CN105428344A - 使用波长转换元件的可调白点光源 - Google Patents
使用波长转换元件的可调白点光源 Download PDFInfo
- Publication number
- CN105428344A CN105428344A CN201510764564.7A CN201510764564A CN105428344A CN 105428344 A CN105428344 A CN 105428344A CN 201510764564 A CN201510764564 A CN 201510764564A CN 105428344 A CN105428344 A CN 105428344A
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- wavelength
- changing element
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000000203 mixture Substances 0.000 claims abstract description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003086 colorant Substances 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 230000009466 transformation Effects 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000862 absorption spectrum Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000009102 absorption Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/14—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0457—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
- H05B45/22—Controlling the colour of the light using optical feedback
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
为使用多个具有轻微不同泵浦波长的发光二极管LED芯片(102)的均匀高亮度光源(100)提供波长转换元件(110),该波长转换元件包括至少两种将光转换为不同颜色的光的不同波长转换材料。可以改变由LED芯片(102)产生的光的强度以提供一种可调的CCT白点。波长转换元件(110)可以是,例如磷光体或发光陶瓷的堆叠(111,112,113)或混合物(114)。另外,由于LED芯片全都使用相同的技术制造,消除了制造不同类型芯片的需求,从而简化了光源(100)的制造过程。
Description
本案为分案申请,母案是申请号为200780045969.9的进入国家阶段的PCT申请,其发明名称为“使用波长转换元件的可调白点光源”,申请日为2007年12月12日。
技术领域
本发明涉及一种产生白光的光源,特别地涉及一种使用多个发光二极管的光源,所述多个发光二极管产生的光具有期望的相关色温(CCT)。
背景技术
最近有这样一种趋势,用发光二极管(LED)代替传统的白炽灯泡。例如,现在使用LED制造交通控制信号和汽车刹车灯。以一个或多个LED替代传统的白炽灯泡是期望的,因为,例如,在能源使用和寿命的方面,白炽灯泡相对于LED效率很低。
然而某些照明应用引出了用LED代替白炽灯泡的特殊问题。例如,一些高度引人注意的照明应用,诸如重点照明灯(accentlamp)或聚光灯,需要具有特殊相关色温(CCT)的白光。在这样的照明应用中,由于在控制LED的光谱分布即CCT或白点(whitepoint)方面中的困难,使用LED代替白炽灯泡是有问题的。然而,当替代白炽灯泡时,LED光源具有紧凑的形状因子(formfactor)是重要的,例如不大于白炽灯泡,这增加了复杂性。此外,期望颜色可调的灯,可以例如针对情绪、场景和个人喜好来调节所述颜色可调的灯。从而,期望能够产生白光的LED光源中的改进。
根据本发明的一个实施例,产生了一种可调CCT白点光源,使用多个具有轻微不同的泵浦波长的LED芯片,光源被提供波长转换元件,该转换元件包括至少两种不同的波长转换材料,这些材料将光转换为不同颜色的光。所述波长转换元件接收来自多个LED芯片的光并将该光的至少一部分转换成不同的颜色。该波长转换元件可以例如是磷光体或发光陶瓷的堆叠或混合物。可以改变由LED芯片产生的光的强度来改变由波长转换元件转换的光的至少一种颜色的强度以控制所得光的白点。另外,由于使用了相同类型的LED芯片,可以将这些多个LED芯片紧密地一起安装在一个或多个基底(submount)上,从而形成紧凑的、高亮度(brightness)的设计。
附图说明
图1为根据本发明一个实施例的光源的侧视图。
图2示出了可以与光源一起使用的LED阵列的透视图。
图3示出了使用不同颜色的LED的重点照明灯的侧视图,以及图4示出了图3的重点照明灯中使用的LED的俯视图。
图5-8示意性地示出了波长转换元件的不同实施例的侧视图。
图9是示出了绿色、红色和钇铝石榴石(YAG)磷光体板(plate)的吸收和发射光谱,所述的板可以被堆叠或混合以形成波长转换元件。
图10为光源的另一个实施例。
具体实施方式
根据本发明的一个实施例,连同多个具有轻微不同泵浦波长的发光二极管芯片一起使用波长转换元件来产生具有可调CCT白点的均匀高亮度光源。该波长转换元件包括至少两种不同波长转换材料,这些材料将光转换为不同颜色的光并可以例如是磷光体或发光陶瓷的堆叠或混合物。由于所得设备的CCT能够被控制以产生令人满意的白光,所述光源可以适合用于例如聚光灯或重点照明灯类型的应用或其中期望紧凑的白光源的其他应用。
图1为根据本发明实施例的光源100的侧视图。光源100可以产生具有可调CCT白点的光,该光可以用作例如重点照明应用。光源100包括可以安装到散热器104的LED102的阵列。波长转换元件110安装在LED102的阵列上并且例如通过安装到散热器104或由散热器104整体形成的支撑体105得以保持。定位反射器光学器件106来聚焦来自波长转换元件110的光并形成所期望的光分配图案。可以例如通过支撑体105将该反射器光学器件106安装到散热器104,或者另外地将之光学耦合以接收来自波长转换元件110的光。在一个实施例中,可以将强度检测器120安装到反射器光学器件106并且耦合到驱动电路122。强度检测器120可以是例如分光计或者在另一个实施例中,如通过检测器121可见,可以与具有不同范围波长的光谱滤光器一起使用不止一个检测器。强度检测器120检测由波长转换元件110产生的光的强度并且驱动电路122做出响应控制阵列中的单个LED102的强度。作为例子,驱动电路122可以使用脉冲调制或者电流控制来改变某个管芯的强度。或者,驱动电路122可以简单地关闭某个管芯或向其增加功率。
阵列中的LED102产生具有相同的一般颜色(例如蓝色)的光,但波长有意地相差可感知到的量,例如相差(differ)大约5nm、10nm、20nm或更大但低于大约50nm。使用具有相同颜色的LED是有利的,因为所有这些LED都可以使用相同的管芯技术来制造。因此,因为无需制造不同类型的LED,简化了一般的制造过程。而且,由于对所有的LED102而言,安装要求是相同的,因此简化了LED102的安装。从而,LED102可以彼此互相接近地安装在相同的基底上。如虚线103所示,如果需要,可以使用不止一个基底。应当理解,可以对LED进行电气上的分组,其中在一个组里,LED相差没那么大,小于大约5nm,即它们来自相同的料箱(bin),但是阵列里其他LED或LED组相差大约5nm或更大。
