CN105206626A - 阵列基板及其制备方法、显示装置 - Google Patents
阵列基板及其制备方法、显示装置 Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 title abstract description 12
- 239000010409 thin film Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 24
- 230000004888 barrier function Effects 0.000 claims description 21
- 230000005611 electricity Effects 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims description 6
- 238000009832 plasma treatment Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 3
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 239000012212 insulator Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- -1 phosphonium ion Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
本发明公开了一种阵列基板及其制备方法、显示装置,属于显示技术领域,可保证源极与像素电极之间的有效电连接。该阵列基板包括多个阵列排布的像素单元,每个像素单元设置有一个薄膜晶体管,所述薄膜晶体管包括位于同层的源极和漏极、连接并部分覆盖源极和漏极的有源层,所述阵列基板还包括覆盖所述有源层的有机平坦层,其中,所述有机平坦层形成有第一过孔,所述有源层对应所述第一过孔的区域导电,使得位于所述有机平坦层之上的像素电极可通过所述第一过孔电连接所述源极。本发明可用于液晶电视、液晶显示器、手机、平板电脑等显示装置。
Description
技术领域
本发明涉及显示技术领域,具体地说,涉及一种阵列基板及其制备方法、显示装置。
背景技术
在薄膜晶体管主动式矩阵液晶显示器(ThinFilmTransistor-ActiveMatrixLiquidCrystalDisplay,简称TFT-AMLCD)或者薄膜晶体管主动矩阵有机发光二极体显示器(TFT-ActiveMatrixOrganicLightEmittingDiode,简称TFT-AMOLED)中,通过TFT的源极5与像素电极6导通,数据信号得以传输至像素电极6,使得显示器可以正常显示图像。
如图1所示,在TFT-AMLCD中,每一像素单元由下至上依次包括:栅极1、栅极绝缘层2、对应栅极1的有源层3、位于同一层且由有源层3连接的源极5和漏极4、电连接源极5的像素电极6。漏极4接入数据信号之后,有源层3在栅极1的驱动下导通源极5和漏极4,使得漏极4接入的数据信号通过源极5传输至像素电极6。因此,源极5与像素电极6的良好接触十分重要。另外,栅极1和衬底基板7之间还可设置有缓冲层8。
如图1所示,在阵列基板制程中,许多产品加入有机平坦层9(PolymerFilmonArray,简称PFA)。具体的,源极5和漏极4之上覆盖有第一绝缘层10,PFA是在形成第一绝缘层10之后形成的,PFA的存在便于阵列基板后续工艺的进行。
在阵列基板的制备过程中,在形成PFA之后,在PFA之上形成公共电极11,在公共电极11之上形成第二绝缘层12,最后形成像素电极6。
为了使得位于最上层的像素电极6可以电连接源极5,需要开设由上至下依次贯穿第二绝缘层12、PFA和第一绝缘层10的过孔13,使得源极5部分暴露在外、与像素电极6电连接。
由于PFA能够和源极5的金属材料发生反应,形成不导电物。而现有技术中,过孔13是逐层刻蚀的,即在形成第一绝缘层10之后,对第一绝缘层10进行刻蚀工艺,形成过孔13之后再形成PFA。则此时PFA可接触到被过孔13暴露在外的部分源极5,使得这部分源极5之上形成不导电物,影响源极5与像素电极6的电连接,降低显示器的良品率。
发明内容
本发明的目的在于提供一种阵列基板及其制备方法、显示装置,可保证源极与像素电极之间的有效电连接。
本发明第一方面提供了一种阵列基板,该阵列基板包括多个阵列排布的像素单元,每个像素单元设置有一个薄膜晶体管,所述薄膜晶体管包括位于同层的源极和漏极、连接并部分覆盖源极和漏极的有源层,所述阵列基板还包括覆盖所述有源层的有机平坦层,
其中,所述有机平坦层形成有第一过孔,所述有源层对应所述第一过孔的区域导电,使得位于所述有机平坦层之上的像素电极可通过所述第一过孔电连接所述源极。
