CN103443866B - 用于电子设备中的可烧结的银薄片粘合剂 - Google Patents
用于电子设备中的可烧结的银薄片粘合剂 Download PDFInfo
- Publication number
- CN103443866B CN103443866B CN201180068476.3A CN201180068476A CN103443866B CN 103443866 B CN103443866 B CN 103443866B CN 201180068476 A CN201180068476 A CN 201180068476A CN 103443866 B CN103443866 B CN 103443866B
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- CN
- China
- Prior art keywords
- silver
- electrically conductive
- thin slice
- conductive composition
- composition according
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29339—Silver [Ag] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
结果 | |
银薄片的振实密度 | 5.7g/cc |
体积电阻率 | 1.3×10-5ohm-cm |
导热率 | 94.6W/m°K |
25℃下的模具剪切强度 | 1.6kg/mm2 |
270℃下的模具剪切强度 | 1.4kg/mm2 |
振实密度为5.7g/cc的银薄片 | 91.1重量% | 88.5重量% | 91.8重量% |
溶剂:2-(2-乙氧基乙氧基)-乙基乙酸酯 | 9.9重量% | - | 4.6重量% |
溶剂:碳酸1,2-亚丙酯 | - | 11.5重量% | - |
溶剂:环辛酮 | 3.6重量% | ||
导热率 | 110.9W/m°K | 94.6W/m°K | 119.8W/m°K |
银薄片的振实密度 | 4.9g/cc | 5.2g/cc | 5.7g/cc | 7.4g/cc |
体积电阻率 | 2.0×10-5ohm-cm | 2.3×10-5ohm-cm | 1.3×10-5ohm-cm | 1.4×10-5ohm-cm |
导热率 | 99.9W/m°K | 92.1W/m°K | 94.6W/m°K | |
270℃下的模具剪切强度 | 1.4kg/mm2 | 1.6kg/mm2 | 1.6kg/mm2 |
银研磨润滑剂 | 硬脂酸 | 月桂酸 | 癸酸 |
银薄片的振实密度 | 5.7 | 5.5 | 5.2 |
体积电阻率 | 1.5×10-5ohm-cm | 1.7×10-5ohm-cm | 1.7×10-5ohm-cm |
导热率 | 109.7W/m°K | 71.1W/m°K | 93.2W/m°K |
25℃下的模具剪切强度 | 1.6kg/mm2 | 0.4kg/mm2 | 1.7kg/mm2 |
270℃下的模具剪切强度 | 1.2kg/mm2 | 0.7kg/mm2 | 1.3kg/mm2 |
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161446575P | 2011-02-25 | 2011-02-25 | |
US61/446,575 | 2011-02-25 | ||
PCT/US2011/065336 WO2012115704A1 (en) | 2011-02-25 | 2011-12-16 | Sinterable silver flake adhesive for use in electronics |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103443866A CN103443866A (zh) | 2013-12-11 |
CN103443866B true CN103443866B (zh) | 2018-01-12 |
Family
ID=46721175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180068476.3A Active CN103443866B (zh) | 2011-02-25 | 2011-12-16 | 用于电子设备中的可烧结的银薄片粘合剂 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8974705B2 (zh) |
EP (1) | EP2678866B1 (zh) |
JP (1) | JP5972291B2 (zh) |
KR (1) | KR101997294B1 (zh) |
CN (1) | CN103443866B (zh) |
TW (1) | TWI509631B (zh) |
WO (1) | WO2012115704A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0008660D0 (en) | 2000-04-07 | 2000-05-31 | Arakis Ltd | The treatment of respiratory diseases |
US10000670B2 (en) * | 2012-07-30 | 2018-06-19 | Henkel IP & Holding GmbH | Silver sintering compositions with fluxing or reducing agents for metal adhesion |
KR102362072B1 (ko) * | 2014-02-24 | 2022-02-11 | 헨켈 아게 운트 코. 카게아아 | 소결성 금속 입자 및 전자제품 응용에서의 그의 용도 |
JP6181108B2 (ja) * | 2014-06-19 | 2017-08-16 | アキム株式会社 | 組立装置および組立方法 |
WO2016071005A1 (de) * | 2014-11-03 | 2016-05-12 | Heraeus Deutschland GmbH & Co. KG | Metallsinterzubereitung und deren verwendung zum verbinden von bauelementen |
JP6857125B2 (ja) * | 2014-12-26 | 2021-04-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | 焼結性接合材料およびそれを用いた半導体装置 |
CN107709418B (zh) | 2015-05-08 | 2021-04-27 | 汉高知识产权控股有限责任公司 | 可烧结的膜和膏及其使用方法 |
KR102524435B1 (ko) | 2015-12-23 | 2023-04-24 | 헨켈 아게 운트 코. 카게아아 | 전도성 조성물을 위한 결합제로서의 중합체 에멀젼 |
JP6982064B2 (ja) * | 2016-09-15 | 2021-12-17 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | コーティングおよびギャップ充填用途のためのグラフェン含有材料 |
US20180190593A1 (en) * | 2016-12-30 | 2018-07-05 | Intel Corporation | Conductive adhesive layer for semiconductor devices and packages |
KR102521531B1 (ko) | 2017-08-31 | 2023-04-14 | 한국광기술원 | 금속환원성 유기물로 코팅된 은 및 구리 나노입자를 포함하는 전자소자 접착용 조성물 및 이의 제조방법, 이를 적용한 전자기기 |
KR20220115953A (ko) * | 2019-12-20 | 2022-08-19 | 헨켈 아게 운트 코. 카게아아 | 금속 결합을 위한 구리 합금을 함유하는 은 소결 조성물 |
