CN105828958B - 涂布构件、涂布装置及涂布方法 - Google Patents

涂布构件、涂布装置及涂布方法 Download PDF

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Publication number
CN105828958B
CN105828958B CN201480067703.4A CN201480067703A CN105828958B CN 105828958 B CN105828958 B CN 105828958B CN 201480067703 A CN201480067703 A CN 201480067703A CN 105828958 B CN105828958 B CN 105828958B
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China
Prior art keywords
coating
coating needle
shaft
needle
coated
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Active
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CN201480067703.4A
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English (en)
Chinese (zh)
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CN105828958A (zh
Inventor
山中昭浩
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NTN Corp
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NTN Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/06—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201480067703.4A 2013-12-13 2014-12-10 涂布构件、涂布装置及涂布方法 Active CN105828958B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-258188 2013-12-13
JP2013258188A JP6411735B2 (ja) 2013-12-13 2013-12-13 塗布部材、塗布装置および塗布方法
PCT/JP2014/082636 WO2015087898A1 (ja) 2013-12-13 2014-12-10 塗布部材、塗布装置および塗布方法

Publications (2)

Publication Number Publication Date
CN105828958A CN105828958A (zh) 2016-08-03
CN105828958B true CN105828958B (zh) 2019-03-22

Family

ID=53371200

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480067703.4A Active CN105828958B (zh) 2013-12-13 2014-12-10 涂布构件、涂布装置及涂布方法

Country Status (3)

Country Link
JP (1) JP6411735B2 (enExample)
CN (1) CN105828958B (enExample)
WO (1) WO2015087898A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016107223A (ja) * 2014-12-09 2016-06-20 Ntn株式会社 塗布機構および塗布装置
JP2017094287A (ja) * 2015-11-25 2017-06-01 Ntn株式会社 塗布ユニット、塗布装置、被塗布対象物の製造方法および基板の製造方法
JP6560108B2 (ja) * 2015-11-25 2019-08-14 Ntn株式会社 塗布ユニット、塗布装置、被塗布対象物の製造方法および基板の製造方法
CN108290176A (zh) * 2015-11-25 2018-07-17 Ntn株式会社 涂布单元、涂布装置、涂有材料的对象物的制造方法以及基板的制造方法
JP6830330B2 (ja) * 2016-08-29 2021-02-17 Ntn株式会社 液体塗布ユニット、液体塗布装置、および液体塗布方法
JP6745683B2 (ja) * 2016-08-31 2020-08-26 Ntn株式会社 液体塗布ユニット、液体塗布装置および液体塗布方法
JP6835506B2 (ja) 2016-09-01 2021-02-24 Ntn株式会社 液体塗布ユニットおよび液体塗布装置
JP2018140336A (ja) 2017-02-27 2018-09-13 Ntn株式会社 液体塗布ユニットおよび液体塗布装置
JP6461260B1 (ja) 2017-08-02 2019-01-30 Ntn株式会社 塗布機構及び塗布装置
JP6937466B2 (ja) * 2018-02-26 2021-09-22 パナソニックＩｐマネジメント株式会社 塗布方法と塗布装置と部品の製造方法
US20220371043A1 (en) * 2019-09-12 2022-11-24 Osaka University Application apparatus and application method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775171A (en) * 1980-10-29 1982-05-11 Fujitsu Ltd Resin dropping device
JPH0253162U (enExample) * 1988-10-12 1990-04-17
JPH03161070A (ja) * 1989-11-17 1991-07-11 Hitachi Electron Eng Co Ltd 接着方式
JPH08125320A (ja) * 1994-10-24 1996-05-17 Toshiba Corp 接着剤塗布装置
JPH09314015A (ja) * 1996-05-28 1997-12-09 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
JP2007285516A (ja) * 2006-03-20 2007-11-01 Nsk Ltd 潤滑剤封入装置及び潤滑剤封入方法
JP2007299859A (ja) * 2006-04-28 2007-11-15 Juki Corp 表面実装用接着剤塗布装置
JP2008307455A (ja) * 2007-06-13 2008-12-25 Ntn Corp 塗布方法、塗布装置、微細欠陥修正装置
JP2010062385A (ja) * 2008-09-04 2010-03-18 Ntn Corp フラックス塗布装置およびフラックス塗布方法

Also Published As

Publication number Publication date
WO2015087898A9 (ja) 2015-08-27
JP2015112576A (ja) 2015-06-22
CN105828958A (zh) 2016-08-03
JP6411735B2 (ja) 2018-10-24
WO2015087898A1 (ja) 2015-06-18

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