CN105824162B - 阵列基板及其制作方法、显示装置 - Google Patents

阵列基板及其制作方法、显示装置 Download PDF

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CN105824162B
CN105824162B CN201610382094.2A CN201610382094A CN105824162B CN 105824162 B CN105824162 B CN 105824162B CN 201610382094 A CN201610382094 A CN 201610382094A CN 105824162 B CN105824162 B CN 105824162B
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array substrate
insulating layer
conductive structure
display area
conductive
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CN105824162A (zh
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李东朝
李京鹏
李建
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BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
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Beijing BOE Optoelectronics Technology Co Ltd
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Abstract

本发明涉及显示技术领域，公开了一种阵列基板及其制作方法、显示装置。所述阵列基板包括绝缘层和位于非显示区域的导电结构，所述绝缘层包括至少一个位于非显示区域的开口，所述开口与所述导电结构的位置一一对应，所述导电结构位于所述开口内，使得所述导电结构的表面低于所述绝缘层的表面，从而在取向膜的摩擦取向过程中，摩擦布不与导电材料接触，与摩擦布接触的均为绝缘材料，高速摩擦产生的静电不存在差异，进而对摩擦布的布毛的影响不存在差异，保证摩擦取向质量，提高画面品质。

Description

阵列基板及其制作方法、显示装置
技术领域
本发明涉及显示技术领域，特别是涉及一种阵列基板及其制作方法、显示装置。
背景技术
目前，薄膜晶体管液晶显示器(TFT-LCD)已成为主流的显示产品，其显示品质随制造工艺技术的进步而不断优化，随着对产品品质要求的不断提高，继而对制作工艺的要求也越来越高。
TFT-LCD的主体结构为液晶显示面板，液晶显示面板包括对盒的阵列基板和彩膜基板，以及填充在阵列基板和彩膜基板之间的液晶。阵列基板的非显示区域包括端子区域，所述端子区域包括多个端子，每一端子包括裸露在外的透明导电层，用于与驱动芯片的引脚连接，为显示区域提供显示所需的信号。
为了使液晶分子能够正确地取向，会在阵列基板和彩膜基板显示区域的内侧表面涂上一层取向膜，并通过摩擦取向工艺在取向膜上形成取向沟槽，为液晶分子提供一定的预倾角。
阵列基板除了显示区域裸露在外取向膜外，还包括非显示区域的保护层10＇和端子1＇，结合图1和图2所示，保护层10＇是绝缘材料，而端子1＇是导电材料，因此在高速摩擦时产生的静电有所差异，因此，对摩擦布的布毛的影响存在差异，将会导致布毛紊乱，造成保护层10＇和端子1＇相接处的布毛方向不一致，直接造成摩擦不良，影响画面品质。
发明内容
本发明提供一种阵列基板及其制作方法、显示装置，用以解决因静电差异导致的取向膜摩擦取向不良问题。
为解决上述技术问题，本发明实施例中提供一种阵列基板，包括显示区域和位于显示区域外围的非显示区域，所述阵列基板包括绝缘层，所述绝缘层包括至少一个位于所述非显示区域的开口，所述非显示区域包括至少一个导电结构，所述开口与所述导电结构的位置一一对应，所述导电结构位于所述开口内。
如上所述的阵列基板，优选的是，所述导电结构由透明导电材料制得。
如上所述的阵列基板，优选的是，所述阵列基板还包括栅线和数据线，用于限定多个像素区域；
所述阵列基板的非显示区域还包括与所述栅线同层的第一金属线和与所述数据线同层的第二金属线，所述第一金属线和所述第二金属线一一对应且电性连接；
所述第一金属线和第二金属线与所述导电结构一一对应且电性连接。
