CN103782310B - 用于制造数据载体的方法 - Google Patents
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Abstract
本发明涉及一种用于制造便携式数据载体、尤其是芯片卡的方法,具有如下方法步骤:提供具有上侧(101)和与上侧(101)相对放置的下侧(102)的载体带(1),其中,具有至少一个接触区(200)的接触场(2)形成在上侧(101);将半导体电路(4)布置在载体带(1)的下侧(102),其中所述半导体电路(4)与相应接触区(200)电导性连接;以及执行注塑成型工艺,使得灌注混合物(6)在所述下侧(102)形成在半导体电路(4)周围,其中所述灌注混合物(6)具有根据便携式数据载体的标准规格的外部尺寸。其中,用于注射灌注混合物(6)的注射通道(7)布置在灌注混合物模具(600)的平行于下侧(102)的一侧,在注射灌注混合物(6)之后,由于注射通道(7),一凹陷(702)留在完成的数据载体中。本发明还涉及一种便携式载体以及便携式数据载体作为用户识别模块的用途。
Description
技术领域
本发明涉及一种用于制造便携式数据载体、尤其是芯片卡的方法,还涉及一种便携式数据载体以及数据载体作为用户识别模块,简称(U)SIM的用途。特别地,本发明涉及制造外部尺寸小于在本申请时标准化的标准尺寸的芯片卡。
背景技术
在ISO/IEC 7816-2标准中,尺寸定义为最小外形,所谓的3FF或“微SIM”或“迷你插件”。这种3FF标准具有大约12mm×15mm的外部尺寸。在ISO/IEC 7816-2标准中,还另外描述了芯片卡的最小尺寸、接触场(contact field)的接触区的数量和准确位置。
依照DE 10 2004 028 218 A1,已知一种用于数据载体的制造方法,其中,提供了还称为箔片载体的载体带。具有单独接触区的接触场形成在载体带的上侧。随后半导体电路放置在与上侧相对布置的下侧,并与上侧的接触区电连接。最后,下侧的半导体电路借助灌注混合物封装。这优选地在注塑成型工艺中进行。此处的灌注混合物的外部尺寸与在便携式数据载体外部尺寸标准规格中所述外部尺寸一致。此处明确地引用DE 10 2004 028218 A1的全部公开内容。在本文中,便携式数据载体通过接触场的物理界面与终端可通信地连接,以交换数据。总体趋势是这些终端会持续变得更小、更紧密并配备有更多功能。由于移动通信终端的日益小型化以及这些装置不断增加的功能能力,期望的是,还减小在终端中操作的便携式数据载体的尺寸。然而,随着终端的进一步小型化,所需的区域并没有减小,使得终端的总体尺寸受到数据载体的标准尺寸的极大影响。
鉴于移动通信终端的日益小型化以及通信终端的日益增长的功能,期望和希望的是,需要进一步减少用于SIM芯片卡(称为“迷你插件”)的标准尺寸。
还要求数据载体仍能在老的通信终端或在需要用于SIM卡的不同外形的终端中操作,从而维持根据ISO/IEC7816-2标准化的接触场还适于未来形式标准。因此,数据载体在未来应当具有的最小可能区域是接触场的区域。
通过依照DE 10 2004 028 218 A1的制造方法,可形成这样的卡体,其不超过接触场的区域,或者在卡体中,接触场的边缘到数据载体本体的边缘区域的距离比在此依照ISO/IEC 7816定义的数据载体的标准更小。当半导体电路通过灌注混合物而模制时,必须确保完成的数据载体能够从灌注混合物模具快速且轻易地移除。因此数据载体的侧区域和上侧之间的侧面角大于零度,特别地为10度。通过侧肋的轻微倾斜,数据载体能从灌注混合物模具更轻易和快速地移除。
在现今ISO/IEC 7816标准中,特别地,数据载体的圆角半径以及数据载体的侧区域和上侧之间的侧面角被严格地预先确定,从而给出了统一构造类型的标准。因此必须假定小于3FF标准的标准化外形也遵从这些限制。从DE 10 2004 028 218 A1中不能得到如何实际上满足对圆角半径和侧面角的这些要求。
