CN1054469C - 形成半导体器件的方法 - Google Patents
形成半导体器件的方法 Download PDFInfo
- Publication number
- CN1054469C CN1054469C CN93105438A CN93105438A CN1054469C CN 1054469 C CN1054469 C CN 1054469C CN 93105438 A CN93105438 A CN 93105438A CN 93105438 A CN93105438 A CN 93105438A CN 1054469 C CN1054469 C CN 1054469C
- Authority
- CN
- China
- Prior art keywords
- film
- gate electrode
- semiconductor
- semiconductor island
- electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 153
- 238000000034 method Methods 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 claims abstract description 39
- 230000003647 oxidation Effects 0.000 claims abstract description 12
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 12
- 239000003792 electrolyte Substances 0.000 claims description 35
- 229910052782 aluminium Inorganic materials 0.000 claims description 30
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 28
- 238000009413 insulation Methods 0.000 claims description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000012535 impurity Substances 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 22
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 11
- 229910052715 tantalum Inorganic materials 0.000 claims description 10
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 239000010407 anodic oxide Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000010276 construction Methods 0.000 claims 1
- 239000002019 doping agent Substances 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 230000005669 field effect Effects 0.000 abstract description 16
- 230000007547 defect Effects 0.000 abstract description 15
- 238000007743 anodising Methods 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 223
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 68
- 229910052814 silicon oxide Inorganic materials 0.000 description 68
- 239000010409 thin film Substances 0.000 description 57
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 26
- 238000004544 sputter deposition Methods 0.000 description 23
- 239000010410 layer Substances 0.000 description 19
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 19
- 239000011521 glass Substances 0.000 description 18
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 18
- 238000012545 processing Methods 0.000 description 16
- 238000000137 annealing Methods 0.000 description 15
- 238000005224 laser annealing Methods 0.000 description 14
- 239000001257 hydrogen Substances 0.000 description 13
- 229910052739 hydrogen Inorganic materials 0.000 description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 238000002048 anodisation reaction Methods 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 238000000151 deposition Methods 0.000 description 10
- 238000005468 ion implantation Methods 0.000 description 10
- 150000002500 ions Chemical class 0.000 description 10
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 230000005684 electric field Effects 0.000 description 9
- 239000008151 electrolyte solution Substances 0.000 description 9
- -1 hydrogen ions Chemical class 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 235000002906 tartaric acid Nutrition 0.000 description 9
- 239000011975 tartaric acid Substances 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000010893 electron trap Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 238000001953 recrystallisation Methods 0.000 description 4
- 229910015900 BF3 Inorganic materials 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000005566 electron beam evaporation Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/021—Manufacture or treatment using multiple gate spacer layers, e.g. bilayered sidewall spacers
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4115503A JP3071940B2 (ja) | 1992-04-07 | 1992-04-07 | 絶縁ゲイト型半導体装置の作製方法 |
JP115503/92 | 1992-04-07 | ||
JP115503/1992 | 1992-04-07 | ||
JP089117/92 | 1993-03-24 | ||
JP089117/1992 | 1993-03-24 | ||
JP5089117A JPH06275646A (ja) | 1993-03-24 | 1993-03-24 | 薄膜トランジスタの作製方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1078068A CN1078068A (zh) | 1993-11-03 |
CN1054469C true CN1054469C (zh) | 2000-07-12 |
Family
ID=26430549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN93105438A Expired - Fee Related CN1054469C (zh) | 1992-04-07 | 1993-04-07 | 形成半导体器件的方法 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR970003917B1 (enrdf_load_stackoverflow) |
CN (1) | CN1054469C (enrdf_load_stackoverflow) |
TW (1) | TW223703B (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105637646A (zh) * | 2013-10-28 | 2016-06-01 | 富士电机株式会社 | 碳化硅半导体装置及其制造方法 |
CN107799605A (zh) * | 2017-10-27 | 2018-03-13 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3469337B2 (ja) * | 1994-12-16 | 2003-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN102569053B (zh) * | 2012-01-18 | 2014-12-24 | 上海华力微电子有限公司 | 一种形成高介电常数金属栅的方法 |
CN105977306A (zh) * | 2016-06-21 | 2016-09-28 | 北京大学深圳研究生院 | 一种自对准薄膜晶体管及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0451968A1 (en) * | 1990-04-11 | 1991-10-16 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Process for manufacturing thin film transistor |
-
1993
- 1993-04-06 KR KR93005710A patent/KR970003917B1/ko not_active Expired - Fee Related
- 1993-04-07 CN CN93105438A patent/CN1054469C/zh not_active Expired - Fee Related
- 1993-04-08 TW TW082102610A patent/TW223703B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0451968A1 (en) * | 1990-04-11 | 1991-10-16 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Process for manufacturing thin film transistor |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105637646A (zh) * | 2013-10-28 | 2016-06-01 | 富士电机株式会社 | 碳化硅半导体装置及其制造方法 |
CN107799605A (zh) * | 2017-10-27 | 2018-03-13 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
US10615051B2 (en) | 2017-10-27 | 2020-04-07 | Boe Technology Group Co., Ltd. | Thin-film transistor and method of manufacturing the same, array substrate, and display apparatus |
CN107799605B (zh) * | 2017-10-27 | 2020-07-31 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
Also Published As
Publication number | Publication date |
---|---|
TW223703B (enrdf_load_stackoverflow) | 1994-05-11 |
KR970003917B1 (en) | 1997-03-22 |
CN1078068A (zh) | 1993-11-03 |
KR930022600A (ko) | 1993-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5545571A (en) | Method of making TFT with anodic oxidation process using positive and negative voltages | |
CN1123934C (zh) | 半导体制造工艺和半导体器件制造工艺 | |
CN1156887C (zh) | 半导体器件及其制造方法 | |
US5899709A (en) | Method for forming a semiconductor device using anodic oxidation | |
CN1156015C (zh) | Mis半导体器件及其制造方法 | |
CN1078014C (zh) | 半导体器件及其制造方法 | |
CN1045688C (zh) | 半导体薄膜及使用这种薄膜的半导体器件的制造方法 | |
US5580792A (en) | Method of removing a catalyst substance from the channel region of a TFT after crystallization | |
CN1113032A (zh) | 一种半导体器件的制造方法 | |
CN1120240A (zh) | 半导体器件及其制造方法 | |
CN1538522A (zh) | 半导体器件 | |
CN1638034A (zh) | 用于制造半导体器件的方法 | |
US7091110B2 (en) | Method of manufacturing a semiconductor device by gettering using a anti-diffusion layer | |
CN1183599C (zh) | 有源矩阵显示器件 | |
CN1054469C (zh) | 形成半导体器件的方法 | |
CN1251331C (zh) | 半导体器件 | |
CN1258104A (zh) | 半导体器件及其制造方法 | |
JP4987198B2 (ja) | 多結晶シリコン薄膜トランジスタの製造方法 | |
CN1917154A (zh) | 金属-绝缘体-半导体器件的制造方法 | |
JP3844538B2 (ja) | 半導体装置の作製方法 | |
CN1134600A (zh) | 制造薄膜晶体管的方法及设备 | |
KR100256912B1 (ko) | 반도체회로, 반도체장치 및 이들의 제조방법 | |
CN1134036A (zh) | 制造半导体器件的方法 | |
KR0161993B1 (ko) | 박막 트랜지스터 제조방법 | |
JP2004327649A (ja) | 半導体装置、薄膜トランジスタおよび半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20000712 Termination date: 20100407 |