可选的,所述有源层对应所述第一过孔的区域为n型重掺杂区域。
可选的,所述有源层的材质为氧化物半导体。
可选的,通过等离子处理,使得所述有源层对应所述第一过孔的区域为n型重掺杂区域。
可选的,所述等离子为氢离子。
可选的,所述有源层和所述有机平坦层之间形成有绝缘层,所述绝缘层形成有第二过孔,所述第一过孔嵌套在所述第二过孔内。
本发明带来了以下有益效果:本发明实施例提供了一种阵列基板,该阵列基板包括多个阵列排布的像素单元,像素单元中的有源层部分覆盖源极和漏极,防止有机平坦层接触到源极。同时,有机平坦层形成有第一过孔,有源层对应该第一过孔的区域导电,保证了像素电极与源极的电连接,有利于提高阵列基板的良品率。
本发明第二方面提供了一种显示装置,该显示装置包括上述的阵列基板。
本发明第三方面提供了一种阵列基板的制备方法,该制备方法包括:
通过同一次构图工艺,形成同层设置的漏极和源极;
在所述漏极和所述源极之上,形成部分覆盖所述漏极和所述源极的有源层;
形成有机平坦层,所述有机平坦层开设第一过孔,所述第一过孔将所述有源层部分暴露;
处理所述第一过孔对应的有源层,使得该部分有源层可导电;
形成像素电极,所述像素电极可通过所述第一过孔对应的有源层电连接所述源极。
可选的,处理所述第一过孔对应的有源层,使得该部分有源层导电包括:
通过等离子处理,使得所述有源层对应所述第一过孔的区域为n型重掺杂区域,以使得该部分有源层导电。
可选的,所述等离子为氢离子。
本发明的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要的附图做简单的介绍:
图1是现有技术中的阵列基板的结构示意图;
图2是本发明实施例提供的阵列基板的结构示意图;
图3是本发明实施例提供的阵列基板的制备方法的流程示意图;
图4至图7是图2所示的阵列基板的制备过程示意图。
具体实施方式
以下将结合附图及实施例来详细说明本发明的实施方式,借此对本发明如何应用技术手段来解决技术问题,并达成技术效果的实现过程能充分理解并据以实施。需要说明的是,只要不构成冲突,本发明中的各个实施例以及各实施例中的各个特征可以相互结合,所形成的技术方案均在本发明的保护范围之内。
本发明实施例提供了一种阵列基板,该阵列基板包括多个阵列排布的像素单元,每个像素单元设置有一个薄膜晶体管。
如图2所示,薄膜晶体管由下至上依次包括栅极1、栅极绝缘层2、位于同层的漏极4和源极5、连接并部分覆盖漏极4和源极5的有源层3。显然,该薄膜晶体管为底栅型薄膜晶体管。
进一步的,在薄膜晶体管之上,阵列基板还包括覆盖有源层3的绝缘层14、位于绝缘层14之上的有机平坦层9,以及位于有机平坦层9之上的像素电极6。其中,有机平坦层9形成有第一过孔15,绝缘层14形成有第二过孔16,第一过孔15嵌套在第二过孔16内。有源层3对应第一过孔15的区域导电,使得位于有机平坦层9之上的像素电极6可通过第一过孔15电连接源极5。
具体的,可通过等离子处理,利用氢离子、磷离子等带正电的离子轰击有源层3对应第一过孔15的区域,使得该区域为n型重掺杂区域17,提升该区域的导电能力,从而使得像素电极6通过第一过孔15接触到有源层3,即可实现像素电极6与位于有源层3之下的源极5电连接的目的。
并且,有源层3隔绝开有机平坦层9与源极5,防止有机平坦层9与源极5接触产生不导电物,而有源层3的材质决定了其无法与有机平坦层9发生反应。因此,像素电极6可以实现与源极5的有效电连接,保证了显示器的良品率。
具体的,本发明实施例中,有源层3可采用非晶硅、低温多晶硅等材质制备。但为了提高有源层3的掺杂效率,可选用氧化物半导体来制备有源层3。其中,有源层3可优选由铟镓锌氧化物(IndiumGalliumZincOxide,简称IGZO)制得。
IGZO是一种含有铟、镓和锌的非晶氧化物,载流子迁移率是非晶硅的20~30倍,可以大大提高TFT对像素电极6的充放电速率,提高像素的响应速度,实现更快的刷新率,同时更快的响应也大大提高了像素的行扫描速率,使得超高分辨率在显示器中成为可能。
为了制备上述阵列基板,本发明实施例还提供了上述阵列基板的制备方法,如图3所示,该制备方法包括:
步骤S101、通过同一次构图工艺,形成同层设置的漏极和源极。
步骤S102、在漏极和源极之上,形成部分覆盖漏极和源极的有源层。
步骤S103、形成有机平坦层,有机平坦层开设第一过孔,第一过孔将有源层部分暴露。
步骤S104、处理第一过孔对应的有源层,使得该部分有源层可导电。
步骤S105、形成像素电极,所述像素电极可通过第一过孔对应的有源层电连接源极。
本发明实施例提供的阵列基板可具体通过以下制备流程制得:
