CN105491795B - A kind of manufacturing method of metallized ceramic base plate and the metallized ceramic base plate manufactured by this method - Google Patents
A kind of manufacturing method of metallized ceramic base plate and the metallized ceramic base plate manufactured by this method Download PDFInfo
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- CN105491795B CN105491795B CN201410477530.5A CN201410477530A CN105491795B CN 105491795 B CN105491795 B CN 105491795B CN 201410477530 A CN201410477530 A CN 201410477530A CN 105491795 B CN105491795 B CN 105491795B
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Abstract
A kind of method and metallized ceramic base plate for increasing ceramic substrate copper layer thickness.This method includes the following steps：（1）Laser boring is carried out on ceramic substrate, to form lower through-hole on the ceramic substrate；（2）In step（1）It is formed on the ceramic substrate of lower through-hole and carries out through-hole printing and pattern printing, to form certain thickness circuit pattern on the ceramic substrate, the pattern printing includes design and manufacture pattern printing silk screen plate, wherein, the process of the design includes each independent pattern being connected respectively with two straight lines, so that the circuit pattern being electrically insulated from one another forms whole plate and conducts；（3）High temperature sintering step（2）It is middle to form the ceramic substrate conducted；（4）To step（3）Copper electroplating layer is carried out through sintered ceramic substrate.The method of the present invention can produce ceramic substrate of the copper layer thickness at 30 100 μm, and production cost is substantially reduced compared to thick film and membrane process.
Description
Technical field
The present invention relates to a kind of method for increasing ceramic substrate copper layer thickness and the ceramic metallizations manufactured by this method
Substrate.
Background technology
Nowadays, the electric current of power module assembly and voltage are just continuously increased, in order to meet its resistance to high current, resistance to big voltage
With the demand of height heat dissipation, usual way is to increase ceramic substrate copper layer thickness.
There are mainly two types of methods, respectively membrane process and thick film for ceramic substrate method for metallising.
Membrane process mainly includes：Ceramic substrate is done into pretreatment cleaning first, utilizes film specialized fabrication technology-Vacuum Deposition
Film mode is in sputter a thin layer copper metal composite bed on ceramic substrate, then with the photoresist of yellow light lithographic coating exposure, development, erosion
It carves, metal line making is completed after striping processing procedure, finally increase the thickness of circuit in a manner of plating or electroless deposition again, it should
Method is mainly using etching mode, therefore circuit spacing is smaller, from micron order（10-60μm）To nanoscale（10-90nm）, but
Equipment investment needed for this method is high and maintenance is not easy, and larger to the pressure of environmental protection.
Thick film mainly includes：Through-hole is got on ceramic substrate with laser-beam drilling machine first, is then printed using through-hole
The upper and lower circuitous pattern that conducts and metallize to form independent pattern on substrate is printed with pattern, vacuum-sintering is then carried out, removes
The organic solvent and organic binder bond in slurry are removed, finally plates last layer NiPdAu coating on pattern in a manner of electroless deposition
Or nickel gold plate or other coating.This method has the following disadvantages：1）Coating surface flatness is low, and error amount is about 1-3 μm；2）
It is low that with silk-screen plate tension and print pass relative position precision is influenced by printing；3）It is limited to print copper layer thickness, generally 10-
30 μm, layers of copper is thicker, and pattern edge layers of copper collapses more serious, influences substrate insulating properties, and production cost can greatly improve.But
It is the situation that thin copper layer thickness cannot meet resistance to high current, resistance to big voltage and high heat dissipation.
It is therefore proposed that it is a kind of it is new formed on ceramic substrate it is thicker（20-100μm）The method of layers of copper is very necessary, with
The shortcomings of avoiding prior art processing procedure length and high equipment investment.
Invention content
In view of the technique of the increase copper thickness of the prior art has the shortcomings that processing procedure is long, of high cost and environment is unfriendly, this hair
It is bright to provide a kind of method for increasing ceramic substrate copper layer thickness and the metallized ceramic base plate manufactured by this method.
The present invention provides the method for increasing ceramic substrate copper layer thickness, this method includes the following steps：
（1）Laser boring is carried out on ceramic substrate, to form lower through-hole on the ceramic substrate；
（2）In step（1）It is formed on the ceramic substrate of lower through-hole and carries out through-hole printing and pattern printing, with described
Certain thickness circuit pattern is formed on ceramic substrate, the pattern printing includes design and manufacture pattern printing silk screen
Plate, wherein, the process of the design includes each independent pattern being connected respectively with two straight lines, so as to be electrically insulated from one another
Circuit pattern formed whole plate conduct；
（3）High temperature sintering step（2）It is middle to form the ceramic substrate conducted；
（4）To step（3）Copper electroplating layer is carried out through sintered ceramic substrate.
The present invention also provides the metallized ceramic base plates manufactured by the above method.