图2示出可以与光源100一起使用的LED芯片102的阵列的透视图。如上文讨论的那样,LED102由相同的管芯技术制造,这允许管芯被紧密地一起放置在至少一个基底130上,由此提高了发光度(luminance)。静电放电(ESD)电路131也被在装载在基底130上。基底130利用多个电引线(electricallead)134附接到直接敷铜(DBC)基板132,基底可以是陶瓷或其他合适的材料。如图1所示,通过机械紧固件或其他合适的机构(例如环氧树脂)将该DBC基板132连接到散热器104。如上面讨论的那样,两个或者更多个LED102发射具有相同的一般颜色(例如蓝色)的光,但是它们具有轻微不同的波长。举个例子,LED102a,102b和102c分别产生具有大约430nm,450nm和470nm波长的光。
通过比较的方式,图3示出了使用不同颜色LED12的重点照明灯10的侧视图以及图4示出了这些LED12的俯视图。灯10使用不同类型的LED12,例如蓝色LED12b,绿色LED12g和红色LED12r来产生期望的不同颜色。安装LED12到散热器14上。因为LED12产生不同颜色的光,使用集成杆(integratingrod)16来混合所产生的光。集成杆16的轮廓在图4中以圆虚线示出,但是集成杆可以具有另外的几何形状,例如六边形。如图3所示,将透镜18耦合到集成杆16的末端并用于产生期望的光的分布。
与光源100相比,不同类型的LED12的使用可以导致发光度的减少,并且增大了制造的难度。例如,不同类型的LED12必须单独地制造。另外,不同类型的LED12必须对付不同的安装要求。因此,如图4所示,不同的LED12安装在单独的基底13上,由于LED12之间的相对较大的间隙,这增大了光源的区域。由此,灯10既损失了亮度又损失了紧凑度。另外,由于LED12产生不同颜色的光,必须使用例如长的集成杆16来混合该光,导致大的重点照明灯10。
回过来参考图1,波长转换元件110包括两种或者三种波长转换材料。举个例子,波长转换元件110可以是不同波长转换材料的堆叠,例如多个磷光层的堆叠,或可替代地,可以是包含多个磷光体混合物的单个层。在一个实施例中,波长转换元件110可以是不同发光陶瓷的堆叠或可以是包含不同类型发光材料的混合物的单个发光陶瓷。举个例子,可以使用包括YAG,SSON,BSSN和/或eCAS的发光陶瓷。因此,波长转换元件110产生组合良好的光并且不需要使用集成光学器件。由此,光源100可以具有紧凑的设计并且产生均匀的光。
图5-8示意性地示出由支撑体5保持在LED102的阵列上的波长转换元件110的不同实施例的侧视图。图5例如示出了波长转换元件110包括不同波长转换层111,112和113的堆叠,它们包括不同的波长转换材料。层111,112,113可以是例如磷光体板和/或发光陶瓷。波长转换层111,112和113分别包含发射绿光,红光和黄光的材料。图6示出作为单个层114的多色波长转换元件110,单个层114包含例如绿、红和黄发射材料的混合物。如图7所示,波长转换元件110的其他实施例也是可能的,例如将所述不同的波长转换材料115,116和117水平地而非垂直地定位成相互紧接。图8说明了另外的实施例,其中波长转换元件110包括水平定位的波长转换材料118和119,以及孔110a,穿过该孔发射未转换的泵浦光。
应当理解图5-8是包括两种或更多种波长转换材料的波长转换元件110的实例。如果需要,可以使用如图5-8中所示的不同实施例或不同实施例的组合。例如,图5和6可以组合成产生波长转换层的堆叠。其中一个层包含两种或更多种波长转换材料的混合物。可替代地,水平定位的波长转换材料和/或孔(例如,图7和8)可以与波长转换材料的混合物或堆叠(例如,图5和6)包括在一起。可以在单独的承载板上喷涂或丝网印制波长转换材料。举个例子,在丝网印制的情况下,不同波长转换材料可以被印制作为彼此紧接的不同的点。为了颜色混合的目的,在波长转换材料和LED之间有一定的距离可以是有益的。
波长转换元件110中的两种或多种波长转换材料具有不同的吸收和激发特性。通过改变来自在波长上具有可感知量的不同的两个或多个LED102的光的强度,所得光的光谱分布,例如从波长转换元件110向前发射的光和来自LED102透过波长元件110的泵浦光,可以受到控制以产生标称值附近的期望的白点CCT。
图9为说明了绿色、红色和YAG磷光体板的吸收和发射光谱的曲线图,它们可以被堆叠或混合来形成波长转换元件110。如可见的那样,当红色和绿色磷光体具有宽得多的吸收光谱时,YAG具有相对狭窄的吸收光谱。
图9还用虚线说明了由如上所述的LED102a,102b和102c产生的430nm,450nm和470nm波长。通过控制由LED102产生的不同波长的强度,可以改变光源100产生的光的色点。例如,通过改变450nm的蓝光的强度,可以改变YAG(黄色)经转换光相对于红色(和绿色)经转换光的比率。如果LED102产生由YAG吸收的波长(即450nm)处具有更大强度的蓝光,那么YAG发射将增加,由此产生更暖的白色点。通过减少450nm蓝光的强度,更少的光被YAG吸收,导致YAG的发射的减少和更冷(cooler)的白色点。类似地,其他波长(即430nm和470nm)的强度变化也可以被用于改变所得光的色点。
由LED102产生的光的强度的调节可以在光源100的制造过程中即通过测试由组装的灯100产生的光、调节并设置不同LED102a,102b,102c的强度来完成以产生期望的白点。可替代地,可以如图1所示使用强度检测器120。在另一个实施例中,可以例如通过改变堆叠中波长转换层之一使之具有期望的厚度来调节波长转换元件110,以便产生所得光的期望的CCT。在另一个应用中,允许终端用户根据其需要或期望通过改变到不同LED(或LED组)的电流的比率来调节灯的颜色。
图10是另一个实施例光源200,其包括LED202的阵列,该阵列包括至少两个发射具有相同一般颜色但是具有可感知的不同波长的光的LED以及包括至少两种不同波长转换材料的波长转换元件210。在散热器204上安装LED202的阵列。准直器元件206大致地准直由LED202发射的光,该光透过例如透射蓝光并反射更长波长的波长选择元件208(例如二色性滤光器)。集中器元件209集中入射到波长转换元件210上的光。任何从波长转换元件210向后发射的光由波长选择元件208再利用(recycled),波长选择元件208将所述光向后反射至波长转换元件210。定位反射器元件212以聚焦来自波长转换元件210的光并且形成期望的光分布图案。如图10所示,光源200可以包括强度检测器220和驱动电路222,如果需要,其可以与参考光源100所描述的类似。
虽然出于说明的目的,结合特定实施例说明了本发明,但是本发明并不局限于此。在不背离本发明范围下可以做出各种各样的改变和修改。因此,所附权利要求的精神和范围不局限于前面的描述。
Claims (30)
1.光源(100),包括:
具有唯一的相同类型的至少两个发光二极管芯片(102),所述至少两个发光二极管芯片(102)产生具有相差5nm至50nm的波长的同样的一般颜色;
波长转换元件(110),其被安装以接收由所述至少两个发光二极管芯片(102)发射的光,所述波长转换元件(110)包括至少两种不同的波长转换材料,这些材料将来自所述至少两个发光二极管芯片(102)的光转换为不同颜色的光;以及
至少一个光检测器(120),其被定位成接收由波长转换元件(110)产生的光并响应于所述经检测光的强度产生信号;和驱动电路(122),其耦合到至少两个发光二极管芯片(102)和至少一个光检测器(120),所述驱动电路(122)响应于由所述至少一个光检测器(120)产生的信号控制由发光二极管芯片(102)中单个发光二极管发射的光的强度。
2.如权利要求1所述的光源,其中所述波长转换元件(110)包括波长转换薄膜(111,112,113)的堆叠。
3.如权利要求1所述的光源,其中所述波长转换元件(110)包括不同波长转换材料的混合物(114),这些材料将来自所述至少两个发光二极管芯片(102)的光转换为不同颜色的光。
4.如权利要求3所述的光源,其中所述不同波长转换材料的混合物(114)是均质的。
5.如权利要求1所述的光源,其中所述波长转换元件(110)包括一种或多种发光陶瓷。
6.如权利要求1所述的光源,其中所述波长转换元件(110)包括一个或多个磷光体层(111,112,113)。
