CN106447006A - 一种芯片卡的承载用载板 - Google Patents

一种芯片卡的承载用载板 Download PDF

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Publication number
CN106447006A
CN106447006A CN201611212286.5A CN201611212286A CN106447006A CN 106447006 A CN106447006 A CN 106447006A CN 201611212286 A CN201611212286 A CN 201611212286A CN 106447006 A CN106447006 A CN 106447006A
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sim
arc
card
micro
support plate
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CN201611212286.5A
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尚冠宇
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Zhengzhou Dandian Technology Software Co Ltd
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Zhengzhou Dandian Technology Software Co Ltd
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Priority to CN201611212286.5A priority Critical patent/CN106447006A/zh
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/063Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code the carrier being marginally punched or notched, e.g. having elongated slots
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips

Abstract

本发明公开了一种芯片卡的承载用载板,它涉及芯片技术领域;所述载体板上设置有数个MiniSIM卡安装槽,所述MiniSIM卡安装槽的左右两端均设置有与MiniSIM卡连接的分离线;所述MiniSIM卡安装槽的前后槽壁上设置有载板弧形凸柱,所述MiniSIM卡的外侧设置有与载板弧形凸柱相配合的MiniSIM卡弧形凹槽,所述MiniSIM卡的中部设置有Micro SIM卡安装槽,所述Micro SIM卡安装槽的前后侧壁上设置有Micro SIM卡弧形凸柱,所述Micro SIM卡弧形凸柱与Micro SIM卡上的Micro SIM卡弧形凹槽相配合;本发明便于实现快速拆装,且不易丢失,合理的利用了载板,使用方便。

Description

一种芯片卡的承载用载板
技术领域:
本发明涉及一种芯片卡的承载用载板,属于芯片技术领域。
背景技术:
一般泛称的芯片卡是指嵌设有一芯片模块的卡片,如智能卡(SIM卡)、金融卡或信用卡等,其中智能卡是指用户身份模块(Subscriber Identity Module,SIM),乃是用以保存行动电话服务的用户身份识别数据的智能卡,通称为SIM卡,目前SIM卡分为Mini(迷你)SIM卡、Micro(微)SIM卡及Nano(奈)SIM卡,其分别设具一预定的规格尺寸,如MiniSIM卡为一15mm x 25mm的矩形卡体,Micro SIM卡为一15mm x 12mm的矩形卡体,Nano SIM卡为一8.8mm x 12.3mm的矩形卡体,上述各矩形卡体并非呈现完整的矩形形状,如其一边角上设有切角,但是现有的芯片卡的承载用载板当芯片取出时就无法再次安装在到载板上,特别是MiniSIM卡,导致载板无法使用,
发明内容:
针对上述问题,本发明要解决的技术问题是提供一种芯片卡的承载用载板。
本发明的一种芯片卡的承载用载板,它包含载板体、MiniSIM卡、Micro SIM卡、Nano SIM卡、芯片体;所述载体板上设置有数个MiniSIM卡安装槽,所述MiniSIM卡安装槽的左右两端均设置有与MiniSIM卡连接的分离线;所述MiniSIM卡安装槽的前后槽壁上设置有载板弧形凸柱,所述MiniSIM卡的外侧设置有与载板弧形凸柱相配合的MiniSIM卡弧形凹槽,所述MiniSIM卡的中部设置有Micro SIM卡安装槽,所述Micro SIM卡安装槽的前后侧壁上设置有Micro SIM卡弧形凸柱,所述Micro SIM卡弧形凸柱与Micro SIM卡上的Micro SIM卡弧形凹槽相配合,所述Micro SIM卡的中部设置有Nano SIM卡安装槽,所述Nano SIM卡安装槽的前后侧壁上设置有Nano SIM卡弧形凸柱,所述Nano SIM卡弧形凸柱与Nano SIM卡上的Nano SIM卡弧形凹槽相配合,所述Nano SIM卡上设置有芯片体。
作为优选,所述的MiniSIM卡弧形凹槽、Micro SIM卡弧形凹槽、Nano SIM卡弧形凹槽的结构相同,均为弧形槽体,且弧形槽体的底部安装有挡板。
作为优选,所述载板弧形凸柱、Micro SIM卡弧形凸柱、Nano SIM卡弧形凸柱的结构相同,且弧形凸柱的外表面设置有耐磨层。
与现有技术相比,本发明的有益效果为:便于实现快速拆装,且不易丢失,合理的利用了载板,使用方便。
附图说明:
为了易于说明,本发明由下述的具体实施及附图作以详细描述。
图1为本发明的结构示意图;
图2为本发明中MiniSIM卡的结构示意图;
图3为图2的俯视图;
图4为本发明中弧形凹槽的结构示意图;
图5为本发明中Micro SIM卡的结构示意图;
图6本发明中Nano SIM卡的结构示意图。
具体实施方式:
为使本发明的目的、技术方案和优点更加清楚明了,下面通过附图中示出的具体实施例来描述本发明。但是应该理解,这些描述只是示例性的,而并非要限制本发明的范围。此外,在以下说明中,省略了对公知结构和技术的描述,以避免不必要地混淆本发明的概念。
如图1-6所示,本具体实施方式采用以下技术方案:它包含载板体1、MiniSIM卡2、Micro SIM卡3、Nano SIM卡4、芯片体5;所述载体板1上设置有数个MiniSIM卡安装槽11,所述MiniSIM卡安装槽11的左右两端均设置有与MiniSIM卡2连接的分离线12;所述MiniSIM卡安装槽11的前后槽壁上设置有载板弧形凸柱13,所述MiniSIM卡2的外侧设置有与载板弧形凸柱13相配合的MiniSIM卡弧形凹槽21,所述MiniSIM卡2的中部设置有Micro SIM卡安装槽22,所述Micro SIM卡安装槽22的前后侧壁上设置有Micro SIM卡弧形凸柱23,所述MicroSIM卡弧形凸柱23与Micro SIM卡3上的Micro SIM卡弧形凹槽31相配合,所述Micro SIM卡3的中部设置有Nano SIM卡安装槽32,所述Nano SIM卡安装槽32的前后侧壁上设置有NanoSIM卡弧形凸柱33,所述Nano SIM卡弧形凸柱33与Nano SIM卡4上的Nano SIM卡弧形凹槽41相配合,所述Nano SIM卡4上设置有芯片体5。
进一步的,所述的MiniSIM卡弧形凹槽21、Micro SIM卡弧形凹槽31、Nano SIM卡弧形凹槽41的结构相同,均为弧形槽体,且弧形槽体的底部安装有挡板7。
进一步的,所述载板弧形凸柱13、Micro SIM卡弧形凸柱23、Nano SIM卡弧形凸柱33的结构相同,且弧形凸柱的外表面设置有耐磨层。
本具体实施方式的工作原理为:在使用时,通过分离线12将MiniSIM卡2分离出来,从MiniSIM卡2上可以再次分离Micro SIM卡3、Nano SIM卡4,当需要使用Micro SIM卡3时,将其分离出,同时将MiniSIM卡2安装到载板上,安装时安装在MiniSIM卡安装槽11内,同时MiniSIM卡弧形凹槽21与载板弧形凸柱13相配合实现安装,且MiniSIM卡弧形凹槽21的挡板实现挡接,提高稳定性,不易脱离,当使用Nano SIM卡4时,分离出Nano SIM卡4,MiniSIM卡2安装在载板上,Micro SIM卡3安装在MiniSIM卡2的Micro SIM卡安装槽22内。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (3)

