CN105934337B - 多层膜 - Google Patents

多层膜 Download PDF

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Publication number
CN105934337B
CN105934337B CN201480067684.5A CN201480067684A CN105934337B CN 105934337 B CN105934337 B CN 105934337B CN 201480067684 A CN201480067684 A CN 201480067684A CN 105934337 B CN105934337 B CN 105934337B
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CN
China
Prior art keywords
polyimide layer
polyimides
weight
multilayer film
carbon black
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480067684.5A
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English (en)
Chinese (zh)
Other versions
CN105934337A (zh
Inventor
T·E·卡内
J·M·巴尔托灵
C·R·贝克斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronics Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of CN105934337A publication Critical patent/CN105934337A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/52—Two layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201480067684.5A 2013-12-13 2014-12-10 多层膜 Active CN105934337B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361915690P 2013-12-13 2013-12-13
US61/915,690 2013-12-13
PCT/US2014/069503 WO2015089161A1 (en) 2013-12-13 2014-12-10 A multilayer film

Publications (2)

Publication Number Publication Date
CN105934337A CN105934337A (zh) 2016-09-07
CN105934337B true CN105934337B (zh) 2017-12-29

Family

ID=52392199

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480067684.5A Active CN105934337B (zh) 2013-12-13 2014-12-10 多层膜

Country Status (6)

Country Link
US (1) US9481809B2 (enExample)
JP (1) JP6434520B2 (enExample)
KR (1) KR102309828B1 (enExample)
CN (1) CN105934337B (enExample)
DE (1) DE112014005687B4 (enExample)
WO (1) WO2015089161A1 (enExample)

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TW201302858A (zh) * 2011-06-24 2013-01-16 Du Pont 有色聚醯亞胺膜及與其有關之方法
KR102309828B1 (ko) * 2013-12-13 2021-10-08 이 아이 듀폰 디 네모아 앤드 캄파니 다층 필름
US9469781B2 (en) * 2013-12-17 2016-10-18 E I Du Pont De Nemours And Company Multilayer film
US9224022B2 (en) 2014-04-29 2015-12-29 Hand Held Products, Inc. Autofocus lens system for indicia readers
US9481150B2 (en) * 2014-12-10 2016-11-01 E I Du Pont De Nemours And Company Multilayer film
JP6403911B1 (ja) * 2017-05-23 2018-10-10 株式会社きもと 積層遮光フィルム、並びに、これを用いた光学機器用遮光リング、レンズユニット及びカメラモジュール
CN107501588B (zh) * 2017-10-01 2020-06-23 南京贝迪电子有限公司 一种弱消光塑料薄膜、表面保护膜及其应用
US11186704B2 (en) * 2018-07-02 2021-11-30 Global Graphene Group, Inc. Manufacturing process for dark-color polymer composite films
WO2020009911A1 (en) * 2018-07-02 2020-01-09 Nanotek Instruments, Inc. Dark-color polymer composite films
US11242443B2 (en) * 2018-07-02 2022-02-08 Global Graphene Group, Inc. Dark-color polymer composite films
JP7361044B2 (ja) * 2018-11-16 2023-10-13 デンカ株式会社 毛状体を有する熱可塑性樹脂シート及びその成形品
JP7263836B2 (ja) * 2019-02-26 2023-04-25 Dic株式会社 黒色ポリイミド粘着テープ
TWI754156B (zh) * 2019-07-23 2022-02-01 達勝科技股份有限公司 聚醯亞胺多層結構及其製造方法
US11718728B2 (en) 2019-11-21 2023-08-08 Dupont Electronics, Inc. Single layer polymer films and electronic devices
US11535710B2 (en) 2020-03-27 2022-12-27 Dupont Electronics, Inc. Single layer polymer films and electronic devices
CN112430449B (zh) * 2020-11-20 2022-07-29 上海昀通电子科技有限公司 一种用于镜头超级黑镀层的胶黏剂组合物及其制备方法和应用