TW202302795A (zh) * | 2021-04-30 | 2023-01-16 | 德商漢高智慧財產控股公司 | 可燒結之導電組合物 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6036889A (en) * | 1995-07-12 | 2000-03-14 | Parelec, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decomposition compounds |
CN101255321A (zh) * | 2007-01-10 | 2008-09-03 | 国家淀粉及化学投资控股公司 | 晶片涂布用高传导性组合物 |
CN101505911A (zh) * | 2005-03-07 | 2009-08-12 | 摩托罗拉公司 | 高能焊接组合物和焊接方法 |
JP2010180471A (ja) * | 2009-02-09 | 2010-08-19 | Dowa Electronics Materials Co Ltd | フレーク状銀粉及びその製造方法、並びに導電性ペースト |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0950082B1 (en) * | 1997-01-06 | 2003-04-23 | Quantum Materials, Inc. | Reducing void formation in curable adhesive formulations |
TW502049B (en) * | 1997-11-06 | 2002-09-11 | Carmel Olefins Ltd | Electrically conductive compositions and methods for producing same |
JP2001307547A (ja) * | 2000-04-25 | 2001-11-02 | Murata Mfg Co Ltd | 導電性組成物およびそれを用いた印刷回路板 |
US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
JP4320447B2 (ja) * | 2004-02-03 | 2009-08-26 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
JP4964152B2 (ja) * | 2005-03-04 | 2012-06-27 | インクテック カンパニー リミテッド | 導電性インク組成物及びこの製造方法 |
US20060289837A1 (en) * | 2005-06-23 | 2006-12-28 | Mcneilly Kirk | Silver salts of dicarboxcylic acids for precious metal powder and flakes |
EP1950767B1 (en) | 2005-09-21 | 2012-08-22 | Nihon Handa Co., Ltd. | Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board |
US7833439B2 (en) * | 2007-07-24 | 2010-11-16 | Ferro Corporation | Ultra low-emissivity (ultra low E) silver coating |
EP3042727B1 (en) * | 2007-10-24 | 2017-08-30 | DOWA Electronics Materials Co., Ltd. | Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles |
JP5389052B2 (ja) * | 2008-01-30 | 2014-01-15 | ダウ・コーニング・コーポレイション | プリンタブルエレクトロニクス用の剥離コーティングとしてのガラス状シリコーン系ハードコーティングを備える電子デバイスの製造方法 |
DE102009040078A1 (de) | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metallpaste mit CO-Vorläufern |
DE102009040076A1 (de) * | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metallpaste mit Oxidationsmittel |
-
2011
- 2011-12-15 TW TW100146593A patent/TWI509631B/zh not_active IP Right Cessation
- 2011-12-16 CN CN201180068476.3A patent/CN103443866B/zh active Active
- 2011-12-16 JP JP2013555416A patent/JP5972291B2/ja not_active Expired - Fee Related
- 2011-12-16 WO PCT/US2011/065336 patent/WO2012115704A1/en active Application Filing
- 2011-12-16 KR KR1020137022009A patent/KR101997294B1/ko active IP Right Grant
- 2011-12-16 EP EP11859486.0A patent/EP2678866B1/en active Active
-
2013
- 2013-03-13 US US13/799,002 patent/US8974705B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6036889A (en) * | 1995-07-12 | 2000-03-14 | Parelec, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decomposition compounds |
CN101505911A (zh) * | 2005-03-07 | 2009-08-12 | 摩托罗拉公司 | 高能焊接组合物和焊接方法 |
CN101255321A (zh) * | 2007-01-10 | 2008-09-03 | 国家淀粉及化学投资控股公司 | 晶片涂布用高传导性组合物 |
JP2010180471A (ja) * | 2009-02-09 | 2010-08-19 | Dowa Electronics Materials Co Ltd | フレーク状銀粉及びその製造方法、並びに導電性ペースト |
Also Published As
Publication number | Publication date |
---|---|
JP2014512634A (ja) | 2014-05-22 |
EP2678866A4 (en) | 2017-03-08 |
CN103443866A (zh) | 2013-12-11 |
WO2012115704A1 (en) | 2012-08-30 |
EP2678866B1 (en) | 2019-02-27 |
TW201237887A (en) | 2012-09-16 |
KR101997294B1 (ko) | 2019-07-05 |
US8974705B2 (en) | 2015-03-10 |
JP5972291B2 (ja) | 2016-08-17 |
US20130187102A1 (en) | 2013-07-25 |
EP2678866A1 (en) | 2014-01-01 |
TWI509631B (zh) | 2015-11-21 |
KR20140007850A (ko) | 2014-01-20 |
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Owner name: HENKEL US IP LLC Free format text: FORMER OWNER: HENKEL CORP. Effective date: 20141106 Owner name: HENKEL CORP. Free format text: FORMER OWNER: HENKEL US IP LLC Effective date: 20141106 |
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