在衬底18上通过物理气相沉积(PhysicalVaporDeposition,简称PVD)形成用于制备栅极1、栅线等结构的第一金属层,之后利用对应的掩膜版进行曝光,经过显影、湿刻、剥离等工艺,形成栅极1。
其中,该衬底18可以是衬底基板,也可是位于衬底基板之上的缓冲层。该缓冲层能对栅极1与衬底基板起到理想的隔离缓冲作用,且能增强栅极1与衬底的附着程度。
之后,在栅极1之上,通过涂覆等工艺,形成用于对栅极1与漏极4、源极5绝缘的栅极绝缘层2。栅极绝缘层2可采用氮化硅(SixNy)、氧化硅(SixOy)等绝缘料制成。栅极绝缘层2形成之后,再次经过PVD工艺,在栅极绝缘层2之上形成第二金属层,该第二金属层用于形成同层设置的漏极4、源极5以及数据线等结构。对第二金属层利用对应的掩膜版进行曝光,经过显影、湿刻、剥离等工艺,可以制备得到漏极4、源极5以及数据线等结构。
在制得漏极4和源极5之后,接下来进行有源层3的制备,得到如图4所示的阵列基板。在漏极4和源极5之上,经过PVD,形成IGZO层,之后利用对应的掩膜版进行曝光,经过显影、湿刻、剥离等工艺得到有源层3的图形。其中,有源层3的厚度为40至100纳米,且与漏极4和源极5的接触面积很大,覆盖绝大部分的漏极4和源极5。如此结构,不仅可以保证有源层3与漏极4、源极5之间的有效接触,还可保护源极5,防止有机平坦层9与源极5接触。
之后,在有源层3之上经过等离子体增强化学气相沉积法(PlasmaEnhancedChemicalVaporDeposition,简称PECVD)形成绝缘层14,该绝缘层14同样可以利用氮化硅、氧化硅等常见的绝缘材料制成。由于绝缘层14是绝缘的,无法导电,为了使得像素电极6能够与源极5导电,需要对绝缘层14利用对应的掩膜版,进行曝光、显影、干刻等工艺,形成第二过孔16,如图5所示。
由于本实施例中的有源层3覆盖了大部分的源极5,因此,该第二过孔16无法将源极5暴露在外,而是将覆盖源极5的有源层3暴露在外。
形成第二过孔16之后,在绝缘层14之上经过涂覆等工艺,形成有机平坦层9。本实施例中,在绝缘层14之上形成有机平坦层9的目的是为了提高显示器的开口率。由于有机平坦层9的存在,像素电极6可以延伸覆盖在部分数据线的上方,从而提高显示器的开口率。这是因为有机平坦层9的厚度足够厚,可以避免像素电极6与数据线之间的寄生电容过大,影响显示器的显示效果。
虽然绝缘层14开设有第二过孔16,但由于第二过孔16是将覆盖源极5的有源层3暴露在外,因此有机平坦层9无法通过第二过孔16接触到源极5,与源极5发生反应形成不导电物。并且,有机平坦层9与由IGZO制成的有源层3无法发生反应,因此有源层3的特性不会受到有机平坦层9的影响。
由于有机平坦层9不导电,而像素电极6是设置在有机平坦层9之上的。因此为了使得像素电极6可以与源极5电连接,有机平坦层9需要开设第一过孔15,该第一过孔15嵌套于第二过孔16内,同样仅将有源层3的部分区域暴露在外,如图6所示。
显然,如果不将有源层3进行一定的处理,由于有源层3未利用导体材质制得,直接接触有源层3的像素电极6还是无法与源极5进行有效的电连接。因此,本发明实施例中,基于有机平坦层9开设的第一过孔15,对该部分被暴露在外的部分有源层3进行氢离子轰击处理,使得这部分区域变为n型重掺杂区域17,如图7所示,以提高这部分有源层3的导电性。从而,像素电极6通过第一过孔15接触到有源层3之后,即可通过导电的n型重掺杂区域17实现与源极5的良好电连接。
最后,在有机平坦层9上,再次经过PVD工艺,形成用于制备像素电极6的氧化铟锡(IndiumTinOxides,简称ITO)层。之后利用对应的掩膜版进行曝光,经过显影、湿刻、剥离等工艺得到像素电极6的图形,制备得如图2所示的阵列基板。
综上,本发明实施例提供了一种阵列基板,该阵列基板包括多个阵列排布的像素单元,像素单元中的有源层部分覆盖源极和漏极,防止有机平坦层接触到源极。同时,有机平坦层形成有第一过孔,有源层对应该第一过孔的区域导电,保证了像素电极与源极的电连接,有利于提高阵列基板的良品率。
本发明实施例进一步还提供了一种显示装置,该显示装置包括上述的阵列基板。该显示装置可为电视、显示器、手机、平板电脑等装置。
虽然本发明所公开的实施方式如上,但所述的内容只是为了便于理解本发明而采用的实施方式,并非用以限定本发明。任何本发明所属技术领域内的技术人员,在不脱离本发明所公开的精神和范围的前提下,可以在实施的形式上及细节上作任何的修改与变化,但本发明的专利保护范围,仍须以所附的权利要求书所界定的范围为准。
Claims (10)
1.一种阵列基板,其特征在于,包括多个阵列排布的像素单元,每个像素单元设置有一个薄膜晶体管,所述薄膜晶体管包括位于同层的源极和漏极、连接并部分覆盖源极和漏极的有源层,所述阵列基板还包括覆盖所述有源层的有机平坦层,