如上所述的阵列基板，优选的是，所述阵列基板还包括栅线和数据线，用于限定多个像素区域；
所述阵列基板的非显示区域还包括与所述栅线同层的第一金属线，所述第一金属线与所述导电结构一一对应且电性连接。
如上所述的阵列基板，优选的是，所述阵列基板还包括栅线和数据线，用于限定多个像素区域；
所述阵列基板的非显示区域还包括与所述数据线同层的第二金属线，所述第二金属线与所述导电结构一一对应且电性连接。
本发明实施例中还提供一种显示装置，包括如上所述的阵列基板。
本发明实施例中还提供如上所述的阵列基板的制作方法，所述阵列基板包括显示区域和位于显示区域外围的非显示区域，所述制作方法包括：
形成绝缘层；
在所述绝缘层中形成至少一个位于所述非显示区域的开口；
在所述非显示区域形成至少一个导电结构，所述开口与所述导电结构的位置一一对应，所述导电结构位于所述开口内。
如上所述的制作方法，优选的是，所述制作方法具体包括：
形成所述绝缘层；
在所述绝缘层中形成所述开口；
在所述开口内形成所述导电结构。
如上所述的制作方法，优选的是，所述制作方法具体包括：
形成所述导电结构；
在所述导电结构上形成所述绝缘层；
在所述绝缘层中形成所述开口。
如上所述的制作方法，优选的是，利用透明导电材料形成所述导电结构。
本发明的上述技术方案的有益效果如下：
上述技术方案中，所述阵列基板包括绝缘层和位于非显示区域的导电结构，所述绝缘层包括至少一个位于非显示区域的开口，所述开口与所述导电结构的位置一一对应，所述导电结构位于所述开口内，使得所述导电结构的表面低于所述绝缘层的表面，从而在取向膜的摩擦取向过程中，摩擦布不与导电材料接触，与摩擦布接触的均为绝缘材料，高速摩擦产生的静电不存在差异，进而对摩擦布的布毛的影响不存在差异，保证摩擦取向质量，提高画面品质。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1表示现有技术中阵列基板的端子区域的局部剖视图；
图2表示现有技术中阵列基板的端子区域的局部俯视图；
图3表示本发明实施例中阵列基板的局部剖视图一；
图4表示本发明实施例中阵列基板的局部剖视图二；
图5表示本发明实施例中阵列基板的局部剖视图三；
图6表示本发明实施例中阵列基板的局部剖视图四；
图7表示现有技术中阵列基板的端子区域的局部俯视图。
具体实施方式
下面将结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
实施例一
结合图3-图6所示，本实施例中提供一种阵列基板，包括显示区域和位于显示区域外围的非显示区域，所述非显示区域包括设置在基底100上的至少一个导电结构1，所述导电结构通常由透明导电材料制得，因为相对于金属材料，透明导电材料不易被氧化。其中，导电结构1可以与像素电极或公共电极同层制作，以简化制作工艺，降低成本。
所述阵列基板还包括设置在基底100上的绝缘层11，绝缘层11包括至少一个位于非显示区域的开口12，开口12与导电结构1的位置一一对应，导电结构1位于开口12内，使得导电结构1远离基底100的表面相对于绝缘层11远离基底100的表面更靠近基底100。
上述阵列基板，导电结构1位于开口12内，使得导电结构1远离基底100的表面相对于绝缘层11远离基底100的表面更靠近基底100，即，导电结构1的表面低于绝缘层11的表面，从而在取向膜的摩擦取向过程中，摩擦布不与导电材料接触，与摩擦布接触的均为绝缘材料，高速摩擦产生的静电不存在差异，进而对摩擦布的布毛的影响不存在差异，保证摩擦取向质量，提高画面品质。
所述阵列基板还包括位于显示区域的各显示膜层结构，如：栅线、数据线、像素电极等。其中，所述栅线和数据线用于限定多个像素区域，每一像素区域包括所述像素电极，所述像素电极与公共电极之间形成驱动液晶分子偏转的电场。所述取向膜用于对液晶分子进行取向，使液晶分子规则排列。所述公共电极可以设置在阵列基板上，也可以设置在彩膜基板上。当所述公共电极设置在阵列基板上时，导电结构1可以与所述公共电极同层制作；当所述公共电极设置在彩膜基板上时，导电结构1可以与所述像素电极同层制作，以简化制作工艺。另外，导电结构1由透明导电材料制得，暴露在外，不易被氧化。
为了降低传输电阻，本实施例中，所述阵列基板的非显示区域还包括与所述栅线同层的第一金属线2和/或与所述数据线同层的第二金属线3，用于传输信号。图3和图5中示意的阵列基板，所述阵列基板的非显示区域包括第一金属线2和第二金属线3，第一金属线2和第二金属线3的位置一一对应且电性连接，第一金属线2与第二金属线3之间具有绝缘层10，第一金属线2和第二金属线3具体通过绝缘层10中的过孔电性连接。导电结构1与第一金属线2和第二金属线3一一对应且电性连接。图4和图6中示意的阵列基板，所述阵列基板的非显示区域仅包括第一金属线2，所述阵列基板的非显示区域也可以仅包括第二金属线，导电结构与第二金属线一一对应且电性连接，与图4和图6类似，不再示意。由于栅线和数据线由金属材料制得，如：Cu，Al，Ag，Mo，Cr，Nd，Ni，Mn，Ti，Ta，W等金属以及这些金属的合金，具有较小的传输电阻，降低功耗。
