CN105405774B - 裸片接合装置及接合方法 - Google Patents

裸片接合装置及接合方法 Download PDF

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Publication number
CN105405774B
CN105405774B CN201510566562.7A CN201510566562A CN105405774B CN 105405774 B CN105405774 B CN 105405774B CN 201510566562 A CN201510566562 A CN 201510566562A CN 105405774 B CN105405774 B CN 105405774B
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China
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mentioned
bare die
adsorption plane
collet chuck
foreign matter
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CN201510566562.7A
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Chinese (zh)
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CN105405774A (zh
Inventor
冈本直树
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Jie Jin Science And Technology Ltd
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Jie Jin Science And Technology Ltd
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Publication of CN105405774A publication Critical patent/CN105405774A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201510566562.7A 2014-09-10 2015-09-08 裸片接合装置及接合方法 Active CN105405774B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014184214A JP6391378B2 (ja) 2014-09-10 2014-09-10 ダイボンダ及びボンディング方法
JP2014-184214 2014-09-10

Publications (2)

Publication Number Publication Date
CN105405774A CN105405774A (zh) 2016-03-16
CN105405774B true CN105405774B (zh) 2019-06-21

Family

ID=55471181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510566562.7A Active CN105405774B (zh) 2014-09-10 2015-09-08 裸片接合装置及接合方法

Country Status (4)

Country Link
JP (1) JP6391378B2 (ko)
KR (2) KR20160030451A (ko)
CN (1) CN105405774B (ko)
TW (2) TWI626696B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201810369UA (en) * 2016-03-22 2018-12-28 Shinkawa Kk Bonding apparatus and bonding method
JP6797569B2 (ja) * 2016-06-13 2020-12-09 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6705727B2 (ja) 2016-09-26 2020-06-03 ファスフォードテクノロジ株式会社 フリップチップボンダおよび半導体装置の製造方法
JP6827836B2 (ja) * 2017-02-13 2021-02-10 株式会社Ｓｃｒｅｅｎホールディングス 異物除去処理評価方法
JP6846958B2 (ja) * 2017-03-09 2021-03-24 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP6694404B2 (ja) * 2017-03-17 2020-05-13 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP6705765B2 (ja) * 2017-03-23 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102042268B1 (ko) * 2018-03-19 2019-11-27 주식회사 아이플렉스 픽커 유닛
JP7520637B2 (ja) * 2020-08-18 2024-07-23 ファスフォードテクノロジ株式会社 ダイボンディング装置、クリーニングヘッドおよび半導体装置の製造方法
JP7039675B2 (ja) * 2020-11-18 2022-03-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102280950B1 (ko) * 2021-03-31 2021-07-26 주식회사 에스에프이 반도체 패키지 이송 장치
CN113113336B (zh) * 2021-04-21 2022-06-14 莆田学院 一种阳极键合设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102693930A (zh) * 2011-03-23 2012-09-26 株式会社日立高新技术仪器 裸片粘接机的拾取方法及裸片粘接机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302630A (ja) * 1993-04-16 1994-10-28 Sumitomo Electric Ind Ltd ダイボンディング方法及び装置
JP2000252305A (ja) * 1999-03-02 2000-09-14 Toshiba Corp チップマウント装置
JP2004146477A (ja) * 2002-10-23 2004-05-20 Nec Kansai Ltd 吸着ノズルの清掃装置及び清掃方法
JP3929436B2 (ja) * 2003-12-03 2007-06-13 東レエンジニアリング株式会社 ヘッド加圧面の清掃方法
TWI254397B (en) * 2005-05-13 2006-05-01 King Yuan Electronics Co Ltd Apparatus and method of automatically cleaning a pick-up head
JP5171524B2 (ja) * 2007-10-04 2013-03-27 株式会社日立ハイテクノロジーズ 物体表面の欠陥検査装置および方法
JP5018750B2 (ja) * 2008-11-25 2012-09-05 パナソニック株式会社 部品実装装置
TWI397143B (zh) * 2009-10-20 2013-05-21 Mpi Corporaion Automatic cleaning of the nozzle device and methods
JP5989313B2 (ja) * 2011-09-15 2016-09-07 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5815345B2 (ja) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
US20130120936A1 (en) * 2011-11-11 2013-05-16 Vale S/A Scanner protection casing and system of reading the height of the pellet bed of grid cars inside a grid furnace comprising a scanner protected by said casing
JP2014060249A (ja) * 2012-09-18 2014-04-03 Hitachi High-Tech Instruments Co Ltd ダイボンダ、および、ダイの位置認識方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102693930A (zh) * 2011-03-23 2012-09-26 株式会社日立高新技术仪器 裸片粘接机的拾取方法及裸片粘接机

Also Published As

Publication number Publication date
TWI626696B (zh) 2018-06-11
JP2016058575A (ja) 2016-04-21
TWI575613B (zh) 2017-03-21
TW201628102A (zh) 2016-08-01
KR20170054371A (ko) 2017-05-17
CN105405774A (zh) 2016-03-16
JP6391378B2 (ja) 2018-09-19
KR101938476B1 (ko) 2019-01-14
KR20160030451A (ko) 2016-03-18
TW201719774A (zh) 2017-06-01

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