The copper layer thickness of the metallized ceramic base plate of this method production at 20-100 μm, effect better than thick film and with it is thin
Embrane method is suitable, and the entire technological process of the present invention is shortened compared with membrane process, reduces manufacturing cost.
Description of the drawings
Fig. 1 is the integrated artistic flow chart of the embodiment of the present invention；
Fig. 2 is the figure formed during a kind of pattern printing of the prior art；
The figure that Fig. 3 is formed when being and carrying out pattern printing according to an embodiment of the invention.
Specific embodiment
The specific embodiment of the present invention is described in detail below.It is it should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
The present invention provides a kind of method for increasing ceramic substrate copper layer thickness, this method includes the following steps：
（1）Laser boring is carried out on ceramic substrate, to form lower through-hole on the ceramic substrate；
（2）In step（1）It is formed on the ceramic substrate of lower through-hole and carries out through-hole printing and pattern printing, with described
Certain thickness circuit pattern is formed on ceramic substrate, the pattern printing uses the drawing making pattern printing silk designed
The mutual independent pattern of each script is together in series, in this way by halftone with two thin straight line respectively mainly in design
It can conduct the circuit pattern being electrically insulated from one another originally formation, meet plating conditions；
（3）High temperature sintering step（2）It is middle to form the ceramic substrate conducted；
（4）To step（3）Copper electroplating layer is carried out through sintered ceramic substrate.
Step（1）In, the process of the laser boring can include：With ceramic laser puncher SF-HFP-3000 to pottery
Porcelain substrate carries out the punch operation of through-hole and location hole, wherein, the condition of punching can include：Laser power is 2100-
2700W, laser pulse width 0.20-0.70ms, laser frequency 1HZ.
In the present invention, in the upper lower through-hole, upper aperture can be 100-140 μm, and lower aperture can be 80-100 μm.It is excellent
In the case of choosing, the upper aperture is 125-140 μm, and the lower aperture is 90-100 μm, may further ensure that copper slurry fills in this way
Filling through-hole is divided to meet the requirement that upper and lower pattern conducts.
It is well known by those skilled in the art that after the laser boring has been carried out, need to ceramic substrate cleaning solution
It is cleaned to remove laser boring margin residual object, the process of the cleaning can include：8- is impregnated with 6-20wt% dust technologies
24 hours, grinding removing laser boring margin residual object after point three sections of adverse currents are washed.The detailed process of the cleaning is this field
Conventional selection, details are not described herein.
The type of the ceramic substrate is not particularly limited in the present invention, can be alumina ceramic-base usually
Plate, aluminum nitride ceramic substrate or silicon carbide ceramics substrate.From the coating for further improving the ceramic substrate and subsequently forming
The angle of bonding force is set out, and the ceramic substrate is preferably aluminium oxide ceramic substrate or aluminum nitride ceramic substrate.
The thickness of the ceramic substrate can be the selection of this field routine, for example, can be 0.25-0.63mm.
Step（2）In, the process of the through-hole printing and pattern printing can include：First bronze medal is starched into stirring 0.5-1.5h
Afterwards, via through holes printing machine carries out through-hole printing, then dries 10-30min；After second bronze medal is starched stirring 0.5-2h, printed through pattern
Brush machine carries out pattern printing, re-dry 10-30min.
The first bronze medal slurry, the second bronze medal slurry carry out through-hole printing for this field, pattern prints common copper slurry.Generally
Ground, the copper slurry can contain copper powder, silver powder, organic solvent, organic bond and active metal.
In first bronze medal slurry and the second bronze medal slurry, organic solvent, organic bond and active metal all can be abilities
The selection of domain routine, wherein, the organic solvent can be terpinol, toluene, methylcellulose or ethyl cellulose；It is described to have
Machine adhesive can be such as at least one of PMMA, methylcellulose and ethyl cellulose；The active metal can be Ti,
At least one of Zr and Hf.
Preferably, the viscosity of the first bronze medal slurry can be controlled in 100-180mPas, and the viscosity of the second bronze medal slurry can
To control in 150-200mPas.
In the present invention, the condition of pattern printing so that the thickness for the figure to be formed is preferably 15-35 μm, in this way can be with
While avoiding detaching with ceramics because being sintered layers of copper caused by copper layer thickness deficiency, pattern printing cost is reduced.It is highly preferred that
The condition of the pattern printing so that the thickness for the figure to be formed is 10-20 μm.
Step（3）In, the method for the high temperature sintering is the selection of this field routine, for example, the condition of high temperature sintering can
To include the first stage carried out successively and second stage.The temperature of the first stage can be 350-450 DEG C, preferably
390-410℃；Time can be 0.5-2 hours, preferably 1-1.5 hours.The temperature of the second stage can be 850-950
DEG C, preferably 860-880 DEG C；Time can be 2-4 hours, preferably 2.5-3 hours.