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CN102482418A (zh) * 2009-08-03 2012-05-30 E.I.内穆尔杜邦公司 无光饰面聚酰亚胺膜及其相关方法
CN103168068A (zh) * 2010-07-23 2013-06-19 E.I.内穆尔杜邦公司 消光整理聚酰亚胺膜及其相关方法

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EP0659553A1 (en) * 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Coextruded multi-layer aromatic polyimide film and preparation thereof
US7018704B2 (en) 2001-09-28 2006-03-28 Kaneka Corporation Polyimide film for flexible printed board and flexible printed board using the same
TWI298334B (en) 2005-07-05 2008-07-01 Chang Chun Plastics Co Ltd Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom
TWI297342B (en) 2006-01-17 2008-06-01 Ind Tech Res Inst Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same
US7790276B2 (en) 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
JP5307523B2 (ja) * 2008-11-27 2013-10-02 日東電工株式会社 シームレスベルト
KR101708520B1 (ko) * 2009-03-06 2017-02-20 이 아이 듀폰 디 네모아 앤드 캄파니 전자 회로 응용을 위한 다층 필름 및 그에 관한 방법
WO2010126047A1 (ja) * 2009-04-28 2010-11-04 宇部興産株式会社 多層ポリイミドフィルム
US9926415B2 (en) * 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) * 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
US20130011645A1 (en) * 2010-03-01 2013-01-10 E. I. Du Pont De Nemours And Company Multilayer film for electronic circuitry applications and methods relating thereto
US8668980B2 (en) * 2010-12-07 2014-03-11 E I Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films
US20120142826A1 (en) * 2010-12-07 2012-06-07 E. I. Du Pont De Nemours And Company Filled polyimide polymers
US20120141758A1 (en) * 2010-12-07 2012-06-07 E.I. Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films
US20120142825A1 (en) * 2010-12-07 2012-06-07 E.I. Du Pont De Nemours And Company Filled polyimide polymers
CN103561953A (zh) * 2011-03-30 2014-02-05 宇部兴产株式会社 聚酰亚胺膜
TWI443016B (zh) 2011-09-09 2014-07-01 Taimide Technology Inc 聚醯亞胺多層膜及其製造方法
JP2013195452A (ja) 2012-03-15 2013-09-30 Fuji Xerox Co Ltd 画像形成装置用複層ポリイミドフィルム、画像形成装置、及び画像形成装置用複層ポリイミドフィルムの製造方法
TWI492970B (zh) 2013-01-28 2015-07-21 Taimide Technology Inc 粉狀呈色消光劑、含有該消光劑之聚醯亞胺膜、及其製造方法
KR102309828B1 (ko) * 2013-12-13 2021-10-08 이 아이 듀폰 디 네모아 앤드 캄파니 다층 필름
US9469781B2 (en) * 2013-12-17 2016-10-18 E I Du Pont De Nemours And Company Multilayer film

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CN102482418A (zh) * 2009-08-03 2012-05-30 E.I.内穆尔杜邦公司 无光饰面聚酰亚胺膜及其相关方法
CN103168068A (zh) * 2010-07-23 2013-06-19 E.I.内穆尔杜邦公司 消光整理聚酰亚胺膜及其相关方法

Also Published As

Publication number Publication date
KR102309828B1 (ko) 2021-10-08
DE112014005687T5 (de) 2016-08-25
DE112014005687B4 (de) 2022-09-01
CN105934337A (zh) 2016-09-07
US9481809B2 (en) 2016-11-01
US20150166832A1 (en) 2015-06-18
JP2017508637A (ja) 2017-03-30
WO2015089161A1 (en) 2015-06-18
JP6434520B2 (ja) 2018-12-05
KR20160096608A (ko) 2016-08-16

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Effective date of registration: 20221118

Address after: Delaware

Patentee after: DuPont Electronics

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Patentee before: E.I. Nemours DuPont