7.如权利要求1所述的光源,还包括至少一个基底(130),所述至少两个发光二极管芯片(102)安装至所述至少一个基底(130)。
8.如权利要求7所述的光源,还包括,散热器(104),所述至少一个基底(130)被安装在所述散热器(104)上;以及支撑体(105),其耦合到所述散热器(104),该支撑体(105)保持所述波长转换元件(110)。
9.如权利要求7所述的光源,其中所述至少一个基底(130)是一个基底(130)并且所述至少两个发光二极管芯片(102)安装在所述一个基底(130)上。
10.如权利要求1所述的光源,还包括定位在所述至少两个发光二极管芯片(102)和波长转换元件(110)之间的波长选择元件(208)。
11.如权利要求10所述的光源,还包括:定位在所述至少两个发光二极管芯片(102)和波长选择元件(208)之间的准直器元件(206);和定位在所述波长选择元件(208)和所述波长转换元件(110)之间的集中器元件(209)。
12.一种发光方法,包括:
从多个相同类型的发光二极管芯片(102)产生光,每个芯片(102)产生具有不同范围的波长的光,这些波长相差5nm至50nm;
使用波长转换元件(110)将来自所述多个发光二极管芯片(102)的部分光转换为至少两种不同颜色的光并且使来自所述多个发光二极管芯片(102)的其他部分光透过所述波长转换元件(110)以产生组合的经转换和透射的光;以及
通过改变来自至少一个发光二极管芯片的光的强度以改变由所述波长转换元件(110)转换的光的至少一种颜色的强度来控制所述组合的经转换和透射的光的白点。
13.如权利要求12所述的方法,还包括在至少一个基底(130)上安装所述多个发光二极管芯片(102)。
14.如权利要求13所述的方法,还包括:安装所述至少一个基底(130)到散热器(104);并将波长转换元件(110)安装在支撑体(105)上的所述多个发光二极管芯片(102)之上,所述支撑体(105)耦合到所述散热器(104)。
15.如权利要求12所述的方法,其中在形成所述波长转换元件(110)的波长转换薄膜(111,112,113)的堆叠中执行对来自所述多个发光二极管芯片(102)的部分光的转换。
16.如权利要求15所述的方法,其中所述波长转换薄膜(111,112,113)的堆叠包括一个或多个发光陶瓷。
17.如权利要求12所述的方法,其中所述波长转换薄膜(111,112,113)的堆叠包括一个或多个磷光体层(111,112,113)。
18.如权利要求12所述的方法,其中通过所述波长转换元件(110)中的不同波长转换材料的混合物(114)执行对来自所述多个发光二极管芯片(102)的部分光的转换。
19.如权利要求18所述的方法,其中所述不同波长转换材料的混合物(114)是均质的。
20.如权利要求12所述的方法,还包括:检测所述组合的经转换和透射的光并且响应地产生信号;以及响应于由光检测器(120)产生的信号改变来自至少一个发光二极管芯片的所述光的强度。
21.如权利要求20所述的方法,其中连续地或周期性地执行检测和改变。
22.如权利要求20所述的方法,其中只执行一次检测和改变。
23.如权利要求12所述的方法,还包括将来自多个发光二极管芯片(102)的光透过波长选择元件(208),以及通过所述波长选择元件(208)将来自所述波长转换元件(110)的经转换的光反射回去。
24.如权利要求23所述的方法,还包括在来自多个发光二极管芯片(102)的所述光被透过所述波长选择元件(208)之前大致地准直该光;以及在来自多个发光二极管芯片(102)的所述光被透过所述波长选择元件(208)之后并在其入射在所述波长转换元件(110)上之前集中该光。
25.光源(100),包括:
基底(130);
安装在所述基底(104;204)上的第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c;202),其中:
所述第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c;202)具有产生第一颜色的光的唯一的相同类型;
所述第一发光二极管和第二发光二极管(102a,102b)具有相差5nm至50nm的波长;
所述第二发光二极管和第三发光二极管(102b,102c)具有相差5nm至50nm的波长;以及
所述第一发光二极管和第三发光二极管(102a,102c)具有相差30nm至50nm的波长;
安装在所述基底(104)上的静电放电电路(131),用于防止所述第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c)遭受静电放电;
用于将来自所述第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c)的一部分光转换成第二颜色、第三颜色和第四颜色的光的波长转换元件(110;210);
光学器件(106;212),用于接收来自所述波长转换元件(110)的光并形成期望的光分布图案;以及
驱动电路(122;222),其耦合到所述第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c;202),其中所述驱动电路(122;222)独立地控制所述第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c;202)的光强,使得所述第一颜色、第二颜色、第三颜色和第四颜色的光组合以产生期望的白色点的光。
26.如权利要求25所述的光源,其中所述波长转换元件(110;210)包括:
包含多个磷光体混合物的单个层(114);或者
包含多个磷光体板或发光陶瓷(111,112,113)的堆叠。
27.如权利要求25所述的光源,其中所述波长转换元件(110;210)包括相互紧接的水平地定位的不同的波长转换材料(115,116,117)。
28.如权利要求27所述的光源,其中所述波长转换元件(110;210)定义孔(110a)。
29.如权利要求26或27所述的光源,进一步包括光检测器(120;220),用于响应于所述经检测光的强度产生信号,其中所述驱动电路(122;222)响应于所述信号独立地控制由所述第一发光二极管、第二发光二极管和第三发光二极管(102a,102b,102c;202)的光强。
30.如权利要求29所述的光源,进一步包括:
定位在所述第一发光二极管、第二发光二极管、第三发光二极管(202)和所述波长转换元件(210)之间的波长选择元件(208);
定位在所述第一发光二极管、第二发光二极管、第三发光二极管(202)和所述波长选择元件(208)之间的准直器元件;以及
定位在所述波长选择元件(208)和所述波长转换元件(210)之间的集中器元件(209)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/611351 | 2006-12-15 | ||
US11/611,351 US7902560B2 (en) | 2006-12-15 | 2006-12-15 | Tunable white point light source using a wavelength converting element |
CN2007800459699A CN102439721A (zh) | 2006-12-15 | 2007-12-12 | 使用波长转换元件的可调白点光源 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800459699A Division CN102439721A (zh) | 2006-12-15 | 2007-12-12 | 使用波长转换元件的可调白点光源 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105428344A true CN105428344A (zh) | 2016-03-23 |
Family
ID=39190282
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510764564.7A Pending CN105428344A (zh) | 2006-12-15 | 2007-12-12 | 使用波长转换元件的可调白点光源 |