另一个问题涉及对数据载体本身的操纵。当数据载体根据需要结合在终端中用于数据交换时,其通常以机械可拆卸的方式固定在终端中,例如通过夹紧、锁定或插入或者一般通过保持数据载体。由于小尺寸,操纵3FF格式的数据载体是困难的,特别是当改变终端中的数据载体时。如果数据载体进一步小型化,则这种操纵会更复杂。
发明内容
因此,本发明之目的是制造数据载体,其更易于操纵,并仍符合未来标准的规格。
本发明之目的通过在相配的独立权利要求中描述的措施来实现。有利实施例在各从属权利要求中加以描述。
特别地,该目的通过用于制造便携式数据载体、尤其是芯片卡的方法来实现。创造性的方法包括以下步骤:提供具有上侧和与上侧相对放置的下侧的载体带,其中具有至少一个接触区的接触场形成在上侧;将半导体电路布置在载体带的下侧,其中该半导体电路与相应的接触区电导性连接;以及执行注塑成型工艺,使得灌注混合物在下侧形成在半导体电路的周围,其中所述灌注混合物具有根据便携式数据载体的标准规格的外部尺寸。该方法的特征在于在注射灌注混合物之后,一凹陷留在完成的数据载体中,位于数据载体主体的平行于下侧的一侧。
术语凹陷指的是数据载体的位于数据载体本体的平行于下侧的一侧上的任何区域下降部。这可以是横向或纵向的导槽、几何图形,例如圆或椭圆或其它不同的结构。
通过这种方法,凹陷以有利的方式布置在数据载体的下侧。该凹陷使用户更易于操纵该数据载体。特别地,当将数据载体结合进终端的保持器(数据载体根据需要结合进保持器)中或从终端的保持器移除数据载体,以与终端进行数据交换时,该凹陷使得可改变数据载体。例如,该凹陷使得用户可以通过他的手指甲或相应物体从保持器移除数据载体。
特别有利地,用于注射灌注混合物的注射通道布置在灌注混合物模具的平行于该载体带下侧的一侧,由此获得该凹陷。这种方式的注射还被公众称作顶浇法。
特别地,该凹陷布置在数据载体的中央,不均匀区域包含在凹陷的内部区域。尽管有不均匀区域,数据载体本体的高度没有超过依照标准规格所述的数据载体本体的最大高度。特别地,在终端中改变该数据载体时,这些不均匀区域使用户更好地操纵数据载体。
特别有利地,灌注混合物是第一灌注混合物,在注塑成型工艺之前,半导体电路已经由第二灌注混合物封装。第二灌注混合物的材料与第一灌注混合物不同。因此第二灌注混合物可以具有更大的侧面角和更大的圆角半径,使得在芯片制造商的制造工艺能够保持不变。然而,为了满足形式标准化的规定,数据载体随后与不同材料再次插入成型。第一灌注混合物的材料具有改进的流动特性,因此通过不同粘性获得了更小的圆角半径。该材料还具有较弱的固化度和更低的稳固性,因此获得了更陡的侧面角。因此可更容易地形成第一灌注混合物的材料。
为了改进对数据载体的分离(singling),载体带被预先打孔,使得在分离数据载体时切割较少的载体带材料。因此,在分离时对数据载体施加较少的机械应力,从而防止载体带和灌注混合物之间的层离。
在分离步骤之前,将数据载体在个性化单元中电子地个性化,由此使数据载体个性化。特别地,在分离步骤前,使数据载体光学地个性化。
有利地,通过将载体带的与灌注混合物连接的部分与载体带的剩余部分分开来分离数据载体。
本发明的思想还涵盖用于与终端进行接触型数据交换的便携式数据载体。该数据载体具有载体带,载体带具有上侧和与上侧相对放置的下侧,具有至少一个接触区的接触场形成在上侧;位于下侧的半导体电路,该半导体电路与至少一个接触区电导性连接;以及灌注混合物材料的数据载体本体,灌注混合物围绕该半导体电路。该灌注复合物具有根据便携式数据载体的标准规格的外部尺寸。完成的数据载体本体具有位于平行于下侧的一侧的凹陷。
数据载体优选地作为根据需要用在终端中的用户识别模块。为此,用户识别模块具有如在技术规格ETSI TS 102 221和ETSI TS 102 671(所谓的通用集成电路,缩写为UICC)中描述的功能。除了上侧之外,用户识别模块的外部轮廓不含金属。
依照本发明的便携式数据载体优选地是具有相应安全功能的数据载体(例如智能卡、芯片卡、代价券和/或在移动通信网络中的用户识别卡),以通过相应的认证来访问安全区域或服务,例如,由移动通信网络提供的移动通信提供商的应用。用户识别模块还可结合作为数据载体中的固定部件,比如M2M模块。
