CN105591015B - 发光器件封装和包括该发光器件封装的照明系统 - Google Patents

发光器件封装和包括该发光器件封装的照明系统 Download PDF

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Publication number
CN105591015B
CN105591015B CN201510757038.8A CN201510757038A CN105591015B CN 105591015 B CN105591015 B CN 105591015B CN 201510757038 A CN201510757038 A CN 201510757038A CN 105591015 B CN105591015 B CN 105591015B
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China
Prior art keywords
emitting device
light emitting
groove
device package
body portion
Prior art date
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CN201510757038.8A
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English (en)
Chinese (zh)
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CN105591015A (zh
Inventor
李恩得
吴政勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140155156A external-priority patent/KR102224242B1/ko
Priority claimed from KR1020150006651A external-priority patent/KR102374170B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN105591015A publication Critical patent/CN105591015A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201510757038.8A 2014-11-10 2015-11-09 发光器件封装和包括该发光器件封装的照明系统 Active CN105591015B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020140155156A KR102224242B1 (ko) 2014-11-10 2014-11-10 발광소자 패키지 및 이를 구비하는 조명 시스템
KR10-2014-0155156 2014-11-10
KR10-2015-0006651 2015-01-14
KR1020150006651A KR102374170B1 (ko) 2015-01-14 2015-01-14 발광소자 패키지, 및 이를 포함하는 조명시스템

Publications (2)

Publication Number Publication Date
CN105591015A CN105591015A (zh) 2016-05-18
CN105591015B true CN105591015B (zh) 2020-05-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510757038.8A Active CN105591015B (zh) 2014-11-10 2015-11-09 发光器件封装和包括该发光器件封装的照明系统

Country Status (4)

Country Link
US (1) US10347803B2 (https=)
EP (1) EP3018720B1 (https=)
JP (1) JP6730017B2 (https=)
CN (1) CN105591015B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4276922A3 (en) * 2016-10-25 2024-02-21 Seoul Semiconductor Co., Ltd. Display apparatus based on light-emitting diode packages
CN107731989A (zh) * 2017-11-21 2018-02-23 苏州市悠文电子有限公司 沉降式发光二极管
DE102018106238A1 (de) * 2018-03-16 2019-09-19 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zur herstellung desselben
JP7082280B2 (ja) * 2018-03-30 2022-06-08 日亜化学工業株式会社 発光装置
WO2022119050A1 (ko) 2020-12-03 2022-06-09 삼성전자주식회사 엘이디 칩 및 이를 포함하는 디스플레이 장치

Citations (2)

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CN202084573U (zh) * 2011-02-15 2011-12-21 晶诚（郑州）科技有限公司 一种大功率led封装结构
CN102318091A (zh) * 2009-03-10 2012-01-11 株式会社纳沛斯Led Led引线框封装、使用led引线框封装的led封装及制造led封装的方法

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KR20030017248A (ko) * 2001-08-24 2003-03-03 주식회사 유피디 플라즈마 디스플레이 패널의 격벽 형성용 매립형 소프트몰드 제작방법 및 그를 이용한 격벽 형성방법
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
US7279346B2 (en) 2004-03-31 2007-10-09 Cree, Inc. Method for packaging a light emitting device by one dispense then cure step followed by another
EP1928029B1 (en) * 2005-09-20 2018-10-31 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode package
KR100820529B1 (ko) * 2006-05-11 2008-04-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법, 면 발광 장치
KR101198762B1 (ko) * 2006-06-22 2012-11-12 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
US20080029775A1 (en) 2006-08-02 2008-02-07 Lustrous Technology Ltd. Light emitting diode package with positioning groove
WO2009066670A1 (ja) 2007-11-20 2009-05-28 Nanoteco Corporation 白色ｌｅｄ装置およびその製造方法
WO2009094799A1 (en) 2008-01-23 2009-08-06 Helio Optoelectronics Corporation A base structure for led that has no halo
DE102009018088A1 (de) * 2008-04-30 2009-12-24 Ledon Lighting Jennersdorf Gmbh Modul zur Homogenisierung von Licht, das von einer Festkörper-Lichtquelle (z.B. einer LED) emittiert wird
JP5238366B2 (ja) * 2008-06-09 2013-07-17 スタンレー電気株式会社 半導体発光装置
JP2010010474A (ja) * 2008-06-27 2010-01-14 Kyocera Corp 発光装置
US8039862B2 (en) 2009-03-10 2011-10-18 Nepes Led Corporation White light emitting diode package having enhanced white lighting efficiency and method of making the same
JP2011049421A (ja) * 2009-08-28 2011-03-10 Origin Electric Co Ltd 絶縁封止電子部品及びその製造方法
JP5919504B2 (ja) * 2011-06-30 2016-05-18 パナソニックＩｐマネジメント株式会社 発光装置
US20130069088A1 (en) * 2011-09-20 2013-03-21 The Regents Of The University Of California Light emitting diode with conformal surface electrical contacts with glass encapsulation
US9263658B2 (en) * 2012-03-05 2016-02-16 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
CN103378252B (zh) * 2012-04-16 2016-01-06 展晶科技(深圳)有限公司 发光二极管模组
JP6108794B2 (ja) * 2012-11-29 2017-04-05 シチズン時計株式会社 発光装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102318091A (zh) * 2009-03-10 2012-01-11 株式会社纳沛斯Led Led引线框封装、使用led引线框封装的led封装及制造led封装的方法
CN202084573U (zh) * 2011-02-15 2011-12-21 晶诚（郑州）科技有限公司 一种大功率led封装结构

Also Published As

Publication number Publication date
CN105591015A (zh) 2016-05-18
EP3018720B1 (en) 2017-07-26
US10347803B2 (en) 2019-07-09
US20160133804A1 (en) 2016-05-12
JP2016092410A (ja) 2016-05-23
JP6730017B2 (ja) 2020-07-29
EP3018720A1 (en) 2016-05-11

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Effective date of registration: 20210812

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China