1.一种芯片卡的承载用载板,其特征在于:它包含载板体、MiniSIM卡、Micro SIM卡、Nano SIM卡、芯片体;所述载体板上设置有数个MiniSIM卡安装槽,所述MiniSIM卡安装槽的左右两端均设置有与MiniSIM卡连接的分离线;所述MiniSIM卡安装槽的前后槽壁上设置有载板弧形凸柱,所述MiniSIM卡的外侧设置有与载板弧形凸柱相配合的MiniSIM卡弧形凹槽,所述MiniSIM卡的中部设置有Micro SIM卡安装槽,所述Micro SIM卡安装槽的前后侧壁上设置有Micro SIM卡弧形凸柱,所述Micro SIM卡弧形凸柱与Micro SIM卡上的Micro SIM卡弧形凹槽相配合,所述Micro SIM卡的中部设置有Nano SIM卡安装槽,所述Nano SIM卡安装槽的前后侧壁上设置有Nano SIM卡弧形凸柱,所述Nano SIM卡弧形凸柱与Nano SIM卡上的Nano SIM卡弧形凹槽相配合,所述Nano SIM卡上设置有芯片体。
2.根据权利要求1所述的一种芯片卡的承载用载板,其特征在于:所述的MiniSIM卡弧形凹槽、Micro SIM卡弧形凹槽、Nano SIM卡弧形凹槽的结构相同,均为弧形槽体,且弧形槽体的底部安装有挡板。
3.根据权利要求1所述的一种芯片卡的承载用载板,其特征在于:所述载板弧形凸柱、Micro SIM卡弧形凸柱、Nano SIM卡弧形凸柱的结构相同,且弧形凸柱的外表面设置有耐磨层。
CN201611212286.5A 2016-12-25 2016-12-25 一种芯片卡的承载用载板 Pending CN106447006A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105913113A (zh) * 2016-04-13 2016-08-31 上海哲山科技股份有限公司 无源智能卡的制造方法及无源智能卡

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201048175Y (zh) * 2007-01-24 2008-04-16 硕民企业有限公司 微型记忆卡连接器的结构改良
CN105654165A (zh) * 2014-12-04 2016-06-08 茂邦电子有限公司 芯片卡及其承载用载板与成型方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201048175Y (zh) * 2007-01-24 2008-04-16 硕民企业有限公司 微型记忆卡连接器的结构改良
CN105654165A (zh) * 2014-12-04 2016-06-08 茂邦电子有限公司 芯片卡及其承载用载板与成型方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105913113A (zh) * 2016-04-13 2016-08-31 上海哲山科技股份有限公司 无源智能卡的制造方法及无源智能卡

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Application publication date: 20170222