在下文中,参照附图更仔细地说明本发明和其他实施例以及本发明的优点,附图仅仅描述了本发明的实施例示例。附图中相同的部件由相同的附图标记表示。附图不必按比例绘制,附图的单个元件可以以放大的尺寸或简化地示出。
附图说明
图1是依照现有技术的用于制造形成有接触区的便携式数据载体的载体带。
图2是在插入成型之前,依照现有技术的数据载体沿图1的截面线A-A′的横截面。
图3是在插入成型之后,依照现有技术的数据载体沿图1的截面线A-A′的横截面。
图4是在插入成型之前,依照本发明的数据载体沿截面线A-A′的横截面。
图5是在插入成型之后,依照本发明的数据载体的横截面。
图6是在插入成型之后,以替代方式制造的根据本发明的数据载体的横截面。
图7是在插入成型之后,在分离步骤期间依照本发明的数据载体的横截面。
图8是依照本发明的凹陷的实施例示例。
具体实施方式
在图1中,以上侧101的俯视图的形式示出现有技术的一部分载体带1。带1是用于依照本发明的制造方法的原料。该载体带1是例如基于塑料和/或FR4的可滚动载体材料的箔片载体,由此是玻璃纤维增强型环氧层压材料,在各侧具有穿孔100以在处理期间支持传输。同样地,示出位于上侧101的接触场2,具有集成半导体电路4的数据载体主体3布置在载体带1的相对下侧102,数据载体主体在此由虚线指示。
为了在上侧101上形成接触场2,施加电气化学方法,即电镀。接触场2在本文中对应于依照ISO/IEC 7816的芯片卡的标准布局。
在图2中,示出在插入成型之前,依照现有技术的数据载体沿图1的截面线A-A′的横截面。该数据载体具有载体带1,接触区200和位于接触区之间的相应截面线201形成在载体带的上侧101,从而使接触区200彼此电隔离或分开。半导体电路4布置在载体带的下侧102,经由导电连接件5与相应接触区200连接。所述连接件5通过引线接合技术(如在此所示)形成,或通过未示出的倒装芯片技术形成。
常规地,灌注混合物模具600布置在半导体电路4周围,所述模具用于使数据载体形成最终形状。该模具具有布置在与载体带正交的一侧的注射通道7。优选地,该注射通道布置在载体带1附近。用于组成数据载体主体4的灌注混合物6经由注射通道7注入。它围绕整个半导体芯片4和导电连接件5。
半导体电路4是对于芯片卡来说常见的“芯片”,即,通过处理晶片而生产的集成电路,所述集成电路通常具有有限资源计算机的所有特征。制造芯片以及通过施加接触布局、接触区和芯片制备载体带1对公众来说都是已知的,并且在书籍“Vom Plastik zurChipkarte”(“从塑料到芯片卡”)中得到详细描述,或者在由W.Rank1、W.Effing、HanserVerlag编写的、第四版书籍“Handbuch der Chipkarten”(“芯片卡手册”)中得到详细描述。对于执行处理步骤以及集成电路的结构和功能的细节,参见相关文献,特别是所提及的书籍。
图3示出在注塑成型工艺之后,在图1的截面线A-A′处的图2的数据载体。由于灌注混合物6的属性和条件,圆角半径9非常大。此外,侧面角8大于零度。而且,一闪亮物(flash)放置在注射通道7的区域中,所述闪亮物通过该注射工艺而得到。在闪亮物位置的放大图中可以识别出实际形状701偏离灌注混合物模具600的理想形状700。在这种横向注射工艺中(还称为打浇),不能排除的是,所产生的闪亮物形成超出灌注混合物模具的边界,使得超出了数据载体的最大尺寸。
由于相应的未来标准会规定必须减小侧面角和圆角半径并且必须移除闪亮物,因此需要其它制造步骤来制造数据载体从而符合标准。
在图4和图5中,示出用于制造数据载体的依照本发明的第一方法。灌注混合物模具600布置在载体带1的下侧102,其形成具有标准规格的外部尺寸的数据载体主体3。在工艺中要确保的是,侧面角8为零度,此外圆角半径9明显地减小,特别是远远小于以常规制造方法形成的圆角半径。与依照图2和图3的制造方法的明显区别是用于灌注混合物6的注射通道7的布置。这种方法被称为顶浇法,并且在当前的典型应用中,凹陷702导致的惊人效果关于数据载体的操纵具有明显的优点。
