CN105404097B - 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法 - Google Patents

移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法 Download PDF

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Publication number
CN105404097B
CN105404097B CN201510651366.XA CN201510651366A CN105404097B CN 105404097 B CN105404097 B CN 105404097B CN 201510651366 A CN201510651366 A CN 201510651366A CN 105404097 B CN105404097 B CN 105404097B
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moving body
exposure
mobile
substrate
supporting member
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CN105404097A (zh
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青木保夫
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201510651366.XA 2010-09-07 2011-09-05 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法 Active CN105404097B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38043310P 2010-09-07 2010-09-07
US61/380,433 2010-09-07
US13/223,970 2011-09-01
US13/223,970 US20120064460A1 (en) 2010-09-07 2011-09-01 Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
CN201180043098.3A CN103097957B (zh) 2010-09-07 2011-09-05 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法

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CN105404097A CN105404097A (zh) 2016-03-16
CN105404097B true CN105404097B (zh) 2019-06-21

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CN201180043098.3A Active CN103097957B (zh) 2010-09-07 2011-09-05 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法

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US (1) US20120064460A1 (enExample)
JP (4) JP5909934B2 (enExample)
KR (3) KR101911724B1 (enExample)
CN (2) CN105404097B (enExample)
HK (1) HK1222921A1 (enExample)
TW (4) TWI538078B (enExample)
WO (1) WO2012033212A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2954561B2 (ja) 1997-01-20 1999-09-27 松下電子工業株式会社 リードフレーム、リードフレームを用いた樹脂封止半導体装置の成形金型、リードフレームを用いた樹脂封止半導体装置および樹脂封止半導体装置の製造方法
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US20110053092A1 (en) * 2009-08-20 2011-03-03 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8988655B2 (en) 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
JP5958692B2 (ja) * 2012-04-04 2016-08-02 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法
JP6035670B2 (ja) * 2012-08-07 2016-11-30 株式会社ニコン 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光装置
CN107436540B (zh) * 2012-08-08 2020-05-26 株式会社尼康 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法
JP6172913B2 (ja) * 2012-10-23 2017-08-02 キヤノン株式会社 ステージ装置、露光装置および物品の製造方法
JP6086299B2 (ja) * 2012-11-13 2017-03-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6358564B2 (ja) 2012-11-30 2018-07-18 株式会社ニコン 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置
WO2015147039A1 (ja) * 2014-03-26 2015-10-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
KR101907864B1 (ko) * 2014-03-28 2018-10-15 가부시키가이샤 니콘 이동체 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 이동체 구동 방법
CN111151749A (zh) 2014-11-14 2020-05-15 株式会社尼康 造形装置及造形方法
JP6712411B2 (ja) * 2015-03-30 2020-06-24 株式会社ニコン 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法
WO2016159176A1 (ja) * 2015-03-31 2016-10-06 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
US10520834B2 (en) * 2015-09-30 2019-12-31 Nikon Corporation Movable body apparatus, exposure apparatus, manufacturing method of flat-panel display and device manufacturing method, and movement method of object
JP6885336B2 (ja) * 2015-09-30 2021-06-16 株式会社ニコン 露光装置、露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6885334B2 (ja) * 2015-09-30 2021-06-16 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光方法
CN106814551B (zh) * 2015-11-30 2019-04-12 上海微电子装备（集团）股份有限公司 一种基板交接装置及交接方法
JP6874314B2 (ja) * 2016-09-30 2021-05-19 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6945624B2 (ja) 2016-10-20 2021-10-06 モレキュラー インプリンツ， インコーポレイテッドＭｏｌｅｃｕｌａｒ Ｉｍｐｒｉｎｔｓ，Ｉｎｃ． インプリントリソグラフィプロセスにおける基板の位置付け
CN107193142A (zh) * 2017-07-19 2017-09-22 武汉华星光电技术有限公司 配向膜固化系统
CN107228127B (zh) * 2017-07-21 2023-06-06 天津航天机电设备研究所 一种气浮轴承
KR102481264B1 (ko) * 2018-01-04 2022-12-26 삼성전자주식회사 디스플레이 장치 및 디스플레이 모듈의 힌지 조립체
JP7473195B2 (ja) * 2020-09-14 2024-04-23 株式会社ブイ・テクノロジー 集束荷電粒子ビーム装置
JP2024043963A (ja) * 2022-09-20 2024-04-02 キオクシア株式会社 パターン形成方法、半導体装置の製造方法、及びインプリント装置
US12090590B1 (en) 2023-10-10 2024-09-17 Wuxi Xivi Science And Technology Co., Ltd. Six-degree-of-freedom air-floating moving apparatus