本发明的技术方案通过设置绝缘层11，导电结构1位于开口12内，以克服静电差异导致的摩擦取向不良问题。具体的实现结构可以为：在绝缘层11中形成开口12后，在开口12内形成透明导电材料，由所述透明导电材料形成导电结构1，即，导电结构1填充在开口12内，且导电结构1的表面低于绝缘层11的表面，参见图3和图4所示。也可以在形成导电结构1后，再形成覆盖导电结构1的绝缘层11，然后在绝缘层11上开设开口12，露出导电结构1，即，绝缘层11设置在导电结构1上，参见图5和图6所示。
需要说明的是，本发明的技术方案适用于非显示区域的所有需要暴露在外的导电结构，例如：与集成芯片、柔性电路板连接的导电结构，导电结构1与集成芯片或柔性电路板的引脚位置一一对应。由于导电结构1位于绝缘层11的开口12内，为了方便集成芯片和柔性电路板的安装，可以在绝缘层11上形成凹槽20，如图7所示，凹槽20与集成芯片和柔性电路板的形状配合，凹槽20与多个开口12位于同侧的一端连通，将集成芯片和柔性电路板放置在凹槽20内时，其引脚插入对应的开口12内，与导电结构1贴合，实现集成芯片和柔性电路板的安装。
本实施例中还提供一种显示装置，包括上述的阵列基板，以提高取向膜的摩擦取向质量，提高显示品质。
所述显示装置具体可以为：液晶显示面板、电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
实施例二
本实施例中提供一种实施例一中的阵列基板的制作方法，所述阵列基板包括显示区域和位于显示区域外围的非显示区域，所述制作方法包括：
形成绝缘层；
在所述绝缘层中形成至少一个位于非显示区域的开口，所述开口与所述导电结构的位置一一对应，所述导电结构位于所述开口内。
通过上述步骤形成的阵列基板，其导电结构位于绝缘层的开口内，从而在取向膜的摩擦取向过程中，摩擦布不与导电材料接触，与摩擦布接触的均为绝缘材料，高速摩擦产生的静电不存在差异，进而对摩擦布的布毛的影响不存在差异，保证摩擦取向质量，提高画面品质。
为了实现上述目的，在对取向膜进行摩擦取向之前形成所述绝缘层。具体可以在对取向膜进行摩擦之前形成所述开口，或在对取向膜进行摩擦之后形成所述开口。
可选的，利用透明导电材料(如：铟锌氧化物、铟锡氧化物)形成所述导电结构，以提高导电结构的抗氧化性。进一步地，当公共电极设置在阵列基板上时，通过对同一透明导电层的构图工艺形成所述导电结构和所述公共电极；当所述公共电极设置在彩膜基板上时，通过对同一透明导电层的构图工艺形成所述导电结构和所述像素电极，以简化制作工艺。
在一个具体的实施方式中，结合图3和图4所示，所述阵列基板的制作方法具体包括：
形成绝缘层11；
在绝缘层11中形成开口12；
在开口12内形成导电结构1。
上述步骤首先形成绝缘层，并在绝缘层中形成开口，然后在所述开口中填充导电材料，形成所述导电结构，并保证所述导电结构远离基底100的表面相对于绝缘层11远离基底100的表面更靠近基底100，即，导电结构1的表面低于绝缘层11的表面，从而在对取向膜进行摩擦取向时，摩擦布不与所述导电结构接触，克服了静电差异造成的摩擦不良问题。
在另一个具体的实施方式中，结合图5和图6所示，所述阵列基板的制作方法具体包括：
形成导电结构1；
在导电结构1上形成绝缘层11；
在绝缘层11中形成开口12，开口12与导电结构1的位置一一对应，暴露出对应导电结构1。
上述步骤首先形成所述导电结构，然后再形成绝缘层，并在所述绝缘层中形成开口，暴露出所述导电结构，由于导电结构的表面低于绝缘层的表面，从而在对取向膜进行摩擦取向时，摩擦布不与所述导电结构接触，克服了静电差异造成的摩擦不良问题。
上面两个具体实施方式形成的导电结构暴露在外，并且由于绝缘层的作用，在对取向膜进行摩擦取向的过程中，摩擦布不与所述导电结构接触，克服了因静电差异导致的摩擦取向不良问题。可选的，在对取向膜进行摩擦之前形成所述开口，防止形成所述开口的制作工艺影响取向膜的取向作用。另外，在第一个具体实施方式中，形成所述导电结构时，缺省了掩膜板，降低了生产成本。
应当理解，本说明书所描述的多个实施例仅用于说明和解释本发明，并不用于限定本发明。并且在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和替换，这些改进和替换也应视为本发明的保护范围。

