CN105742208B - 基板输送装置和基板输送方法 - Google Patents

基板输送装置和基板输送方法 Download PDF

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Publication number
CN105742208B
CN105742208B CN201510981164.1A CN201510981164A CN105742208B CN 105742208 B CN105742208 B CN 105742208B CN 201510981164 A CN201510981164 A CN 201510981164A CN 105742208 B CN105742208 B CN 105742208B
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Prior art keywords
substrate
detection
unit
deviation
holding
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Chinese (zh)
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CN105742208A (zh
Inventor
林徳太郎
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to CN201910983507.6A priority Critical patent/CN110729215B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manipulator (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Robotics (AREA)
  • Multimedia (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CN201510981164.1A 2014-12-24 2015-12-23 基板输送装置和基板输送方法 Active CN105742208B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910983507.6A CN110729215B (zh) 2014-12-24 2015-12-23 基板输送装置和基板输送方法

Applications Claiming Priority (2)

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JP2014261085A JP6316742B2 (ja) 2014-12-24 2014-12-24 基板搬送装置および基板搬送方法
JP2014-261085 2014-12-24

Related Child Applications (1)

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CN201910983507.6A Division CN110729215B (zh) 2014-12-24 2015-12-23 基板输送装置和基板输送方法

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CN105742208A CN105742208A (zh) 2016-07-06
CN105742208B true CN105742208B (zh) 2019-11-08

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CN201910983507.6A Active CN110729215B (zh) 2014-12-24 2015-12-23 基板输送装置和基板输送方法

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US (1) US9960063B2 (https=)
JP (1) JP6316742B2 (https=)
KR (1) KR102443868B1 (https=)
CN (2) CN105742208B (https=)
TW (1) TWI614833B (https=)

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JP6802726B2 (ja) * 2017-02-14 2020-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、それを備える基板処理装置および基板搬送方法
JP6862903B2 (ja) * 2017-02-23 2021-04-21 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
US11485584B2 (en) 2017-06-06 2022-11-01 Mitsubishi Heavy Industries Machinery Systems, Ltd. Tire conveying apparatus, tire inspection system provided with same, and tire conveying method
TWI660163B (zh) * 2017-06-08 2019-05-21 Mitsubishi Heavy Industries Machinery Systems, Ltd. 輪胎搬運裝置、具備其的輪胎試驗系統及輪胎搬運方法
KR102059567B1 (ko) * 2017-08-21 2019-12-27 피에스케이홀딩스 (주) 기판 반송 장치
JP7023094B2 (ja) * 2017-12-05 2022-02-21 日本電産サンキョー株式会社 ロボット
WO2019146456A1 (ja) * 2018-01-26 2019-08-01 東京エレクトロン株式会社 基板処理装置
KR102099115B1 (ko) * 2018-06-08 2020-04-10 세메스 주식회사 기판 이송 장치, 이를 포함하는 기판 처리 장치 및 기판 틀어짐 보정 방법
KR102512865B1 (ko) * 2018-11-14 2023-03-23 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 반송 방법
JP7211142B2 (ja) * 2019-02-15 2023-01-24 東京エレクトロン株式会社 基板処理装置及び基板処理方法
WO2020196506A1 (ja) * 2019-03-28 2020-10-01 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN112151429A (zh) * 2019-06-26 2020-12-29 弘塑科技股份有限公司 基板传送设备、半导体制程机台及基板传送方法
CN111063636B (zh) * 2019-11-28 2023-03-24 华虹半导体(无锡)有限公司 晶圆水平偏差检测方法、检测装置和炉管设备
JP7429578B2 (ja) * 2020-03-27 2024-02-08 株式会社ダイヘン アライナ装置およびワークの位置ずれ補正方法
JP7553191B2 (ja) * 2020-08-31 2024-09-18 東京エレクトロン株式会社 基板搬送システムの制御方法及び基板搬送システム
KR102624577B1 (ko) * 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7617745B2 (ja) * 2021-01-05 2025-01-20 東京エレクトロン株式会社 プロセスモジュール、基板処理システムおよび処理方法
TWI905688B (zh) * 2023-09-05 2025-11-21 家登精密工業股份有限公司 支撐中柱檢測系統及支撐中柱檢測方法
CN119480700A (zh) * 2024-10-30 2025-02-18 无锡市诺一智能科技有限公司 一种应用于半导体加工的基板输送装置和输送方法

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US20140277690A1 (en) * 2013-03-12 2014-09-18 Tokyo Electron Limited Apparatus for transferring substrate, substrate processing system, method for transferring substrate and memory medium

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US20140277690A1 (en) * 2013-03-12 2014-09-18 Tokyo Electron Limited Apparatus for transferring substrate, substrate processing system, method for transferring substrate and memory medium

Also Published As

Publication number Publication date
JP6316742B2 (ja) 2018-04-25
KR20160078243A (ko) 2016-07-04
KR102443868B1 (ko) 2022-09-16
CN110729215B (zh) 2023-10-13
TW201633442A (zh) 2016-09-16
CN105742208A (zh) 2016-07-06
US9960063B2 (en) 2018-05-01
JP2016122710A (ja) 2016-07-07
TWI614833B (zh) 2018-02-11
CN110729215A (zh) 2020-01-24
US20160189390A1 (en) 2016-06-30

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