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1993803A (zh) * 2004-11-25 2007-07-04 株式会社尼康 移动体系统、曝光装置及组件制造方法
EP2037137A2 (en) * 2001-02-27 2009-03-18 Canon Kabushiki Kaisha Stage device
CN101405838A (zh) * 2006-09-01 2009-04-08 株式会社尼康 移动体驱动方法及移动体驱动系统、图案形成方法及装置、曝光方法及装置、组件制造方法、以及校正方法
CN101551599A (zh) * 2009-04-03 2009-10-07 清华大学 一种光刻机硅片台双台交换系统
CN101551593A (zh) * 2009-04-24 2009-10-07 上海微电子装备有限公司 用于光刻装置的对准系统、光刻装置及其对准方法
CN101611470A (zh) * 2007-03-05 2009-12-23 株式会社尼康 移动体装置、图案形成装置及图案形成方法、设备制造方法、移动体装置的制造方法以及移动体驱动方法
CN101681116A (zh) * 2007-11-08 2010-03-24 株式会社尼康 移动体装置、图案形成装置及曝光装置、以及元件制造方法
CN101681810A (zh) * 2007-12-28 2010-03-24 株式会社尼康 移动体驱动方法及装置、曝光方法及装置、图案形成方法及装置、以及器件制造方法
CN101680747A (zh) * 2007-12-28 2010-03-24 株式会社尼康 移动体驱动系统、图案形成装置、曝光装置及曝光方法、以及器件制造方法
CN101796614A (zh) * 2008-02-08 2010-08-04 株式会社尼康 位置测量系统及位置测量方法、移动体装置、移动体驱动方法、曝光装置及曝光方法、图案形成装置、以及组件制造方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2812785B2 (ja) * 1990-06-02 1998-10-22 株式会社日立製作所 試料位置決め装置
US5196745A (en) * 1991-08-16 1993-03-23 Massachusetts Institute Of Technology Magnetic positioning device
JPH11504770A (ja) * 1996-03-04 1999-04-27 アーエスエム リソグラフィ ベスローテン フェンノートシャップ マスクパターンをステップ及びスキャン結像するリソグラフィ装置
US6089525A (en) * 1997-10-07 2000-07-18 Ultratech Stepper, Inc. Six axis active vibration isolation and payload reaction force compensation system
TWI233535B (en) * 1999-04-19 2005-06-01 Asml Netherlands Bv Motion feed-through into a vacuum chamber and its application in lithographic projection apparatuses
US6654095B1 (en) * 1999-10-18 2003-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP2001215718A (ja) 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6888620B2 (en) * 2001-11-29 2005-05-03 Nikon Corporation System and method for holding a device with minimal deformation
JP2004063790A (ja) * 2002-07-29 2004-02-26 Nikon Corp 露光装置及びデバイス製造方法
TWI338323B (en) * 2003-02-17 2011-03-01 Nikon Corp Stage device, exposure device and manufacguring method of devices
EP1519230A1 (en) * 2003-09-29 2005-03-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005317916A (ja) * 2004-03-30 2005-11-10 Canon Inc 露光装置及びデバイス製造方法
US7604439B2 (en) * 2004-04-14 2009-10-20 Coreflow Scientific Solutions Ltd. Non-contact support platforms for distance adjustment
KR101119814B1 (ko) * 2004-06-07 2012-03-06 가부시키가이샤 니콘 스테이지 장치, 노광 장치 및 노광 방법
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
JP4793851B2 (ja) * 2005-05-31 2011-10-12 レーザーテック株式会社 カラーフィルタ基板のステージ装置及び検査装置
JP4917780B2 (ja) * 2005-09-08 2012-04-18 住友化学株式会社 露光装置