其中,所述有机平坦层形成有第一过孔,所述有源层对应所述第一过孔的区域导电,使得位于所述有机平坦层之上的像素电极可通过所述第一过孔电连接所述源极。
2.根据权利要求1所述的阵列基板,其特征在于,所述有源层对应所述第一过孔的区域为n型重掺杂区域。
3.根据权利要求2所述的阵列基板,其特征在于,所述有源层的材质为氧化物半导体。
4.根据权利要求3所述的阵列基板,其特征在于,通过等离子处理,使得所述有源层对应所述第一过孔的区域为n型重掺杂区域。
5.根据权利要求4所述的阵列基板,其特征在于,所述等离子为氢离子。
6.根据权利要求1所述的阵列基板,其特征在于,所述有源层和所述有机平坦层之间形成有绝缘层,所述绝缘层形成有第二过孔,所述第一过孔嵌套在所述第二过孔内。
7.一种显示装置,其特征在于,包括如权利要求1至6所述的阵列基板。
8.一种阵列基板的制备方法,其特征在于,包括:
通过同一次构图工艺,形成同层设置的漏极和源极;
在所述漏极和所述源极之上,形成部分覆盖所述漏极和所述源极的有源层;
形成有机平坦层,所述有机平坦层开设第一过孔,所述第一过孔将所述有源层部分暴露;
处理所述第一过孔对应的有源层,使得该部分有源层导电;
形成像素电极,所述像素电极可通过所述第一过孔对应的有源层电连接所述源极。
9.根据权利要求8所述的制备方法,其特征在于,处理所述第一过孔对应的有源层,使得该部分有源层导电包括:
通过等离子处理,使得所述有源层对应所述第一过孔的区域为n型重掺杂区域,以使得该部分有源层可导电。
10.根据权利要求9所述的制备方法,其特征在于,所述等离子为氢离子。
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Cited By (7)
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CN109449210A (zh) * | 2018-09-19 | 2019-03-08 | 云谷(固安)科技有限公司 | 驱动薄膜晶体管及制备方法、阵列基板及显示器件 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106206612A (zh) * | 2016-08-19 | 2016-12-07 | 京东方科技集团股份有限公司 | 阵列基板的制作方法及显示面板、显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102655095A (zh) * | 2011-06-01 | 2012-09-05 | 京东方科技集团股份有限公司 | 薄膜晶体管及阵列基板的制造方法 |
CN103219391A (zh) * | 2013-04-07 | 2013-07-24 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制作方法、阵列基板和显示装置 |
CN103337522A (zh) * | 2013-06-17 | 2013-10-02 | 南京中电熊猫液晶显示科技有限公司 | 一种金属氧化物薄膜晶体管阵列基板及其制造方法 |
CN104362125A (zh) * | 2014-09-25 | 2015-02-18 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100900404B1 (ko) * | 2003-12-22 | 2009-06-02 | 엘지디스플레이 주식회사 | 액정표시소자의 제조 방법 |
KR101480004B1 (ko) * | 2008-02-21 | 2015-01-08 | 삼성디스플레이 주식회사 | 표시판 및 그 제조 방법 |
US8441007B2 (en) * | 2008-12-25 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
WO2010135539A1 (en) * | 2009-05-20 | 2010-11-25 | The Trustees Of The University Of Pennsylvania | Self-adaptive bio-signal and modulation device |
JP2011221098A (ja) * | 2010-04-05 | 2011-11-04 | Seiko Epson Corp | 電気光学装置用基板、電気光学装置、及び電子機器 |
JP2011248072A (ja) * | 2010-05-26 | 2011-12-08 | Hitachi Displays Ltd | 画像表示装置の製造方法 |
