CN105874891A - 铜箔、包含该铜箔的电气部件以及电池 - Google Patents

铜箔、包含该铜箔的电气部件以及电池 Download PDF

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Publication number
CN105874891A
CN105874891A CN201480071903.7A CN201480071903A CN105874891A CN 105874891 A CN105874891 A CN 105874891A CN 201480071903 A CN201480071903 A CN 201480071903A CN 105874891 A CN105874891 A CN 105874891A
Authority
CN
China
Prior art keywords
copper foil
copper
minuteness particle
microfine
sublayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480071903.7A
Other languages
English (en)
Chinese (zh)
Inventor
崔恩实
范元辰
宋基德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Materials Co Ltd
Original Assignee
Iljin Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Materials Co Ltd filed Critical Iljin Materials Co Ltd
Publication of CN105874891A publication Critical patent/CN105874891A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
CN201480071903.7A 2013-12-30 2014-12-26 铜箔、包含该铜箔的电气部件以及电池 Pending CN105874891A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130166916A KR101695236B1 (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지
KR10-2013-0166916 2013-12-30
PCT/KR2014/012942 WO2015102323A1 (ko) 2013-12-30 2014-12-26 동박, 이를 포함하는 전기부품 및 전지

Publications (1)

Publication Number Publication Date
CN105874891A true CN105874891A (zh) 2016-08-17

Family

ID=53493613

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480071903.7A Pending CN105874891A (zh) 2013-12-30 2014-12-26 铜箔、包含该铜箔的电气部件以及电池

Country Status (4)

Country Link
JP (1) JP2017508890A (ko)
KR (1) KR101695236B1 (ko)
CN (1) CN105874891A (ko)
WO (1) WO2015102323A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111031663A (zh) * 2018-10-09 2020-04-17 金居开发股份有限公司 微粗糙电解铜箔及铜箔基板
CN112118669A (zh) * 2019-06-19 2020-12-22 金居开发股份有限公司 进阶反转电解铜箔及应用其的铜箔基板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102399930B1 (ko) * 2017-08-29 2022-05-18 에스케이넥실리스 주식회사 노듈층을 갖는 동박의 제조방법, 이 방법으로 제조된 동박, 이를 포함하는 이차전지용 전극 및 이차전지
TWI719698B (zh) * 2019-06-12 2021-02-21 金居開發股份有限公司 進階反轉電解銅箔及其銅箔基板
JP7392996B2 (ja) * 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 アドバンスド電解銅箔及びそれを適用した銅張積層板
KR102413300B1 (ko) * 2020-12-10 2022-06-27 와이엠티 주식회사 금속박, 이를 포함하는 캐리어 부착 금속박 및 이를 포함하는 인쇄회로기판

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089603A2 (en) * 1999-09-29 2001-04-04 Yates Foil USA, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
CN1335897A (zh) * 1999-11-11 2002-02-13 三井金属鉱业株式会社 有载体的电沉积铜箔及使用该电沉积铜箔制造的包铜层叠物
CN1530469A (zh) * 2003-02-12 2004-09-22 �źӵ�·ͭ����ʽ���� 用于高频率的铜箔及其制造方法
KR20080039035A (ko) * 2006-10-31 2008-05-07 강원대학교산학협력단 리튬 이차 전지용 음극, 및 이를 포함하는 리튬 이차 전지
CN102959775A (zh) * 2010-06-28 2013-03-06 古河电气工业株式会社 电解铜箔、锂离子充电电池用电解铜箔、使用该电解铜箔的锂离子充电电池用电极、使用该电极的锂离子充电电池

Family Cites Families (7)

* Cited by examiner, † Cited by third party
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JP2717910B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JPH07202367A (ja) * 1993-12-28 1995-08-04 Japan Energy Corp 印刷回路用銅箔の表面処理方法
JP3739929B2 (ja) * 1998-03-09 2006-01-25 古河サーキットフォイル株式会社 プリント配線板用銅箔及びその製造方法
WO2004049476A1 (ja) * 2002-11-27 2004-06-10 Mitsui Mining & Smelting Co., Ltd. 非水電解液二次電池用負極集電体およびその製造方法
JP4027255B2 (ja) * 2003-03-28 2007-12-26 三洋電機株式会社 リチウム二次電池用負極及びその製造方法
JP4653510B2 (ja) * 2005-01-04 2011-03-16 Ｊｘ日鉱日石金属株式会社 リチウム２次電池用負極材料
US20110143195A1 (en) * 2009-06-29 2011-06-16 Shuji Ito Negative electrode for lithium ion battery, method for producing the same, and lithium ion battery

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089603A2 (en) * 1999-09-29 2001-04-04 Yates Foil USA, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
CN1335897A (zh) * 1999-11-11 2002-02-13 三井金属鉱业株式会社 有载体的电沉积铜箔及使用该电沉积铜箔制造的包铜层叠物
CN1530469A (zh) * 2003-02-12 2004-09-22 �źӵ�·ͭ����ʽ���� 用于高频率的铜箔及其制造方法
KR20080039035A (ko) * 2006-10-31 2008-05-07 강원대학교산학협력단 리튬 이차 전지용 음극, 및 이를 포함하는 리튬 이차 전지
CN102959775A (zh) * 2010-06-28 2013-03-06 古河电气工业株式会社 电解铜箔、锂离子充电电池用电解铜箔、使用该电解铜箔的锂离子充电电池用电极、使用该电极的锂离子充电电池

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111031663A (zh) * 2018-10-09 2020-04-17 金居开发股份有限公司 微粗糙电解铜箔及铜箔基板
CN111031663B (zh) * 2018-10-09 2023-05-05 金居开发股份有限公司 铜箔基板
CN112118669A (zh) * 2019-06-19 2020-12-22 金居开发股份有限公司 进阶反转电解铜箔及应用其的铜箔基板

Also Published As

Publication number Publication date
WO2015102323A1 (ko) 2015-07-09
KR20150077944A (ko) 2015-07-08
KR101695236B1 (ko) 2017-01-11
JP2017508890A (ja) 2017-03-30

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Application publication date: 20160817

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