CN2007800459699A Pending CN102439721A (zh) | 2006-12-15 | 2007-12-12 | 使用波长转换元件的可调白点光源 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800459699A Pending CN102439721A (zh) | 2006-12-15 | 2007-12-12 | 使用波长转换元件的可调白点光源 |
Country Status (9)
Country | Link |
---|---|
US (2) | US7902560B2 (zh) |
EP (1) | EP2102909A1 (zh) |
JP (1) | JP2010514153A (zh) |
KR (1) | KR20090096627A (zh) |
CN (2) | CN105428344A (zh) |
BR (1) | BRPI0720065A2 (zh) |
RU (1) | RU2468472C2 (zh) |
TW (1) | TWI497744B (zh) |
WO (1) | WO2008072196A1 (zh) |
Families Citing this family (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090185392A1 (en) * | 2003-03-26 | 2009-07-23 | Optim, Inc. | Detachable illumination system |
US7798692B2 (en) | 2003-03-26 | 2010-09-21 | Optim, Inc. | Illumination device |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US20100032695A1 (en) * | 2008-08-05 | 2010-02-11 | The Regents Of The University Of California | Tunable white light based on polarization sensitive light-emitting diodes |
US9335006B2 (en) * | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
KR20080049947A (ko) * | 2006-12-01 | 2008-06-05 | 엘지전자 주식회사 | 방송 시스템, 인터페이스 방법, 및 데이터 구조 |
US20080214896A1 (en) * | 2007-01-10 | 2008-09-04 | Krupa Robert J | Endoscope with detachable elongation portion |
US8203260B2 (en) * | 2007-04-13 | 2012-06-19 | Intematix Corporation | Color temperature tunable white light source |
US7942556B2 (en) * | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
US20090190371A1 (en) * | 2008-01-24 | 2009-07-30 | Optim, Inc. | Monolithic illumination device |
US8651723B2 (en) * | 2008-02-21 | 2014-02-18 | Koninklijke Philips N.V. | LED light source with a luminescent layer |
US8916890B2 (en) * | 2008-03-19 | 2014-12-23 | Cree, Inc. | Light emitting diodes with light filters |
US20110037376A1 (en) * | 2008-04-23 | 2011-02-17 | Koninklijke Philips Electronics N.V. | Luminous device |
WO2009134433A2 (en) * | 2008-05-02 | 2009-11-05 | Light Prescriptions Innovators, Llc | Remote-phosphor led downlight |
US20110116520A1 (en) * | 2008-07-07 | 2011-05-19 | Koninklijke Philips Electronics N.V. | Eye-safe laser-based lighting |
JP5079635B2 (ja) * | 2008-08-20 | 2012-11-21 | シャープ株式会社 | 照明機器 |
US9425172B2 (en) * | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8858032B2 (en) * | 2008-10-24 | 2014-10-14 | Cree, Inc. | Lighting device, heat transfer structure and heat transfer element |
US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
DE102009005907A1 (de) * | 2009-01-23 | 2010-07-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
US7956546B2 (en) * | 2009-05-15 | 2011-06-07 | Bridgelux, Inc. | Modular LED light bulb |
WO2010151600A1 (en) | 2009-06-27 | 2010-12-29 | Michael Tischler | High efficiency leds and led lamps |
US9547119B2 (en) | 2009-07-14 | 2017-01-17 | Philips Lighting Holding B.V. | Color temperature variable light emitter |
US8273588B2 (en) * | 2009-07-20 | 2012-09-25 | Osram Opto Semiconductros Gmbh | Method for producing a luminous device and luminous device |
US8598809B2 (en) * | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
DE102009040095B4 (de) * | 2009-09-04 | 2013-07-04 | Olympus Winter & Ibe Gmbh | Medizinische Leuchte mit Leuchtstoffschicht |
JP2013513200A (ja) * | 2009-12-04 | 2013-04-18 | オスラム ゲーエムベーハー | 共にモールドされた光センサを有するled発光モジュール |
US8511851B2 (en) * | 2009-12-21 | 2013-08-20 | Cree, Inc. | High CRI adjustable color temperature lighting devices |
US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
