CN105419709B - 一种电子产品用密封胶组合物 - Google Patents

一种电子产品用密封胶组合物 Download PDF

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CN105419709B
CN105419709B CN201610030598.8A CN201610030598A CN105419709B CN 105419709 B CN105419709 B CN 105419709B CN 201610030598 A CN201610030598 A CN 201610030598A CN 105419709 B CN105419709 B CN 105419709B
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彭孝茹
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Shenzhen Dover Technology Co., Ltd.
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Abstract

本发明公开了一种电子产品用密封胶组合物，其特征在于，包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯10~15份、杂萘联苯聚芳醚5~15份、聚四氢呋喃醚二醇12~20份、纳米级碳酸钙20~30份、固化剂3~5份和表干剂5~12份。本发明所得的密封胶组合物具有合适的固化速度，易于施工/加工，而且密封胶组合物的粘结强度高、电绝缘性优良，适用范围广。

Description

一种电子产品用密封胶组合物
技术领域
本发明涉及一种密封胶，具体涉及一种电子产品用的密封胶组合物，属于高分子材料技术领域。
背景技术
电子产品密封胶为主要用于电子产品的粘接与密封、重要零部件的保护性加固密封保护或其他行业中需粘结或密封的一种胶体，可以粘结金属及非金属材质，起到粘结、固定、密封、灌封、涂覆等作用。由于用途的特殊性，电子产品用的密封胶应该具备耐电晕、耐老化、抗漏电、电气绝缘性能佳、密封性强等特点。
现有的电子密封胶在冬季温度、湿度很低的环境下或者高温、高湿的环境下，通常固化较慢；而在高温、干燥的环境下或者干燥、风干情况下，通常固化较快，往往来不及施工即已固化；其固化速度无法满足现代电子产品生产或者维修施工的需求。
发明内容
针对现有技术不足，本发明提供了一种电子产品用密封胶组合物，具有合适的固化速度，易于施工/加工，而且密封胶组合物的粘结强度高、电绝缘性优良，适用范围广。
本发明解决上述技术问题采用的技术方案为：一种电子产品用密封胶组合物，其包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯10~15份、杂萘联苯聚芳醚5~15份、聚四氢呋喃醚二醇12~20份、纳米级碳酸钙20~30份、固化剂3~5份和表干剂5~12份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；
所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%。
进一步地，所述固化剂为多元醇N330、多元醇MN–700、芳香胺ML–200中的一种。
进一步地，所述表干剂为甲苯二异氰酸酯(TDI)。
与现有技术相比，本发明的一种电子产品用密封胶组合物所具备的优点：本发明通过多次试验获得一种合理的原料配方，所得密封胶具有合适的固化速度，易于施工/加工，而且密封胶组合物的粘结强度高、电绝缘性优良，适用范围广；对ABS、PVC、高密度 聚苯乙烯（HIPS）等各种塑料，微晶玻璃和金属有良好的粘结性且粘结强度高，一般不需要使用底涂；耐水性好，防潮防水性能优越，耐高低温性能优越，在-50℃～+200℃范围内性能变化不大；无毒、挥发性小，不会在电子器材表面留下油污或出现雾状，安全环保。
密封胶最终性能取决于合成的预聚物分子的化学组成与构型，例如平均聚合度(分子链长度)、主链性质、分子量分布情况、交联与支链的存在与否、分子链的定向作用等，本发明中改性环氧树脂、杂萘联苯聚芳醚各独立分子中含刚性结构芳环、杂萘环、醚键、高聚合度分子链，与可起优异塑化性的邻苯二甲酸二辛酯共混形成胶粘性优良的密封胶基料；在本发明中，纳米级碳酸钙可改善密封胶的施工性和温度敏感性，使密封胶可以在较宽温度下保持胶粘性；聚四氢呋喃醚二醇(PTMEG)的玻璃化转变温度低，可在较低环境温度下（-50℃）使用，不会产生粘接破坏及脆化，而且可改善高温粘附性，缓解高温带来的流动性过强及粘附性下降；表干剂TDI对产品性能影响较大，尤其对固化速度和表面干燥速度的影响最明显，TDI的添加可助密封胶实施后20min左右表干，在满足密封施工所需时间的要求前提下，表干时间较快。
具体实施方式
下面结合具体实施例对本发明做进一步的说明。
实施例1：一种电子产品用密封胶组合物，其包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯12份、杂萘联苯聚芳醚10份、聚四氢呋喃醚二醇15份、纳米级碳酸钙25份、固化剂4份和表干剂8份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；
所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%。
进一步地，所述固化剂为多元醇N330，所述表干剂为甲苯二异氰酸酯(TDI)。
实施例2：一种电子产品用密封胶组合物，其包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯10份、杂萘联苯聚芳醚5份、聚四氢呋喃醚二醇12份、纳米级碳酸钙20份、固化剂3份和表干剂5份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；
所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%。
进一步地，所述固化剂为多元醇MN–700，所述表干剂为甲苯二异氰酸酯(TDI)。
实施例3：一种电子产品用密封胶组合物，其包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯15份、杂萘联苯聚芳醚15份、聚四氢呋喃醚二醇20份、纳米级碳酸钙30份、固化剂5份和表干剂12份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；
所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%。
进一步地，所述固化剂为芳香胺ML–200，所述表干剂为甲苯二异氰酸酯(TDI)。
实施例4：一种电子产品用密封胶组合物，其包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯10份、杂萘联苯聚芳醚15份、聚四氢呋喃醚二醇12份、纳米级碳酸钙30份、固化剂3份和表干剂12份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；
所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%。
进一步地，所述固化剂为多元醇N330，所述表干剂为甲苯二异氰酸酯(TDI)。
实施例5：一种电子产品用密封胶组合物，其包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯11份、杂萘联苯聚芳醚8份、聚四氢呋喃醚二醇18份、纳米级碳酸钙27份、固化剂4份和表干剂10份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；
所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%。
进一步地，所述固化剂为多元醇N330，所述表干剂为甲苯二异氰酸酯(TDI)。
经测试，实施例1-5所得密封胶的性能指标如下表所示：
性能 实施例1 实施例2 实施例3 实施例4 实施例5
体积电阻率 GB/T1692-2008 1.6×1016Ω,cm 1.3×1016Ω,cm 1.4×1016Ω,cm 1.3×1016Ω,cm 1.5×1016Ω,cm
表干时间 20min 19min 22min 22min 21min
本发明的密封胶在实施时粘附性较强，在实施后20min左右即可形成表干，表面光滑，表面粘附性急剧下降，对加工/实施物料的其他操作不产生粘附性影响，具有良好的实用性。