Step（3）In, the high temperature sintering is 1 × 10 preferably in vacuum degree-5-1×10-4It is carried out under Pa.
It is further preferred that the condition of the high temperature sintering so that the thickness of circuit pattern is 2-6 μm, it so on the one hand can
To meet the requirement of the binding force between layers of copper and ceramics, the cost of pattern printing on the other hand can be reduced.
Step（4）In, carrying out the process of copper electroplating layer can include：Successively by step（3）Through sintered ceramic substrate
Carry out pickling, double washings, pickling, electro-coppering, double washings and drying.The detailed process of progress copper electroplating layer is on ceramic substrate
The selection of this field routine, details are not described herein.
In the present invention, the thickness of the layers of copper formed after copper electroplating layer is preferably 20-100 μm, on the one hand can reduce system
This is caused, on the other hand can guarantee that metallized ceramic base plate obtained has higher resistance to electric current, proof voltage and high heat radiation energy again
Power.
In order to further improve the corrosion resistance of the metallized ceramic base plate and conductive capability.By step（4）, that is,
To step（3）After sintered ceramic substrate carries out copper electroplating layer, the method further includes：（5）In the pottery for being formed with layers of copper
The surface of porcelain substrate carries out plating NiPdAu or nickel gold.Plate selection of the method for NiPdAu or nickel gold for this field routine.Herein
It is not repeating.
The present invention also provides the metallized ceramic base plates manufactured by the above method.The ceramic metal manufactured using the above method
The manufacture of categoryization substrate is at low cost, has higher resistance to high current, resistance to big voltage and high heat-sinking capability.In addition, the ceramic metal
There is higher bonding force between the ceramic substrate of categoryization substrate and the layers of copper of formation.
The present invention is further described With reference to embodiment, but can not therefore limit the scope of the invention.
In following embodiment, using the copper layer thickness of 760 measurement line layers of PCB special purpose copper thickness testers CMI.Line layer
Adhesive strength test method be：It is tested using ailhead vertical tension and measures film adhesion, after wiring board is cleaned, with strong
Ailhead is sticked at copper wire layer surface by power organic adhesive, is then measured ailhead and wiring board and is separated required power, dynamometry dress
It is spring scale to put, full scale 10kgf, minimum scale 0.1kgf, therefore accuracy is 0.05kgf, and tensile speed is
1.5cm/min。
Embodiment
This implementation is for illustrating the method for the increase ceramic substrate copper layer thickness of the present invention and the pottery that is manufactured by this method
Porcelain metallized substrate.
First with ceramic laser puncher SF-HFP-3000 to AlN ceramic（4.5 inch of size, thickness 0.381mm, purchase
From Tokuyama Co., Ltd）Punch operation is carried out, wherein, the condition of punching can include：Laser power is 2700W, laser pulse width
For 0.30ms, laser frequency 1Hz, the upper aperture in the upper lower through-hole of formation is 125-135 μm, and lower aperture is 95-100 μm.
Then, the AlN ceramic is impregnated 16 hours with 10wt% dust technologies, grinding removing laser boring edge is residual after point three sections of washings
Stay object.Then carry out through-hole printing and pattern printing respectively with through-hole printing machine and pattern printing machine, through-hole printing use the
One bronze medal slurry viscosity is 100mPas（Purchased from opening up from up to company of electric wire Co., Ltd., preceding stirring 40 minutes is used）, pattern, which prints, to be made
Second bronze medal slurry viscosity is in 150mPas（Purchased from opening up from up to company of electric wire Co., Ltd., preceding stirring 1 hour is used）, every time
In 100 DEG C of dry 20min, the figure that pattern printing copper layer thickness is 14 μm, then by ceramic substrate in drying box after printing
It is put into sintering furnace, is 0.3 × 10 in vacuum degree-4Under conditions of Pa, kept respectively when 400 DEG C and 880 DEG C 1 hour and 3 small
When, entire sintering duration 8 hours, including temperature fall time.Sintered substrate copper layer thickness is maintained at 60% or so i.e. 8.4 μ
M, 0.3 μm of layers of copper surface roughness Ra ＜ after being ground by grinder, finally progress electro-coppering operation, current density 16ASF,
80 μm of copper layer thickness is formed, the adhesive strength of line layer is 11Kgf after tested.