US9631782B2 (en) * | 2010-02-04 | 2017-04-25 | Xicato, Inc. | LED-based rectangular illumination device |
US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
WO2011153141A2 (en) | 2010-06-03 | 2011-12-08 | 3M Innovative Properties Company | Light converting and emitting device with suppressed dark-line defects |
WO2011153153A1 (en) * | 2010-06-04 | 2011-12-08 | 3M Innovative Properties Company | Multicolored light converting led with minimal absorption |
WO2011153034A1 (en) | 2010-06-04 | 2011-12-08 | 3M Innovative Properties Company | Light converting and emitting device with minimal edge recombination |
WO2012000114A1 (en) | 2010-06-29 | 2012-01-05 | Cooledge Lightning Inc. | Electronic devices with yielding substrates |
US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
US8437517B2 (en) | 2010-11-03 | 2013-05-07 | Lockheed Martin Corporation | Latent fingerprint detectors and fingerprint scanners therefrom |
DE102010062463A1 (de) * | 2010-12-06 | 2012-06-06 | Osram Ag | Leuchtvorrichtung |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
CN103502726A (zh) * | 2011-02-23 | 2014-01-08 | 瓦维恩股份有限公司 | 具有再循环的发光二极管阵列照明系统 |
TW201248083A (en) * | 2011-03-17 | 2012-12-01 | Rambus Inc | Adjustable light source, and light bulb with adjustable light source |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
USD700584S1 (en) | 2011-07-06 | 2014-03-04 | Cree, Inc. | LED component |
DE102011079697A1 (de) * | 2011-07-25 | 2013-01-31 | Osram Ag | Beleuchtungsvorrichtung |
US8449129B2 (en) | 2011-08-02 | 2013-05-28 | Xicato, Inc. | LED-based illumination device with color converting surfaces |
US8403529B2 (en) | 2011-08-02 | 2013-03-26 | Xicato, Inc. | LED-based illumination module with preferentially illuminated color converting surfaces |
US8669722B2 (en) | 2011-08-12 | 2014-03-11 | Tsmc Solid State Lighting Ltd. | Color temperature adjustment for LED lamps using switches |
US20150241350A1 (en) | 2011-08-26 | 2015-08-27 | Edward J. Miesak | Latent fingerprint detection |
DE102011083564A1 (de) * | 2011-09-27 | 2013-03-28 | Osram Gmbh | Led-lichtsystem mit verschiedenen leuchtstoffen |
US20130093362A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Methods and apparatus for implementing tunable light emitting device with remote wavelength conversion |
WO2013066306A1 (en) | 2011-10-31 | 2013-05-10 | Hewlett-Packard Development Company, L.P. | Luminescent stacked waveguide display |
CN102540656B (zh) * | 2011-11-15 | 2014-12-31 | 深圳市光峰光电技术有限公司 | 发光装置及投影系统 |
GB2497950A (en) * | 2011-12-22 | 2013-07-03 | Sharp Kk | Laser and Phosphor Based Light Source for Improved Safety |
DE102012200023B4 (de) * | 2012-01-02 | 2018-01-25 | Osram Oled Gmbh | Leuchte |
DE102012101393A1 (de) * | 2012-02-21 | 2013-08-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
US20130221848A1 (en) * | 2012-02-24 | 2013-08-29 | Lockheed Martin Corporation | System, method and computer program product for reducing a thermal load on an ultraviolet flash lamp |
CN103292163A (zh) * | 2012-03-01 | 2013-09-11 | 欧司朗股份有限公司 | 照明装置和包括该照明装置的灯具 |
EP2823226B1 (en) * | 2012-03-08 | 2017-05-10 | Philips Lighting Holding B.V. | Light emitting device and method for manufacturing a light emitting device |
EP2637224B1 (en) | 2012-03-09 | 2019-04-03 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting device, illumination apparatus and system using same |
US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
DE102012105208A1 (de) * | 2012-06-15 | 2013-12-19 | Osram Opto Semiconductors Gmbh | Halbleiterlichtquelle |
