MY187700A - Method for manufacturing pad conditioner and pad conditioner - Google Patents

Method for manufacturing pad conditioner and pad conditioner

Info

Publication number
MY187700A
MY187700A MYPI2016702816A MYPI2016702816A MY187700A MY 187700 A MY187700 A MY 187700A MY PI2016702816 A MYPI2016702816 A MY PI2016702816A MY PI2016702816 A MYPI2016702816 A MY PI2016702816A MY 187700 A MY187700 A MY 187700A
Authority
MY
Malaysia
Prior art keywords
pad conditioner
abrasive grains
photosensitive film
manufacturing
plating layer
Prior art date
Application number
MYPI2016702816A
Inventor
Wan-Jae Kwon
Young-Pil Kwon
Tai-Kyung Kim
Jung-Hyun Yang
Sang-Ho Lee
Original Assignee
Saesol Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saesol Diamond Ind Co Ltd filed Critical Saesol Diamond Ind Co Ltd
Publication of MY187700A publication Critical patent/MY187700A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Disclosed are herein a pad conditioner (10) and a method for manufacturing the same. The method comprises depositing a photosensitive film (23) on a base substrate, followed by etching to form a plurality of receiving holes in the photosensitive film (23); inserting abrasive grains (27) into the receiving holes (25) and blanketing a plating layer over the photosensitive film and the abrasive grains; removing the base substrate and then the photosensitive film (23); and melting a part of the plating layer to expose a part of each of the abrasive grains (27). The pad conditioner has abrasive grains (27) homogeneously protruding at a uniform height from the plating layer.
MYPI2016702816A 2014-03-25 2014-11-11 Method for manufacturing pad conditioner and pad conditioner MY187700A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140034834A KR101558449B1 (en) 2014-03-25 2014-03-25 Manufacturing method of pad conditioner

Publications (1)

Publication Number Publication Date
MY187700A true MY187700A (en) 2021-10-12

Family

ID=54195877

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702816A MY187700A (en) 2014-03-25 2014-11-11 Method for manufacturing pad conditioner and pad conditioner

Country Status (5)

Country Link
KR (1) KR101558449B1 (en)
CN (1) CN105940484B (en)
MY (1) MY187700A (en)
SG (1) SG11201606279YA (en)
WO (1) WO2015147401A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107336150A (en) * 2017-08-01 2017-11-10 华侨大学 A kind of method that deposition prepares abrasive particle pattern distribution mill
CN107336148A (en) * 2017-08-01 2017-11-10 华侨大学 A kind of quick method for preparing abrasive particle pattern distribution mill
KR102013386B1 (en) * 2018-01-29 2019-08-22 새솔다이아몬드공업 주식회사 Manufacturing method of pad conditioner by reverse plating and pad conditioner thereof
WO2019225624A1 (en) * 2018-05-22 2019-11-28 帝国イオン株式会社 Wear-resistant coating film, wear-resistant member, method for producing wear-resistant coating film, and sliding mechanism

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100508300B1 (en) * 2003-05-06 2005-08-17 (주)디디다이아 Method of fabricating a chemical mechanical polishing pad conditioner using ceramic material and chemical mechanical polishing pad conditioner fabricated thereby
JP2007260886A (en) * 2006-03-30 2007-10-11 Mitsubishi Materials Corp Cmp conditioner and manufacturing method therefor
KR20090078647A (en) * 2008-01-15 2009-07-20 이화다이아몬드공업 주식회사 Conditioner for chemical mechanical planarization pad.
KR20110124988A (en) * 2010-05-12 2011-11-18 신한다이아몬드공업 주식회사 Cmp pad conditioner and its manufacutring method
KR101178849B1 (en) * 2010-07-30 2012-08-31 신한다이아몬드공업 주식회사 Cmp pad conditioner and its manufacturing method
JP6014835B2 (en) * 2011-12-14 2016-10-26 帝国イオン株式会社 CMP pad conditioner and method of manufacturing the CMP pad conditioner

Also Published As

Publication number Publication date
CN105940484A (en) 2016-09-14
SG11201606279YA (en) 2016-09-29
KR20150111202A (en) 2015-10-05
WO2015147401A1 (en) 2015-10-01
KR101558449B1 (en) 2015-10-07
CN105940484B (en) 2018-10-16

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