JP5040657B2 (ja) * 2005-10-24 2012-10-03 株式会社ニコン 露光装置、露光方法、デバイスの製造方法、デバイス組立方法
JP2007150280A (ja) * 2005-11-04 2007-06-14 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP4545697B2 (ja) * 2006-02-17 2010-09-15 住友重機械工業株式会社 ステージ装置
CN102749813B (zh) * 2006-09-01 2014-12-03 株式会社尼康 曝光方法及装置、以及组件制造方法
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
US8937706B2 (en) * 2007-03-30 2015-01-20 Asml Netherlands B.V. Lithographic apparatus and method
JP5279207B2 (ja) * 2007-06-11 2013-09-04 Ｎｓｋテクノロジー株式会社 露光装置用基板搬送機構
JP5056339B2 (ja) * 2007-10-18 2012-10-24 凸版印刷株式会社 基板搬送装置用基板把持機構
NL1036511A1 (nl) * 2008-02-13 2009-08-14 Asml Netherlands Bv Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object.
JP2009210295A (ja) * 2008-02-29 2009-09-17 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
JP5117243B2 (ja) * 2008-03-27 2013-01-16 株式会社オーク製作所 露光装置
CN101598900B (zh) * 2008-06-05 2012-03-07 四川虹欧显示器件有限公司 等离子显示屏的曝光方法
KR100977466B1 (ko) * 2008-07-04 2010-08-23 한국전기연구원 원통형 자기부상 스테이지
KR20100018950A (ko) 2008-08-08 2010-02-18 하명찬 타이어 가황기용 단열판
JP5254073B2 (ja) * 2008-08-21 2013-08-07 Ｎｓｋテクノロジー株式会社 スキャン露光装置およびスキャン露光装置の基板搬送方法
JP2010060990A (ja) * 2008-09-05 2010-03-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP4787872B2 (ja) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 基板搬送処理装置
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US20100195083A1 (en) * 2009-02-03 2010-08-05 Wkk Distribution, Ltd. Automatic substrate transport system
NL2003877A (en) * 2009-02-05 2010-08-09 Asml Holding Nv Reticle support that reduces reticle slippage.
JP2011192332A (ja) * 2010-03-12 2011-09-29 Panasonic Corp メモリオーディオ再生装置
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2037137A2 (en) * 2001-02-27 2009-03-18 Canon Kabushiki Kaisha Stage device
CN1993803A (zh) * 2004-11-25 2007-07-04 株式会社尼康 移动体系统、曝光装置及组件制造方法
CN101405838A (zh) * 2006-09-01 2009-04-08 株式会社尼康 移动体驱动方法及移动体驱动系统、图案形成方法及装置、曝光方法及装置、组件制造方法、以及校正方法
CN101611470A (zh) * 2007-03-05 2009-12-23 株式会社尼康 移动体装置、图案形成装置及图案形成方法、设备制造方法、移动体装置的制造方法以及移动体驱动方法
CN101681116A (zh) * 2007-11-08 2010-03-24 株式会社尼康 移动体装置、图案形成装置及曝光装置、以及元件制造方法
CN101681810A (zh) * 2007-12-28 2010-03-24 株式会社尼康 移动体驱动方法及装置、曝光方法及装置、图案形成方法及装置、以及器件制造方法
CN101680747A (zh) * 2007-12-28 2010-03-24 株式会社尼康 移动体驱动系统、图案形成装置、曝光装置及曝光方法、以及器件制造方法
CN101796614A (zh) * 2008-02-08 2010-08-04 株式会社尼康 位置测量系统及位置测量方法、移动体装置、移动体驱动方法、曝光装置及曝光方法、图案形成装置、以及组件制造方法
CN101551599A (zh) * 2009-04-03 2009-10-07 清华大学 一种光刻机硅片台双台交换系统
CN101551593A (zh) * 2009-04-24 2009-10-07 上海微电子装备有限公司 用于光刻装置的对准系统、光刻装置及其对准方法

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