DE102012210743A1 (de) * | 2012-06-25 | 2014-01-02 | Osram Gmbh | Leuchtvorrichtung mit lichtsensor |
JP2014017344A (ja) * | 2012-07-09 | 2014-01-30 | Olympus Corp | 光源装置 |
CN102788279B (zh) * | 2012-08-03 | 2015-01-28 | 珠海市集利发展有限公司 | Led光室 |
DE102012107290A1 (de) * | 2012-08-08 | 2014-02-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil, Konversionsmittelplättchen und Verfahren zur Herstellung eines Konversionsmittelplättchens |
WO2014026486A1 (zh) * | 2012-08-17 | 2014-02-20 | Qian Zhiqiang | 白光led发光装置 |
WO2014036409A2 (en) * | 2012-08-30 | 2014-03-06 | The Regents Of The University Of California | High-power, laser-driven, white light source using one or more phosphors |
US9574728B2 (en) | 2012-08-30 | 2017-02-21 | The Regents Of The University Of California | Laser-driven white lighting system for high-brightness applications |
DE102012215702A1 (de) * | 2012-09-05 | 2014-03-06 | Osram Gmbh | Beleuchtungseinrichtung |
US20140168963A1 (en) * | 2012-12-18 | 2014-06-19 | Musco Corporation | Multi-led lens with light pattern optimization |
DE102013206154A1 (de) * | 2013-04-08 | 2014-10-09 | Zumtobel Lighting Gmbh | Leuchtvorrichtung mit variabel einstellbarer Lichtfarbe |
US10788678B2 (en) | 2013-05-17 | 2020-09-29 | Excelitas Canada, Inc. | High brightness solid state illumination system for fluorescence imaging and analysis |
JP5796038B2 (ja) | 2013-06-18 | 2015-10-21 | デクセリアルズ株式会社 | 蛍光体シート |
US9877370B2 (en) | 2013-06-20 | 2018-01-23 | Philips Lighting Holding B.V. | Lighting device comprising at least two sets of LEDs |
DE102013106519A1 (de) * | 2013-06-21 | 2014-12-24 | Osram Opto Semiconductors Gmbh | Anordnung zur Erzeugung von Mischlicht und Verfahren zum Betrieb einer Anordnung von Mischlicht |
CN103840067A (zh) * | 2013-12-31 | 2014-06-04 | 吴震 | 波长转换装置和发光装置 |
DE102014100771A1 (de) * | 2014-01-23 | 2015-07-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines keramischen Konversionselements und Licht emittierendes Bauelement |
EP3201953B1 (en) * | 2014-10-01 | 2019-08-07 | Lumileds Holding B.V. | Light source with tunable emission spectrum |
US10091852B2 (en) * | 2014-10-24 | 2018-10-02 | Phoseon Technology, Inc. | Lighting system and methods for reducing noise at light sensing device |
US9995440B2 (en) | 2014-12-08 | 2018-06-12 | Intematix Corporation | Color temperature tunable and dimmable solid-state linear lighting arrangements |
WO2016096387A1 (en) * | 2014-12-16 | 2016-06-23 | Philips Lighting Holding B.V. | Working light, lighting system and use thereof |
JP6877342B2 (ja) * | 2014-12-16 | 2021-05-26 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | 照明装置、照明システム、並びに前記照明装置及び前記照明システムの使用 |
US9804096B1 (en) | 2015-01-14 | 2017-10-31 | Leidos Innovations Technology, Inc. | System and method for detecting latent images on a thermal dye printer film |
US10244601B2 (en) | 2015-05-26 | 2019-03-26 | Philips Lighting Holding B.V. | Switchable high color contrast lighting |
EP3104474A1 (en) * | 2015-06-08 | 2016-12-14 | Jabil Circuit Belgium NV | Enhanced eye-safe laser based lighting |
US9970629B2 (en) | 2015-10-19 | 2018-05-15 | GE Lighting Solutions, LLC | Remote phosphor lighting devices and methods |
DE202015105686U1 (de) * | 2015-10-26 | 2017-01-27 | Tridonic Gmbh & Co Kg | Weißes Licht abstrahlendes LED-Modul |
TWI578903B (zh) * | 2015-11-10 | 2017-04-21 | With low drag resistance of the variable wavelength LED lamps | |
CA2951301C (en) | 2015-12-09 | 2019-03-05 | Abl Ip Holding Llc | Color mixing for solid state lighting using direct ac drives |