在图5中,示出在注射工艺之后,图4所述数据载体。通过顶浇法,即,将注射通道7布置在数据载体主体3的与载体带1的下侧102平行的一侧上,形成凹陷702。从放大图中可看出,不均匀区域703包含在凹陷700内。通过这个凹陷702和包含在其中的不均匀区域703,用户更容易从终端移除数据载体或将数据载体结合在终端内。
在此,数据载体具有带六个或七个接触区200的成形接触场2。数据载体主体3的表面明显小于依照3FF标准至今说明的数据载体的实施例。接触区200彼此电隔离,其由分隔线201标示。依照图4和图5的这种小型化数据载体例如在由申请人于2011年4月29日在GPTO申请的DE 10 2011100 070中得到描述,或在由申请人于2011年5月11日在GPTO申请的DE10 2011101 297中得到描述。还描述了具有七分之一接触区C9的接触场2的构造,其需要额外的分隔线201。当人们希望使用多个不同通信协议(例如USB、ISO、SWP)与终端交换数据时,接触区C9特别有用。从上面提及的申请中还可以得到触点和配线的分配。
此外,图4和图5中制造的数据载体的形状符合未来标准,因为侧面角8和圆角半径9已经适应于当前标准。特别地,数据载体主体的高度h小于或等于与该标准一致的高度。
用于注塑成型工艺的工具包括两个半模,下部半模抵靠载体带1的上侧并且充当基底。上部半模紧靠在载体带1的下侧,在留出空腔的同时围绕具有接触区C1-C9和必要时存在的其它接触结构(例如为焊线的形式)的半导体电路6。由上部半模围绕的空腔具有所完成的便携式数据载体所需的最终形状,在必要时可通过减去载体带1的厚度d来校正高度。特别地,数据载体主体3的最终形状可以是具有如在由ETSI在将来可能讨论的作为新格式的标准尺寸的几何形状。
随后使由此已大部分完成的便携式数据载体个性化。为此,将其中嵌入有半导体电路4的芯片卡本体3带至测试和个性化装置。特别地,所述装置具有带触针的读/写装置,触针依靠在接触区200上以与半导体电路4建立数据连接。接着经由这种数据连接,以常见方式检查半导体电路4,并随后通过例如写入序列号来提供个性化数据。
将已测试的和个性化的便携式数据载体随后供给至标签站,在标签站,例如借助于激光或者通过利用喷墨打印机打印标签或者设置图形元件。数据相关个性化和随后标签化的步骤适宜在滚筒上进行,即,当灌注混合物6仍然与载体带1相连时。在此,穿孔100使得载体带1可简单地移动。
接着,分离已个性化的数据载体。在此,通过合适的工具(例如,冲压工具)去除载体带1的位于灌注混合物外部的部分。载体带1的与灌注混合物6连接的部分保留在灌注混合物6上并成为完成的便携式数据载体的覆盖层。作为冲压的替代,还可通过剪切、使用激光或化学分离来实现载体带1的去除。分离步骤还能够在较早的阶段进行,即,在标签化或在个性化装置中进行个性化之前进行。其它加工步骤例如可在“托盘”,即在具有凹陷的一种托盘中进行,数据载体单独地位于凹陷中。
在图6中,示出图4和5的制造方法的替代例。在此,半导体芯片4最初由第二灌注混合物601封装。需要考虑的是,第二灌注混合物的尺寸小于由标准化数据载体的标准所需的外部尺寸。依照图4和图5中描述的方法,第一灌注混合物现在布置在第二灌注混合物601的周围。很容易就能意识到,在图6中,第一灌注混合物6具有小得多的侧面角8(特别地小于5度)以及更小的圆角半径9。从打浇中产生的闪亮物也通过顶浇过程封装。依照图6所示的凹陷702给数据载体的用户提供改进的操纵。在此,有利地,与内部灌注混合物相比,外部灌注混合物可具有在稳定性、粘性以及固化度方面不同的材料属性,因此,第二材料可以是特别的更加便宜。
在图7中,又示出一种替代的制造方法。除了半导体电路4的第二封装,与标准规格相比,数据载体具有更大的外部尺寸。为了改进侧面角8、圆角半径9以及为了分离的目的,不但从载体带1分离数据载体,而且还在分离时调整灌注混合物。为此,可使用切割工具10或冲压工具。或者,还可通过激光或借助化学工艺来形成最终形状。
在图8中,示出依照本发明的凹陷702。该凹陷702通过注射工具形成。在该实施例中,凹陷702的形状是椭圆的,符合用户手指或指甲的形状。不均匀区域703形成在凹陷702的内部,通过该不均匀区域进一步改进了对数据载体的操纵。