Claims (8)
1. a kind of method for increasing ceramic substrate copper layer thickness, this method include the following steps：
(1) laser boring is carried out on ceramic substrate, to form lower through-hole on the ceramic substrate；
(2) it is formed on the ceramic substrate of upper lower through-hole in step (1) and carries out through-hole printing and pattern printing, in the ceramics
Certain thickness circuit pattern is formed on substrate, the pattern printing includes design and manufacture pattern printing silk screen plate,
Wherein, the process of the design includes each independent pattern being connected respectively with two straight lines, so as to be electrically insulated from one another
Circuit pattern forms whole plate and conducts；
(3) ceramic substrate conducted is formed in high temperature sintering step (2)；
(4) copper electroplating layer is carried out through sintered ceramic substrate to step (3)；
Starched using the first bronze medal and carry out through-hole printing, the viscosity control of the first bronze medal slurry in 100-180mPas, using the second bronze medal starch into
Row pattern prints, and the viscosity of the second bronze medal slurry is controlled in 150-200mPas；
The high temperature sintering includes the first stage carried out successively and second stage, and the temperature of first stage is 350-450 DEG C, when
Between be 0.5-2 hours；The temperature of second stage is 850-950 DEG C, and the time is 2-4 hours.
2. according to the method described in claim 1, wherein, in the upper lower through-hole, upper aperture is 125-140 μm, and lower aperture is
90-100μm。
3. according to the method described in claim 1, wherein, the ceramic substrate is aluminium oxide ceramic substrate or aluminium nitride ceramics base
Plate.
4. according to the method described in claim 1, wherein, in step (3), the temperature of the first stage is 390-410 DEG C, when
Between be 1-1.5 hours；The temperature of the second stage is 860-880 DEG C, and the time is 2.5-3 hours；The high temperature sintering is true
Reciprocal of duty cycle is 1 × 10-5-1×10-4It is carried out under Pa.
5. according to the method described in claim 4, wherein, the condition of the high temperature sintering so that the thickness of circuit pattern is 6-12
μm。
6. according to the method described in claim 1, wherein, in step (4), the condition of the copper electroplating layer causes the thickness of layers of copper
It is 20-100 μm.
7. according to the method described in claim 1, wherein, to step (3) after sintered ceramic substrate carries out copper electroplating layer,
The method further includes：(5) plating NiPdAu or nickel gold plate are carried out on the surface for the ceramic substrate for being formed with layers of copper.
8. a kind of metallized ceramic base plate that any one the method manufactures in claim 1-7.
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| CN107785469A (en) * | 2016-08-24 | 2018-03-09 | 浙江德汇电子陶瓷有限公司 | The method for packing and UVLED base of ceramic structures of a kind of UVLED base of ceramic |
| CN107785470B (en) * | 2016-08-24 | 2020-06-05 | 浙江德汇电子陶瓷有限公司 | UV-LED auxiliary frame ceramic substrate and manufacturing method thereof |
| CN107785471A (en) * | 2016-08-24 | 2018-03-09 | 浙江德汇电子陶瓷有限公司 | The method for packing and UVLED base of ceramic encapsulating structures of a kind of UVLED base of ceramic |
| CN107995781B (en) * | 2017-12-05 | 2020-09-15 | 天津荣事顺发电子有限公司 | Aluminum nitride ceramic circuit board and preparation method thereof |
| CN108323003A (en) * | 2018-01-24 | 2018-07-24 | 深圳市牧泰莱电路技术有限公司 | A kind of ceramic circuit-board and its manufacturing method with plated-through hole |
| CN109346256A (en) * | 2018-12-05 | 2019-02-15 | 中国振华集团云科电子有限公司 | A kind of resistor chain and preparation method thereof |
| CN109734481B (en) * | 2019-03-18 | 2021-09-21 | 昆山福烨电子有限公司 | Production process of metal ceramic thick film circuit |
| CN111834324A (en) * | 2019-04-15 | 2020-10-27 | 谭祖荣 | Polished thick film substrate suitable for packaging flip chip and eutectic crystal element and manufacturing method thereof |
| CN110602889A (en) * | 2019-10-21 | 2019-12-20 | 深圳市中基自动化有限公司 | Contact circuit board process for lithium battery formation |
| CN114222446A (en) * | 2021-12-30 | 2022-03-22 | 无锡天杨电子有限公司 | Metallization method of large-current via hole of double-sided ceramic copper-clad plate |
| CN115448746A (en) * | 2022-08-22 | 2022-12-09 | 浙江湖州新京昌电子有限公司 | Production process for ceramic substrate |
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| CN103533765A (en) * | 2012-08-07 | 2014-01-22 | 立诚光电股份有限公司 | Method for improving metal surface roughness on ceramic through hole substrate and ceramic substrate |
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| TW201410085A (en) * | 2012-05-02 | 2014-03-01 | Ceramtec Gmbh | Method for producing ceramic circuit boards from ceramic substrates having metal-filled vias |
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| CN103429010A (en) * | 2012-05-25 | 2013-12-04 | 大毅科技股份有限公司 | Forming method for conductive jack of ceramic heat dissipation substrate |
| CN103533765A (en) * | 2012-08-07 | 2014-01-22 | 立诚光电股份有限公司 | Method for improving metal surface roughness on ceramic through hole substrate and ceramic substrate |
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