CN105654165B - 芯片卡及其承载用载板与成型方法 - Google Patents
芯片卡及其承载用载板与成型方法 Download PDFInfo
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- CN105654165B CN105654165B CN201410730424.3A CN201410730424A CN105654165B CN 105654165 B CN105654165 B CN 105654165B CN 201410730424 A CN201410730424 A CN 201410730424A CN 105654165 B CN105654165 B CN 105654165B
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CN201410730424.3A CN105654165B (zh) | 2014-12-04 | 2014-12-04 | 芯片卡及其承载用载板与成型方法 |
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CN105654165A CN105654165A (zh) | 2016-06-08 |
CN105654165B true CN105654165B (zh) | 2019-03-19 |
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Families Citing this family (3)
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CN106447006A (zh) * | 2016-12-25 | 2017-02-22 | 郑州单点科技软件有限公司 | 一种芯片卡的承载用载板 |
CN106654644A (zh) * | 2016-12-28 | 2017-05-10 | 郑州单点科技软件有限公司 | 一种物联网m2m芯片卡 |
CN112465097A (zh) * | 2019-09-09 | 2021-03-09 | 品瓒国际有限公司 | 用户识别模块及其制作方法 |
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TW200636597A (en) * | 2005-03-14 | 2006-10-16 | Renesas Tech Corp | Integrated circuit (IC) card and its manufacturing method |
CN201000636Y (zh) * | 2007-01-19 | 2008-01-02 | 江阴长电先进封装有限公司 | 模塑方式封装多芯片集成sim卡 |
US20110309152A1 (en) * | 2010-06-22 | 2011-12-22 | Kim Young-Sun | Plastic card package and plastic card package manufacturing method |
CN202013867U (zh) * | 2011-03-24 | 2011-10-19 | 钒创科技股份有限公司 | 薄膜芯片装置 |
EP2568418B1 (en) * | 2011-09-12 | 2015-08-19 | Oberthur Technologies | A microcircuit card and a tool and method for making such a card |
CN103152453A (zh) * | 2013-02-25 | 2013-06-12 | 广东楚天龙智能卡有限公司 | 三合一手机通卡 |
TWM479460U (zh) * | 2014-02-14 | 2014-06-01 | A Men Technology Corp | 晶片卡組合結構(一) |
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Effective date of registration: 20191129 Address after: The independent state of Samoa, a street Luotemo Apia center 2 floor Co-patentee after: XIAMEN MSSB TECHNOLOGY CO.,LTD. Patentee after: Aflash Technology, Co.,Ltd. Address before: The independent state of Samoa, a street Luotemo Apia center 2 floor Patentee before: Aflash Technology, Co.,Ltd. |
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Effective date of registration: 20210713 Address after: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee after: XIAMEN MSSB TECHNOLOGY Co.,Ltd. Address before: The independent state of Samoa, a street Luotemo Apia center 2 floor Patentee before: Aflash Technology, Co.,Ltd. Patentee before: XIAMEN MSSB TECHNOLOGY Co.,Ltd. |
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Address after: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee after: Jingwang Semiconductor (Xiamen) Co.,Ltd. Address before: 361101 room e502b, Taiwan Science and technology enterprise cultivation center, Xiamen Torch hi tech Zone (Xiang'an) Industrial Zone, Fujian Province Patentee before: XIAMEN MSSB TECHNOLOGY CO.,LTD. |