CN105378151B - 通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 - Google Patents

通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 Download PDF

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Publication number
CN105378151B
CN105378151B CN201480037943.XA CN201480037943A CN105378151B CN 105378151 B CN105378151 B CN 105378151B CN 201480037943 A CN201480037943 A CN 201480037943A CN 105378151 B CN105378151 B CN 105378151B
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China
Prior art keywords
solution
tin
water
amount
gold
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Expired - Fee Related
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CN201480037943.XA
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Chinese (zh)
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CN105378151A (zh
Inventor
T·A·伍德罗
J·A·尼耳森
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Boeing Co
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Boeing Co
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Priority to CN201810419361.8A priority Critical patent/CN108360029B/zh
Publication of CN105378151A publication Critical patent/CN105378151A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201480037943.XA 2013-07-05 2014-04-29 通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 Expired - Fee Related CN105378151B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810419361.8A CN108360029B (zh) 2013-07-05 2014-04-29 通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/935,832 US10260159B2 (en) 2013-07-05 2013-07-05 Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
US13/935,832 2013-07-05
PCT/US2014/035890 WO2015002691A1 (en) 2013-07-05 2014-04-29 Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810419361.8A Division CN108360029B (zh) 2013-07-05 2014-04-29 通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

Publications (2)

Publication Number Publication Date
CN105378151A CN105378151A (zh) 2016-03-02
CN105378151B true CN105378151B (zh) 2020-08-28

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CN201480037943.XA Expired - Fee Related CN105378151B (zh) 2013-07-05 2014-04-29 通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置
CN201810419361.8A Expired - Fee Related CN108360029B (zh) 2013-07-05 2014-04-29 通过将锡与金掺杂减轻锡和镀锡表面上的锡须生长的方法和装置

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Country Status (5)

Country Link
US (1) US10260159B2 (enExample)
EP (1) EP3017092A1 (enExample)
JP (1) JP6448634B2 (enExample)
CN (2) CN105378151B (enExample)
WO (1) WO2015002691A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106547769B (zh) 2015-09-21 2020-06-02 阿里巴巴集团控股有限公司 一种doi显示方法及装置
US11686007B2 (en) * 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
CN110106537A (zh) * 2019-06-26 2019-08-09 浙江金卓首饰有限公司 一种用于制备3d硬金的电铸液和3d硬金的制备方法
JP7686981B2 (ja) * 2021-01-13 2025-06-03 三菱マテリアル株式会社 錫合金めっき液

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US3764489A (en) * 1968-11-28 1973-10-09 Oxy Metal Finishing Corp Electrodeposition of gold alloys
US4013523A (en) * 1975-12-24 1977-03-22 Oxy Metal Industries Corporation Tin-gold electroplating bath and process
US4310392A (en) * 1979-12-31 1982-01-12 Bell Telephone Laboratories, Incorporated Electrolytic plating
JPS6115992A (ja) * 1984-06-29 1986-01-24 Sumitomo Metal Mining Co Ltd 金−錫合金メツキ浴及びメツキ方法
US6245208B1 (en) * 1999-04-13 2001-06-12 Governors Of The University Of Alberta Codepositing of gold-tin alloys
WO2005118917A1 (en) * 2004-06-01 2005-12-15 Technic, Inc. Electroplating solution for alloys of gold with tin

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JPS5339003B2 (enExample) * 1973-08-28 1978-10-19
JPS55107795A (en) * 1979-02-08 1980-08-19 Seiko Epson Corp Gold tin alloy electroplating bath and plating method
US4959278A (en) 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof
US5393573A (en) 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
DE19623274A1 (de) 1996-05-31 1997-12-04 Atotech Deutschland Gmbh Wäßrige Lösung zur elektrolytischen Abscheidung von Zinn oder einer Zinnlegierung
US5750017A (en) 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
AU8670798A (en) 1997-07-30 1999-02-22 Whitaker Corporation, The Two layer solderable tin coating
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US20020192492A1 (en) 2001-05-11 2002-12-19 Abys Joseph Anthony Metal article coated with near-surface doped tin or tin alloy
EP1260614B1 (en) 2001-05-24 2008-04-23 Shipley Co. L.L.C. Tin plating
JP3716925B2 (ja) * 2002-01-30 2005-11-16 株式会社ナウケミカル Ａｕ−Ｓｎ合金めっき液
US6860981B2 (en) 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
ITMI20021388A1 (it) * 2002-06-24 2003-12-24 Milano Politecnico Bagno elettrolitico per l'elettrodeposizione di metalli nobili e loroleghe con stagno
JP4521228B2 (ja) * 2003-07-28 2010-08-11 正也 市村 光析出による金メッキ法及び金メッキ膜形成装置
US7391116B2 (en) 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
WO2005110287A2 (en) * 2004-05-11 2005-11-24 Technic, Inc. Electroplating solution for gold-tin eutectic alloy
JP2006009039A (ja) 2004-06-21 2006-01-12 Rambo Chemicals (Hong Kong) Ltd ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
WO2006078549A1 (en) * 2005-01-21 2006-07-27 Technic, Inc. Pulse plating process for deposition of gold-tin alloy
US20070007144A1 (en) 2005-07-11 2007-01-11 Schetty Robert A Iii Tin electrodeposits having properties or characteristics that minimize tin whisker growth
US20070295530A1 (en) 2006-06-07 2007-12-27 Honeywell International, Inc. Coatings and methods for inhibiting tin whisker growth
US7604871B2 (en) 2006-06-07 2009-10-20 Honeywell International Inc. Electrical components including abrasive powder coatings for inhibiting tin whisker growth
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
JP5396583B2 (ja) * 2008-02-07 2014-01-22 石原ケミカル株式会社 電気スズ又はスズ合金メッキ浴、当該メッキ皮膜を形成した電子部品
JP5479767B2 (ja) 2008-03-31 2014-04-23 古河電気工業株式会社 接続部品用金属角線材およびその製造方法
CN101981235A (zh) * 2008-03-31 2011-02-23 古河电气工业株式会社 连接零件用金属材料及其制造方法
JP6145671B2 (ja) * 2012-12-24 2017-06-14 石原ケミカル株式会社 スズ又はスズ合金メッキ浴及び当該メッキ浴を用いて皮膜形成した電子部品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764489A (en) * 1968-11-28 1973-10-09 Oxy Metal Finishing Corp Electrodeposition of gold alloys
US4013523A (en) * 1975-12-24 1977-03-22 Oxy Metal Industries Corporation Tin-gold electroplating bath and process
US4310392A (en) * 1979-12-31 1982-01-12 Bell Telephone Laboratories, Incorporated Electrolytic plating
JPS6115992A (ja) * 1984-06-29 1986-01-24 Sumitomo Metal Mining Co Ltd 金−錫合金メツキ浴及びメツキ方法
US6245208B1 (en) * 1999-04-13 2001-06-12 Governors Of The University Of Alberta Codepositing of gold-tin alloys
WO2005118917A1 (en) * 2004-06-01 2005-12-15 Technic, Inc. Electroplating solution for alloys of gold with tin

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Electrodeposition of Au-Sn Alloys for Lead-free Solders: Au-rich Eutectic and Sn-rich Eutectic Compositions;A.He et al.;《2013 IEEE International symposium》;20130228;第52-68页 *
Electrodeposition of Au-Sn Alloys from a Modified Non-Cyanide Bath;J. L. Cardoso, S. G. dos Santos Filho;《ECS Transactions》;20091231;第23卷(第1期);第85-92页 *
Electrodeposition of Sn and Au–Sn alloys from a single non-cyanide electrolyte;He, A. & Ivey et al.;《Journal of Materials Science: Materials in Electronics》;20120515;第23卷(第12期);第2186-2193页 *
He, A. & Ivey et al..Electrodeposition of Sn and Au–Sn alloys from a single non-cyanide electrolyte.《Journal of Materials Science: Materials in Electronics》.2012,第23卷(第12期), *

Also Published As

Publication number Publication date
US20150008131A1 (en) 2015-01-08
US10260159B2 (en) 2019-04-16
JP6448634B2 (ja) 2019-01-09
CN108360029B (zh) 2020-12-08
CN105378151A (zh) 2016-03-02
CN108360029A (zh) 2018-08-03
EP3017092A1 (en) 2016-05-11
WO2015002691A1 (en) 2015-01-08
JP2016524048A (ja) 2016-08-12

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Granted publication date: 20200828