部件列表
1载体带
100穿孔
101上侧
102下侧
2接触场
200接触区
201分隔线
3芯片卡体
h数据载体主体的高度
4半导体电路
5半导体电路和接触区之间的电接触
6第一灌注混合物
600灌注混合物模具
601第二灌注混合物
7注射通道
700理想形状
701实际形状
702凹陷
703不均匀区域
8侧面角
9圆角半径
10冲压工具
A-A’截面线
Claims (16)
1.一种用于制造便携式数据载体的方法,具有如下方法步骤:
-提供具有上侧(101)和与上侧(101)相对放置的下侧(102)的载体带(1),其中,具有至少一个接触区(200)的接触场(2)形成在上侧(101);
-将半导体电路(4)布置在载体带(1)的下侧(102),其中所述半导体电路(4)与相应接触区(200)电导性连接;以及
-执行注塑成型工艺,使得灌注混合物(6)在所述下侧(102)形成在半导体电路(4)周围,其中所述灌注混合物(6)具有根据便携式数据载体的标准规格的外部尺寸,
其特征在于:
-用于注射灌注混合物的注射通道布置在数据载体本体的与载体带的下侧平行的一侧上,从而形成凹陷,
其中所述数据载体是根据需要用于终端中的用户识别模块,所述凹陷(702)设置成在用户识别模块结合进终端和/或从终端分离时使用户识别模块的用户更容易地操纵用户识别模块。
2.依照权利要求1所述的方法,其中,所述便携式数据载体是芯片卡。
3.依照权利要求1-2任一项所述的方法,其中用于注射灌注混合物(6)的注射通道(7)布置在灌注混合物模具(600)的平行于下侧(102)的一侧,从而形成所述凹陷(702)。
4.依照权利要求1-2任一项所述的方法,其中所述凹陷(702)布置在数据载体的中央,并且不均匀区域(703)包含在所述凹陷的内部区域中。
5.依照权利要求1-2任一项所述的方法,其中所述灌注混合物(6)是第一灌注混合物(6),在注塑成型工艺之前,半导体电路(4)已被第二灌注混合物(601)封装。
6.依照权利要求1-2任一项所述的方法,其中所述载体带(1)被预先打孔,使得在分离数据载体时切割较少的载体带材料。
7.依照权利要求1-2任一项所述的方法,其中在分离步骤之前,在个性化单元中将所述数据载体电子地个性化,由此使数据载体个性化。
8.依照权利要求1-2任一项所述的方法,其中在分离步骤前使数据载体光学地个性化。
9.依照权利要求1-2任一项所述的方法,其中通过将载体带(1)的与灌注混合物连接的部分与载体带的剩余部分分开来分离数据载体。
10.一种便携式数据载体,用于与终端进行接触型数据交换,具有:
-载体带(1),具有上侧(101)和与上侧(101)相对放置的下侧(102),其中具有至少一个接触区(200)的接触场(2)形成在上侧(101);
-位于下侧(102)的半导体电路(4),其中所述半导体电路(4)与至少一个接触区(200)电导性连接;
-灌注混合物材料的数据载体主体(3),其中灌注混合物(6)围绕所述半导体电路(4),所述灌注混合物(6)具有根据便携式数据载体的标准规格的外部尺寸;
其特征在于:
-用于注射灌注混合物的注射通道布置在数据载体本体的与载体带的下侧平行的一侧上,从而形成凹陷,
其中所述数据载体是根据需要用于终端中的用户识别模块,所述凹陷(702)设置成在用户识别模块结合进终端和/或从终端移除时使用户识别模块的用户更容易地操纵用户标识模块。
11.依照权利要求10所述的便携式数据载体,其中,所述便携式数据载体是芯片卡。
12.依照权利要求10所述的便携式数据载体,其中所述凹陷(702)具有位于内部区域的不均匀区域(703),其中,尽管有不均匀区域(703),数据载体主体(3)没有超过依照标准规格所述的数据载体主体(3)的最大高度(h)。
13.依照权利要求10至12任一项所述的便携式数据载体,其中所述半导体电路(4)由第一灌注混合物(6)和第二灌注混合物(601)封装,并且其中所述第一灌注混合物(6)的材料与第二灌注混合物(601)不同。
