed description of the invention disclosed and described above, to modifications and changes more of the present utility model
Should also be as falling in scope of the claims of the present utility model.
Claims (5)
1. an electroplated diamond napping sheet for band chip-removal hole, includes cloth matrix (1), it is characterised in that: described cloth matrix (1)
For circle, described cloth matrix (1) upside is disposed with metal gauze (2) and diamond particles grinding layer (3), wherein said gold
Hard rock particulate abrasive layer (3) includes several grinding layer basic units and is posted on metal by binding agent so that the even compartment of terrain of plating mode is viscous
On gauze (2), described cloth matrix (1) downside is provided with flocking layer of cloth (4), direct chip discharging hole is distributed on described cloth matrix (1)
(5).
The electroplated diamond napping sheet of a kind of band chip-removal hole the most according to claim 1, it is characterised in that: described Flocked fabric
Lower chip-removal hole (6) is had on layer (4).
The electroplated diamond napping sheet of a kind of band chip-removal hole the most according to claim 1, it is characterised in that: described diamond
Diadust particle diameter 10～15 μm of particulate abrasive layer (3).
The electroplated diamond napping sheet of a kind of band chip-removal hole the most according to claim 1, it is characterised in that: described binding agent
For epoxy resin.
The electroplated diamond napping sheet of a kind of band chip-removal hole the most according to claim 1, it is characterised in that: described metallic yarn
Net (2) is 200～325 mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620358669.2U CN205817622U (en) | 2016-04-25 | 2016-04-25 | A kind of electroplated diamond napping sheet of band chip-removal hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620358669.2U CN205817622U (en) | 2016-04-25 | 2016-04-25 | A kind of electroplated diamond napping sheet of band chip-removal hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205817622U true CN205817622U (en) | 2016-12-21 |
Family
ID=58147765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620358669.2U Expired - Fee Related CN205817622U (en) | 2016-04-25 | 2016-04-25 | A kind of electroplated diamond napping sheet of band chip-removal hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205817622U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107804058A (en) * | 2016-09-08 | 2018-03-16 | 源鸿工业股份有限公司 | Grid gauze manufacture method with open hole |
| CN109129224A (en) * | 2018-09-27 | 2019-01-04 | 东莞金太阳研磨股份有限公司 | A kind of disk sand paper and the grinding apparatus with the disk sand paper |
| CN109822452A (en) * | 2019-03-29 | 2019-05-31 | 深圳市宏通新材料有限公司 | Porous metal matrix diamond lap polishing plate |
-
2016
- 2016-04-25 CN CN201620358669.2U patent/CN205817622U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107804058A (en) * | 2016-09-08 | 2018-03-16 | 源鸿工业股份有限公司 | Grid gauze manufacture method with open hole |
| CN109129224A (en) * | 2018-09-27 | 2019-01-04 | 东莞金太阳研磨股份有限公司 | A kind of disk sand paper and the grinding apparatus with the disk sand paper |
| CN109822452A (en) * | 2019-03-29 | 2019-05-31 | 深圳市宏通新材料有限公司 | Porous metal matrix diamond lap polishing plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20210425 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |