CN105246855B - 氧化物烧结体和溅射靶、以及其制造方法 - Google Patents

氧化物烧结体和溅射靶、以及其制造方法 Download PDF

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Publication number
CN105246855B
CN105246855B CN201480030142.0A CN201480030142A CN105246855B CN 105246855 B CN105246855 B CN 105246855B CN 201480030142 A CN201480030142 A CN 201480030142A CN 105246855 B CN105246855 B CN 105246855B
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sintered body
oxide sintered
oxide
ingao
atomic
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CN105246855A (zh
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田尾幸树
广濑研太
慈幸范洋
越智元隆
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Kobe Steel Ltd
Kobelco Research Institute Inc
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Kobe Steel Ltd
Kobelco Research Institute Inc
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    • HELECTRICITY
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    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
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    • H01J37/3426Material
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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  • Chemical & Material Sciences (AREA)
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  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
CN201480030142.0A 2013-11-29 2014-11-28 氧化物烧结体和溅射靶、以及其制造方法 Active CN105246855B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-247763 2013-11-29
JP2013247763 2013-11-29
PCT/JP2014/081642 WO2015080271A1 (ja) 2013-11-29 2014-11-28 酸化物焼結体およびスパッタリングターゲット、並びにその製造方法

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CN105246855A CN105246855A (zh) 2016-01-13
CN105246855B true CN105246855B (zh) 2017-05-31

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US (1) US10515787B2 (enExample)
JP (1) JP5796812B2 (enExample)
KR (1) KR101622530B1 (enExample)
CN (1) CN105246855B (enExample)
TW (1) TWI515167B (enExample)
WO (1) WO2015080271A1 (enExample)

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JP2017019668A (ja) * 2015-07-07 2017-01-26 株式会社コベルコ科研 酸化物焼結体およびスパッタリングターゲット、並びにそれらの製造方法
JP6254308B2 (ja) 2016-04-19 2017-12-27 株式会社コベルコ科研 酸化物焼結体およびスパッタリングターゲット、並びにそれらの製造方法
JP6956748B2 (ja) * 2017-02-01 2021-11-02 出光興産株式会社 酸化物半導体膜、薄膜トランジスタ、酸化物焼結体及びスパッタリングターゲット
JP6364561B1 (ja) * 2017-05-18 2018-07-25 株式会社コベルコ科研 酸化物焼結体およびスパッタリングターゲット
JP6364562B1 (ja) * 2017-05-19 2018-07-25 株式会社コベルコ科研 酸化物焼結体およびスパッタリングターゲット
CN107623040A (zh) * 2017-09-05 2018-01-23 华南理工大学 一种铟镓锌氧化物薄膜晶体管及其制造方法
JP6724057B2 (ja) * 2018-03-30 2020-07-15 Jx金属株式会社 スパッタリングターゲット部材
JP6722736B2 (ja) * 2018-09-21 2020-07-15 Jx金属株式会社 焼結体および、スパッタリングターゲット
KR102492876B1 (ko) * 2018-12-28 2023-01-27 이데미쓰 고산 가부시키가이샤 소결체
JP7250723B2 (ja) * 2020-03-31 2023-04-03 Jx金属株式会社 スパッタリングターゲット及びスパッタリングターゲットの製造方法
US20250003056A1 (en) * 2021-11-22 2025-01-02 Corning Incorporated Amorphous transparent conductive oxide films and methods of fabricating the same
CN116813310B (zh) * 2023-06-01 2024-06-07 先导薄膜材料(广东)有限公司 一种稀土元素掺杂氧化铟锡镓靶材及其制备方法
KR102890447B1 (ko) * 2023-11-08 2025-11-25 엘티메탈 주식회사 저저항 및 저반사 산화물 박막, 및 상기 박막을 포함하는 디스플레이 장치

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JP3457969B2 (ja) 1992-05-11 2003-10-20 東ソー株式会社 高密度ito焼結体及びスパッタリングターゲット
US6042752A (en) * 1997-02-21 2000-03-28 Asahi Glass Company Ltd. Transparent conductive film, sputtering target and transparent conductive film-bonded substrate
JP3806521B2 (ja) * 1998-08-27 2006-08-09 旭硝子セラミックス株式会社 透明導電膜、スパッタリングターゲットおよび透明導電膜付き基体
US20040222089A1 (en) * 2001-09-27 2004-11-11 Kazuyoshi Inoue Sputtering target and transparent electroconductive film
JP5522889B2 (ja) * 2007-05-11 2014-06-18 出光興産株式会社 In−Ga−Zn−Sn系酸化物焼結体、及び物理成膜用ターゲット
US20120279856A1 (en) * 2009-10-15 2012-11-08 Medvedovski Eugene Tin Oxide Ceramic Sputtering Target and Method of Producing It
JP2011174134A (ja) 2010-02-24 2011-09-08 Idemitsu Kosan Co Ltd In−Ga−Sn系酸化物焼結体、ターゲット、酸化物半導体膜、及び半導体素子
JP6167039B2 (ja) * 2011-08-22 2017-07-19 出光興産株式会社 In−Ga−Sn系酸化物焼結体
JP5883367B2 (ja) * 2012-09-14 2016-03-15 株式会社コベルコ科研 酸化物焼結体およびスパッタリングターゲット、並びにその製造方法
JP5883368B2 (ja) * 2012-09-14 2016-03-15 株式会社コベルコ科研 酸化物焼結体およびスパッタリングターゲット

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WO2015080271A1 (ja) 2015-06-04
KR101622530B1 (ko) 2016-05-18
US10515787B2 (en) 2019-12-24
US20160111264A1 (en) 2016-04-21
KR20150136552A (ko) 2015-12-07
CN105246855A (zh) 2016-01-13
TW201538431A (zh) 2015-10-16
JP2015127293A (ja) 2015-07-09
TWI515167B (zh) 2016-01-01
JP5796812B2 (ja) 2015-10-21

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