TWI661582B (zh) * | 2016-03-08 | 2019-06-01 | National Central University | 主動式抑制藍光溢漏之led結構 |
CN109154425B (zh) * | 2016-05-13 | 2021-06-15 | 新唐科技日本株式会社 | 光源装置以及照明装置 |
US9854637B2 (en) | 2016-05-18 | 2017-12-26 | Abl Ip Holding Llc | Method for controlling a tunable white fixture using a single handle |
US9596730B1 (en) | 2016-05-18 | 2017-03-14 | Abl Ip Holding Llc | Method for controlling a tunable white fixture using multiple handles |
US10119676B2 (en) * | 2016-06-10 | 2018-11-06 | Osram Gmbh | Lighting device, corresponding lamp and method |
CN105957946A (zh) * | 2016-07-13 | 2016-09-21 | 中国人民大学 | 一种近自然光谱的led倒装照明器件 |
KR20180054165A (ko) * | 2016-11-15 | 2018-05-24 | 주식회사 알토 | 기능성 led 조명 장치 |
US10371896B2 (en) * | 2016-12-22 | 2019-08-06 | Magic Leap, Inc. | Color separation in planar waveguides using dichroic filters |
DE102017113375A1 (de) * | 2017-06-19 | 2018-12-20 | Schreiner Group Gmbh & Co. Kg | Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie |
DE102017113380A1 (de) | 2017-06-19 | 2018-12-20 | Schreiner Group Gmbh & Co. Kg | Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie |
CN109285929B (zh) * | 2017-07-21 | 2023-09-08 | 日亚化学工业株式会社 | 发光装置、集成型发光装置以及发光模块 |
TWI663746B (zh) * | 2018-05-30 | 2019-06-21 | 國立清華大學 | 亮度色溫可調光源及其用途 |
CN110630913B (zh) * | 2018-05-30 | 2022-02-01 | 周卓煇 | 亮度色温可调光源及其用途 |
US10874006B1 (en) | 2019-03-08 | 2020-12-22 | Abl Ip Holding Llc | Lighting fixture controller for controlling color temperature and intensity |
US10728979B1 (en) | 2019-09-30 | 2020-07-28 | Abl Ip Holding Llc | Lighting fixture configured to provide multiple lighting effects |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1538534A (zh) * | 2003-04-15 | 2004-10-20 | 郑荣彬 | 白光发光装置 |
US20060258028A1 (en) * | 2004-11-12 | 2006-11-16 | Philips Lumileds Lighting Company Llc | Color control by alteration of wavelength converting element |
EP1605199A3 (en) * | 2004-06-04 | 2011-01-26 | Philips Lumileds Lighting Company LLC | Remote wavelength conversion in an illumination device |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5758644A (en) * | 1995-06-07 | 1998-06-02 | Masimo Corporation | Manual and automatic probe calibration |
JP3486345B2 (ja) * | 1998-07-14 | 2004-01-13 | 東芝電子エンジニアリング株式会社 | 半導体発光装置 |
WO2000019546A1 (en) * | 1998-09-28 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Lighting system |
US6404125B1 (en) * | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
US6357889B1 (en) * | 1999-12-01 | 2002-03-19 | General Electric Company | Color tunable light source |
JP4932078B2 (ja) * | 2000-12-04 | 2012-05-16 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
TW522534B (en) * | 2001-09-11 | 2003-03-01 | Hsiu-Hen Chang | Light source of full color LED using die bonding and packaging technology |
US6777883B2 (en) * | 2002-04-10 | 2004-08-17 | Koninklijke Philips Electronics N.V. | Integrated LED drive electronics on silicon-on-insulator integrated circuits |
JP4197109B2 (ja) * | 2002-08-06 | 2008-12-17 | 静雄 藤田 | 照明装置 |
JP2004207367A (ja) * | 2002-12-24 | 2004-07-22 | Toyoda Gosei Co Ltd | 発光ダイオード及び発光ダイオード配列板 |
JP3717480B2 (ja) * | 2003-01-27 | 2005-11-16 | ローム株式会社 | 半導体発光装置 |
DE20309033U1 (de) | 2003-06-11 | 2003-12-04 | Dr. Adrian Mahlkow Out E.V. | Modul für variable, langzeitstabile Licht- und Farbwiedergabe |
US6919584B2 (en) | 2003-06-19 | 2005-07-19 | Harvatek Corporation | White light source |
JP4217558B2 (ja) * | 2003-08-29 | 2009-02-04 | キヤノン株式会社 | 記録媒体種類の識別装置、記録装置、および識別方法 |
US7250715B2 (en) | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
DE102005020695B4 (de) | 2004-04-30 | 2006-06-22 | Optotransmitter-Umweltschutz-Technologie E.V. | Vorrichtung zur Emission von Strahlung mit einstellbarer Spektraleigenschaft |
KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
US7144131B2 (en) * | 2004-09-29 | 2006-12-05 | Advanced Optical Technologies, Llc | Optical system using LED coupled with phosphor-doped reflective materials |
JP4534717B2 (ja) * | 2004-10-29 | 2010-09-01 | 豊田合成株式会社 | 発光装置 |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
CN102003659B (zh) * | 2005-02-14 | 2013-09-04 | 三菱化学株式会社 | 照明用光源及其制造方法 |
JP4679183B2 (ja) * | 2005-03-07 | 2011-04-27 | シチズン電子株式会社 | 発光装置及び照明装置 |
JP4389840B2 (ja) * | 2005-05-26 | 2009-12-24 | パナソニック電工株式会社 | 半導体素子実装用回路基板の製造方法 |
-
2006
- 2006-12-15 US US11/611,351 patent/US7902560B2/en active Active
-
2007
- 2007-12-12 JP JP2009540957A patent/JP2010514153A/ja active Pending
- 2007-12-12 WO PCT/IB2007/055063 patent/WO2008072196A1/en active Application Filing
- 2007-12-12 CN CN201510764564.7A patent/CN105428344A/zh active Pending
- 2007-12-12 KR KR1020097014325A patent/KR20090096627A/ko not_active Application Discontinuation
- 2007-12-12 CN CN2007800459699A patent/CN102439721A/zh active Pending
- 2007-12-12 EP EP07849460A patent/EP2102909A1/en not_active Ceased
- 2007-12-12 RU RU2009127111/28A patent/RU2468472C2/ru active
- 2007-12-12 BR BRPI0720065-0A patent/BRPI0720065A2/pt active Search and Examination
- 2007-12-13 TW TW096147720A patent/TWI497744B/zh active
-
2011
- 2011-01-28 US US13/015,916 patent/US20110121758A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1538534A (zh) * | 2003-04-15 | 2004-10-20 | 郑荣彬 | 白光发光装置 |
EP1605199A3 (en) * | 2004-06-04 | 2011-01-26 | Philips Lumileds Lighting Company LLC | Remote wavelength conversion in an illumination device |
US20060258028A1 (en) * | 2004-11-12 | 2006-11-16 | Philips Lumileds Lighting Company Llc | Color control by alteration of wavelength converting element |
Also Published As
Publication number | Publication date |
---|---|
CN102439721A (zh) | 2012-05-02 |
TW200843145A (en) | 2008-11-01 |
WO2008072196A1 (en) | 2008-06-19 |
US20080142816A1 (en) | 2008-06-19 |
JP2010514153A (ja) | 2010-04-30 |
RU2468472C2 (ru) | 2012-11-27 |
BRPI0720065A2 (pt) | 2013-12-17 |
US20110121758A1 (en) | 2011-05-26 |
RU2009127111A (ru) | 2011-01-20 |
US7902560B2 (en) | 2011-03-08 |
TWI497744B (zh) | 2015-08-21 |
EP2102909A1 (en) | 2009-09-23 |
KR20090096627A (ko) | 2009-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105428344A (zh) | 使用波长转换元件的可调白点光源 | |
US10008484B2 (en) | Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters | |
US8497629B2 (en) | Color-temperature-tunable device | |
JP5616000B2 (ja) | コンパクトな色可変光源としてのシングルチップled | |
US8403529B2 (en) | LED-based illumination module with preferentially illuminated color converting surfaces | |
JP3940596B2 (ja) | 照明光源 | |
JP4386693B2 (ja) | Ledランプおよびランプユニット | |
US8143777B2 (en) | LED lighting unit with LEDs and phosphor materials | |
US9080729B2 (en) | Multiple-LED emitter for A-19 lamps | |
KR20110026490A (ko) | 광혼합재를 포함하는 고상 조명 디바이스 | |
JP2002057376A (ja) | Ledランプ | |
TW201205892A (en) | LED-based light emitting systems and devices | |
US20080315217A1 (en) | Semiconductor Light Source and Method of Producing Light of a Desired Color Point | |
JP2006261702A (ja) | 照明光源 | |
JP2006080334A (ja) | Led発光装置 | |
EP2820351B1 (en) | Led lighting arrangement | |
KR20220094290A (ko) | 백색 발광장치 및 조명 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160323 |
|
WD01 | Invention patent application deemed withdrawn after publication |