TWI438868B (zh) * | 2010-07-30 | 2014-05-21 | Au Optronics Corp | 互補金氧半電晶體及其製作方法 |
TW201622158A (zh) * | 2014-12-10 | 2016-06-16 | 中華映管股份有限公司 | 薄膜電晶體以及其製作方法 |
KR102322015B1 (ko) * | 2015-04-07 | 2021-11-05 | 삼성디스플레이 주식회사 | 박막트랜지스터 어레이 기판의 제조 방법 및 그에 따라 제조된 박막 트랜지스터 어레이 기판 |
-
2015
- 2015-11-09 CN CN201510755212.5A patent/CN105206626B/zh active Active
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- 2015-12-14 WO PCT/CN2015/097242 patent/WO2017080013A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102655095A (zh) * | 2011-06-01 | 2012-09-05 | 京东方科技集团股份有限公司 | 薄膜晶体管及阵列基板的制造方法 |
CN103219391A (zh) * | 2013-04-07 | 2013-07-24 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制作方法、阵列基板和显示装置 |
CN103337522A (zh) * | 2013-06-17 | 2013-10-02 | 南京中电熊猫液晶显示科技有限公司 | 一种金属氧化物薄膜晶体管阵列基板及其制造方法 |
CN104362125A (zh) * | 2014-09-25 | 2015-02-18 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105487316A (zh) * | 2016-01-19 | 2016-04-13 | 深圳市华星光电技术有限公司 | 液晶显示面板及液晶显示装置 |
CN106356607A (zh) * | 2016-08-26 | 2017-01-25 | 周峰 | 复合结构的射频器件的制造方法及其复合结构射频材料 |
CN107479286A (zh) * | 2017-09-04 | 2017-12-15 | 深圳市华星光电技术有限公司 | 一种改善灰阶斜纹的过孔结构 |
CN108933179A (zh) * | 2018-07-05 | 2018-12-04 | 深圳市华星光电半导体显示技术有限公司 | 一种薄膜晶体管及其制作方法 |
CN108933179B (zh) * | 2018-07-05 | 2020-06-16 | 深圳市华星光电半导体显示技术有限公司 | 一种薄膜晶体管及其制作方法 |
US11316049B2 (en) | 2018-07-05 | 2022-04-26 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Thin-film transistor and manufacturing method thereof |
CN109449210A (zh) * | 2018-09-19 | 2019-03-08 | 云谷(固安)科技有限公司 | 驱动薄膜晶体管及制备方法、阵列基板及显示器件 |
CN110085603A (zh) * | 2019-04-30 | 2019-08-02 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及制作方法 |
CN113097272A (zh) * | 2021-03-29 | 2021-07-09 | 鄂尔多斯市源盛光电有限责任公司 | 显示背板及其制作方法、显示装置 |
CN113097272B (zh) * | 2021-03-29 | 2023-09-22 | 鄂尔多斯市源盛光电有限责任公司 | 显示背板及其制作方法、显示装置 |
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US20180190812A1 (en) | 2018-07-05 |
WO2017080013A1 (zh) | 2017-05-18 |
CN105206626B (zh) | 2018-11-20 |
US10644159B2 (en) | 2020-05-05 |
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