CN105209671B - 钒掺杂SiC单晶及其方法 - Google Patents
钒掺杂SiC单晶及其方法 Download PDFInfo
- Publication number
- CN105209671B CN105209671B CN201380073671.4A CN201380073671A CN105209671B CN 105209671 B CN105209671 B CN 105209671B CN 201380073671 A CN201380073671 A CN 201380073671A CN 105209671 B CN105209671 B CN 105209671B
- Authority
- CN
- China
- Prior art keywords
- sic
- growth
- vanadium
- carrier gas
- gas
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361767318P | 2013-02-21 | 2013-02-21 | |
| US61/767,318 | 2013-02-21 | ||
| US14/064,604 US9322110B2 (en) | 2013-02-21 | 2013-10-28 | Vanadium doped SiC single crystals and method thereof |
| US14/064,604 | 2013-10-28 | ||
| PCT/US2013/069630 WO2014130108A1 (en) | 2013-02-21 | 2013-11-12 | Vanadium doped sic single crystals and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105209671A CN105209671A (zh) | 2015-12-30 |
| CN105209671B true CN105209671B (zh) | 2018-03-02 |
Family
ID=51351325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380073671.4A Active CN105209671B (zh) | 2013-02-21 | 2013-11-12 | 钒掺杂SiC单晶及其方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9322110B2 (enExample) |
| JP (1) | JP6272360B2 (enExample) |
| CN (1) | CN105209671B (enExample) |
| DE (1) | DE112013006709T5 (enExample) |
| WO (1) | WO2014130108A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105274624B (zh) * | 2015-10-09 | 2017-09-29 | 张家港市东大工业技术研究院 | 一种利用微波辐照制备钒掺杂半绝缘碳化硅的方法 |
| JP6675197B2 (ja) * | 2015-12-28 | 2020-04-01 | 昭和電工株式会社 | 炭化珪素単結晶の製造装置 |
| CN105568385A (zh) * | 2016-01-22 | 2016-05-11 | 山东大学 | 一种掺锗SiC体单晶材料的生长方法 |
| CN108149315B (zh) * | 2018-01-24 | 2020-10-23 | 中国科学院上海硅酸盐研究所 | 晶体生长用坩埚以及释放碳化硅晶体热应力的方法 |
| CN109402731B (zh) * | 2018-10-17 | 2021-01-15 | 福建北电新材料科技有限公司 | 一种高纯半绝缘碳化硅晶体生长装置及其方法 |
| JP7393900B2 (ja) * | 2019-09-24 | 2023-12-07 | 一般財団法人電力中央研究所 | 炭化珪素単結晶ウェハ及び炭化珪素単結晶インゴットの製造方法 |
| CN110699752B (zh) * | 2019-10-30 | 2022-03-22 | 安徽微芯长江半导体材料有限公司 | 分步生长弱磁性Fe-V共掺杂SiC晶体的方法 |
| JP7263537B2 (ja) * | 2019-10-31 | 2023-04-24 | 京セラ株式会社 | 配線基板、電子装置及び電子モジュール |
| CN110904501B (zh) * | 2019-11-13 | 2022-03-29 | 安徽微芯长江半导体材料有限公司 | 晶体生长用籽晶下置式装置 |
| CN111172592B (zh) * | 2019-12-24 | 2021-03-26 | 山东天岳先进科技股份有限公司 | 一种掺杂碳化硅单晶、衬底及制备方法和使用的装置 |
| CN113249795A (zh) * | 2020-02-11 | 2021-08-13 | 稳晟材料科技股份有限公司 | 碳化硅长晶设备及其长晶方法 |
| CN111232980A (zh) * | 2020-03-23 | 2020-06-05 | 攀钢集团攀枝花钢铁研究院有限公司 | 碳化钒粉末的制备方法 |
| JP2021191892A (ja) | 2020-05-11 | 2021-12-16 | エーエスエム・アイピー・ホールディング・ベー・フェー | バナジウム化合物の送達のための方法およびシステム |
| CN111534854B (zh) * | 2020-06-12 | 2021-07-13 | 北京北方华创微电子装备有限公司 | 晶体生长炉 |
| US20220025549A1 (en) | 2020-07-27 | 2022-01-27 | Globalwafers Co., Ltd. | Silicon carbide wafer and method of fabricating the same |
| US20220049373A1 (en) * | 2020-08-11 | 2022-02-17 | II-VI Delaware, Inc | Sic single crystal(s) doped from gas phase |
| CN112144110B (zh) * | 2020-09-23 | 2021-07-23 | 中电化合物半导体有限公司 | Pvt法生长碳化硅晶体的生长方法 |
| CN112853491A (zh) * | 2020-12-31 | 2021-05-28 | 山西烁科晶体有限公司 | 一种掺杂碳化硅单晶及其制备方法 |
| CN113279065B (zh) * | 2021-04-01 | 2022-01-11 | 浙江大学杭州国际科创中心 | 一种IVB族原子和铝共掺制备p型4H-SiC的方法 |
| DE102021123991B4 (de) | 2021-09-16 | 2024-05-29 | Pva Tepla Ag | PVT-Verfahren und Apparatur zum prozesssicheren Herstellen von Einkristallen |
| CN114108096B (zh) * | 2021-11-30 | 2023-06-02 | 江苏集芯半导体硅材料研究院有限公司 | 碳化硅晶体生长装置 |
| CN114108094B (zh) * | 2021-11-30 | 2023-06-27 | 江苏集芯半导体硅材料研究院有限公司 | 碳化硅晶体生长装置 |
| CN114059156B (zh) * | 2021-11-30 | 2023-03-28 | 江苏集芯半导体硅材料研究院有限公司 | 碳化硅晶体生长装置 |
| US20250146171A1 (en) * | 2022-02-17 | 2025-05-08 | Sumitomo Electric Industries, Ltd. | Silicon carbide substrate, method of manufacturing silicon carbide substrate, and manufacturing apparatus for silicon carbide substrate |
| DE102022123757B4 (de) * | 2022-09-16 | 2024-05-29 | Pva Tepla Ag | Apparatur, Tragrahmen für eine Apparatur und PVT-Verfahren zum prozesssicheren Herstellen von Einkristallen |
| DE102022123747A1 (de) * | 2022-09-16 | 2024-03-21 | Pva Tepla Ag | PVT-Verfahren und Apparatur zum prozesssicheren Herstellen von Einkristallen |
| JP2025531120A (ja) * | 2022-09-16 | 2025-09-19 | ピー・ヴィ・エー テプラ アー・ゲー | 単結晶のプロセス安全生産のためのpvt方法および装置 |
| WO2024095640A1 (ja) * | 2022-10-31 | 2024-05-10 | 住友電気工業株式会社 | 炭化珪素基板、エピタキシャル基板、半導体装置の製造方法および炭化珪素基板の製造方法 |
| CN117187960A (zh) * | 2023-09-21 | 2023-12-08 | 浙江晶越半导体有限公司 | 提高大尺寸晶体掺杂效率的坩埚及碳化硅晶体掺杂方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5611955A (en) * | 1993-10-18 | 1997-03-18 | Northrop Grumman Corp. | High resistivity silicon carbide substrates for high power microwave devices |
| JP2010150133A (ja) * | 2008-12-24 | 2010-07-08 | Sicrystal Ag | 均一ドーピングされたSiCバルク単結晶の製造方法および均一ドーピングされたSiC基板 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE9502288D0 (sv) | 1995-06-26 | 1995-06-26 | Abb Research Ltd | A device and a method for epitaxially growing objects by CVD |
| US5683507A (en) | 1995-09-05 | 1997-11-04 | Northrop Grumman Corporation | Apparatus for growing large silicon carbide single crystals |
| SE9503428D0 (sv) | 1995-10-04 | 1995-10-04 | Abb Research Ltd | A method for epitaxially growing objects and a device for such a growth |
| US5746827A (en) | 1995-12-27 | 1998-05-05 | Northrop Grumman Corporation | Method of producing large diameter silicon carbide crystals |
| US5667587A (en) | 1996-12-18 | 1997-09-16 | Northrop Gruman Corporation | Apparatus for growing silicon carbide crystals |
| US5985024A (en) | 1997-12-11 | 1999-11-16 | Northrop Grumman Corporation | Method and apparatus for growing high purity single crystal silicon carbide |
| US6056820A (en) | 1998-07-10 | 2000-05-02 | Northrop Grumman Corporation | Advanced physical vapor transport method and apparatus for growing high purity single crystal silicon carbide |
| US6410433B1 (en) | 1999-04-27 | 2002-06-25 | Tokyo Electron Limited | Thermal CVD of TaN films from tantalum halide precursors |
| US6329088B1 (en) | 1999-06-24 | 2001-12-11 | Advanced Technology Materials, Inc. | Silicon carbide epitaxial layers grown on substrates offcut towards <1{overscore (1)}00> |
| EP1268883A1 (en) | 2000-03-13 | 2003-01-02 | II-VI Incorporated | Large size single crystal seed crystal fabrication by intergrowth of tiled seed crystals |
| US20050255245A1 (en) | 2004-01-13 | 2005-11-17 | Fanton Mark A | Method and apparatus for the chemical vapor deposition of materials |
| JP4987707B2 (ja) | 2004-07-07 | 2012-07-25 | トゥー‐シックス・インコーポレイテッド | 低ドーピング半絶縁性SiC結晶と方法 |
| JP2006193348A (ja) * | 2005-01-11 | 2006-07-27 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体基板およびその製造方法 |
| US7608524B2 (en) | 2005-04-19 | 2009-10-27 | Ii-Vi Incorporated | Method of and system for forming SiC crystals having spatially uniform doping impurities |
| US8361227B2 (en) | 2006-09-26 | 2013-01-29 | Ii-Vi Incorporated | Silicon carbide single crystals with low boron content |
| US7767022B1 (en) * | 2006-04-19 | 2010-08-03 | Ii-Vi Incorporated | Method of annealing a sublimation grown crystal |
| DE102008063129B4 (de) | 2008-12-24 | 2013-05-16 | Sicrystal Ag | Herstellungsverfahren für einen codotierten SiC-Volumeneinkristall und hochohmiges SiC-Substrat |
| JP5779171B2 (ja) | 2009-03-26 | 2015-09-16 | トゥー‐シックス・インコーポレイテッド | SiC単結晶の昇華成長方法及び装置 |
| DE102010029756B4 (de) * | 2010-06-07 | 2023-09-21 | Sicrystal Gmbh | Herstellungsverfahren für einen SiC-Volumeneinkristall mit großer Facette und einkristallines SiC-Substrat mit homogener Widerstandsverteilung |
-
2013
- 2013-10-28 US US14/064,604 patent/US9322110B2/en active Active
- 2013-11-12 WO PCT/US2013/069630 patent/WO2014130108A1/en not_active Ceased
- 2013-11-12 DE DE112013006709.9T patent/DE112013006709T5/de active Pending
- 2013-11-12 CN CN201380073671.4A patent/CN105209671B/zh active Active
- 2013-11-12 JP JP2015559228A patent/JP6272360B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5611955A (en) * | 1993-10-18 | 1997-03-18 | Northrop Grumman Corp. | High resistivity silicon carbide substrates for high power microwave devices |
| JP2010150133A (ja) * | 2008-12-24 | 2010-07-08 | Sicrystal Ag | 均一ドーピングされたSiCバルク単結晶の製造方法および均一ドーピングされたSiC基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016507467A (ja) | 2016-03-10 |
| CN105209671A (zh) | 2015-12-30 |
| US20140234194A1 (en) | 2014-08-21 |
| US9322110B2 (en) | 2016-04-26 |
| WO2014130108A1 (en) | 2014-08-28 |
| DE112013006709T5 (de) | 2015-11-26 |
| JP6272360B2 (ja) | 2018-01-31 |
| WO2014130108A9 (en) | 2015-04-16 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |