CN105593945B - 对人体无害的异向性导电膜组成物及异向性导电膜 - Google Patents
对人体无害的异向性导电膜组成物及异向性导电膜 Download PDFInfo
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- CN105593945B CN105593945B CN201480054014.XA CN201480054014A CN105593945B CN 105593945 B CN105593945 B CN 105593945B CN 201480054014 A CN201480054014 A CN 201480054014A CN 105593945 B CN105593945 B CN 105593945B
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- anisotropic conducting
- acrylic acid
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- C09J7/00—Adhesives in the form of films or foils
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- H01L2224/29399—Coating material
- H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29447—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
- H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29455—Nickel [Ni] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
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KR1020130124421A KR101594483B1 (ko) | 2013-10-18 | 2013-10-18 | 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 디스플레이 장치 |
KR10-2013-0124421 | 2013-10-18 | ||
PCT/KR2014/009783 WO2015057012A1 (ko) | 2013-10-18 | 2014-10-17 | 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 반도체 장치 |
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CN (1) | CN105593945B (ko) |
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WO (1) | WO2015057012A1 (ko) |
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CN1796453A (zh) * | 2004-12-30 | 2006-07-05 | 第一毛织株式会社 | 形成各向异性导电膜用的组合物 |
CN101308711A (zh) * | 2008-04-29 | 2008-11-19 | 刘萍 | 多层结构异方向导电膜及其制备方法 |
KR101202045B1 (ko) * | 2009-12-24 | 2012-11-16 | 제일모직주식회사 | 저온 속경화형 이방 전도성 필름용 조성물 및 이를 이용한 저온 속경화형 이방 전도성 필름 |
CN103160217A (zh) * | 2011-12-16 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
CN103173144A (zh) * | 2011-12-26 | 2013-06-26 | 第一毛织株式会社 | 用于各向异性导电粘附膜的组合物、各向异性导电粘附膜和半导体装置 |
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KR100673778B1 (ko) | 2005-08-19 | 2007-01-24 | 제일모직주식회사 | 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법 |
GB0622150D0 (en) * | 2006-11-06 | 2006-12-20 | Kontrakt Technology Ltd | Anisotropic semiconductor film and method of production thereof |
KR100787381B1 (ko) | 2006-11-16 | 2007-12-24 | 한국과학기술연구원 | 미세 캡슐-도전성 입자 복합체, 이의 제조 방법 및 이를이용한 이방 도전성 접착 필름 |
KR20090068886A (ko) * | 2007-12-24 | 2009-06-29 | 엘지전자 주식회사 | 이방성 도전 필름을 이용한 접속 구조체 및 그의 접속상태검사방법 |
KR20100010694A (ko) * | 2008-07-23 | 2010-02-02 | 주식회사 효성 | 3층 이방성 도전 필름 및 이의 제조방법 |
KR101279980B1 (ko) | 2010-12-29 | 2013-07-05 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
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CN1796453A (zh) * | 2004-12-30 | 2006-07-05 | 第一毛织株式会社 | 形成各向异性导电膜用的组合物 |
CN101308711A (zh) * | 2008-04-29 | 2008-11-19 | 刘萍 | 多层结构异方向导电膜及其制备方法 |
KR101202045B1 (ko) * | 2009-12-24 | 2012-11-16 | 제일모직주식회사 | 저온 속경화형 이방 전도성 필름용 조성물 및 이를 이용한 저온 속경화형 이방 전도성 필름 |
CN103160217A (zh) * | 2011-12-16 | 2013-06-19 | 第一毛织株式会社 | 各向异性导电膜组合物、各向异性导电膜和半导体装置 |
CN103173144A (zh) * | 2011-12-26 | 2013-06-26 | 第一毛织株式会社 | 用于各向异性导电粘附膜的组合物、各向异性导电粘附膜和半导体装置 |
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WO2015057012A1 (ko) | 2015-04-23 |
CN105593945A (zh) | 2016-05-18 |
TWI522399B (zh) | 2016-02-21 |
KR101594483B1 (ko) | 2016-02-16 |
TW201527364A (zh) | 2015-07-16 |
KR20150045140A (ko) | 2015-04-28 |
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