Claims (1)

1.一种电子产品用密封胶组合物，其特征在于，包括一线原料：改性环氧树脂、邻苯二甲酸二辛酯、杂萘联苯聚芳醚、聚四氢呋喃醚二醇、纳米级碳酸钙、固化剂和表干剂，所述原
料的质量份数为：改性环氧树脂100份、邻苯二甲酸二辛酯10~15份、杂萘联苯聚芳醚5~15份、聚四氢呋喃醚二醇12~20份、纳米级碳酸钙20~30份、固化剂3~5份和表干剂5~12份；
所述的改性环氧树脂为端羟基液体丁腈橡胶改性环氧树脂，所述端羟基液体丁腈橡胶改性环氧树脂的制备方法为：先将端羟基液体丁腈橡胶与2 ,4-甲苯二异氰酸酯置于反应釜中于85℃下抽真空反应4h，得预聚体，然后将环氧树脂置于充满惰性气体的反应釜中，加热至100℃后加入预聚体，抽真空保温反应4h；所述预聚体的量为环氧树脂量的30%，所述2,4-甲苯二异氰酸酯的量为端羟基液体丁腈橡胶量的25%；
所述固化剂为多元醇N330、多元醇MN-700、芳香胺ML-200中的一种；
所述表干剂为甲苯二异氰酸酯(TDI)。
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