Claims (6)

1.一种阵列基板，包括显示区域和位于显示区域外围的非显示区域，其特征在于，所述阵列基板包括绝缘层，所述绝缘层包括至少一个位于所述非显示区域的开口，所述非显示区域包括至少一个导电结构，所述开口与所述导电结构的位置一一对应，所述导电结构位于所述开口内，所述导电结构与所述开口的侧壁直接接触；
所述阵列基板还包括栅线和数据线，用于限定多个像素区域；
所述阵列基板的非显示区域还包括与所述栅线同层的第一金属线，所述第一金属线与所述导电结构一一对应且电性连接；或者，
所述阵列基板的非显示区域还包括与所述数据线同层的第二金属线，所述第二金属线与所述导电结构一一对应且电性连接。
2.根据权利要求1所述的阵列基板，其特征在于，所述导电结构为透明导电材料。
3.一种显示装置，其特征在于，包括权利要求1-2任一项所述的阵列基板。
4.一种权利要求1-2任一项所述的阵列基板的制作方法，所述阵列基板包括显示区域和位于显示区域外围的非显示区域，所述制作方法包括：
形成绝缘层；
在所述绝缘层中形成至少一个开口；
在所述非显示区域形成至少一个导电结构，所述开口与所述导电结构的位置一一对应，所述导电结构的位于所述开口内，所述导电结构与所述开口的侧壁直接接触。
5.根据权利要求4所述的制作方法，其特征在于，所述制作方法具体包括：
形成所述绝缘层；
在所述绝缘层中形成所述开口；
在所述开口内形成所述导电结构。
6.根据权利要求4所述的制作方法，其特征在于，利用透明导电材料形成所述导电结构。
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