14.依照权利要求13所述的便携式数据载体,其中所述第二灌注混合物(601)的圆角半径(9)大于所述第一灌注混合物(6)的圆角半径(9)。
15.依照权利要求13所述的便携式数据载体,其中所述第二灌注混合物(601)的侧面角(8)大于所述第一灌注混合物(6)的侧面角(8)。
16.依照权利要求10至12任一项所述的数据载体作为根据需要用于终端中的用户识别模块的用途。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US7293716B1 (en) * | 2005-02-17 | 2007-11-13 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
CN101536019A (zh) * | 2006-11-17 | 2009-09-16 | 欧贝特技术公司 | 制造实体的方法以及相应的设备 |
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US6444501B1 (en) * | 2001-06-12 | 2002-09-03 | Micron Technology, Inc. | Two stage transfer molding method to encapsulate MMC module |
DE10227936C1 (de) * | 2002-06-21 | 2003-05-15 | Heraeus Gmbh W C | Verfahren zur Herstellung von Systemträgern aus metallischem Trägerband sowie Metallstreifen mit Trägerbereich für elektrische Bauelemente |
US20070152071A1 (en) * | 2006-01-05 | 2007-07-05 | En-Min Jow | Package method for flash memory card and structure thereof |
DE102008005320A1 (de) | 2008-01-21 | 2009-07-23 | Giesecke & Devrient Gmbh | Kartenförmiger Datenträger |
DE102011100070A1 (de) | 2011-04-29 | 2012-10-31 | Giesecke & Devrient Gmbh | Verfahren zum optischen Personalisieren von tragbaren Datenträgern |
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DE102011101237A1 (de) | 2011-05-11 | 2012-11-15 | Heidelberger Druckmaschinen Ag | System zum Lokalisieren und Identifizieren von wenigstens zwei separaten Gegenständen |
DE102011112031A1 (de) | 2011-05-11 | 2012-11-15 | Giesecke & Devrient Gmbh | Verfahren zum Datenaustausch zwischen Endgerät und Chipkarte |
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US7293716B1 (en) * | 2005-02-17 | 2007-11-13 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
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