CN105118912B - A kind of heat dissipation uniformly exempts from packaged LED structure and LED light - Google Patents
A kind of heat dissipation uniformly exempts from packaged LED structure and LED light Download PDFInfo
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- CN105118912B CN105118912B CN201510584263.6A CN201510584263A CN105118912B CN 105118912 B CN105118912 B CN 105118912B CN 201510584263 A CN201510584263 A CN 201510584263A CN 105118912 B CN105118912 B CN 105118912B
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- polyhedral
- hexahedron
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention discloses a kind of heat dissipations uniformly to exempt from packaged LED structure and LED light, the LED structure include substrate, upside-down mounting in the substrate chip and holder in substrate periphery is set, wherein, it is provided on the substrate for two layers or more the polyhedral structures to the chip cooling.The polyhedral structure that the present invention passes through the setting table scalariform that interlocks on substrate so that the heat that LED chip generates can evenly and rapidly conduct, and avoid the hot stack of chip, reduce the temperature of chip, prevent chip from burning, to ensure that the reliability of LED product.
Description
Technical field
The present invention relates to technical field of LED illumination more particularly to it is a kind of heat dissipation uniformly exempt from packaged LED structure and
LED light.
Background technology
Currently, with the promotion of LED power and luminous efficiency, energy conservation and environmental protection, the features such as response is fast, small, light efficiency is high
LED product be widely used in showing the backlight of product and the fields such as general illumination, and it is empty to occupy increasing market
Between, it is considered to be the best light source of new generation green energy conservation illumination.
But at present since the electricity conversion of LED is not still high, for great power LED device, only
The electric energy of 15%-20% is converted into luminous energy, remaining 80%-85% is converted to thermal energy.It exports and disappears if chip cannot generate heat in time
It dissipates, amount of heat will accumulate in inside LED, and junction temperature of chip will be stepped up, and on the one hand make LED reduced performances（Such as operating voltage
Reduce, luminous efficiency reduction, red shift of wavelength etc.）, thermal stress on the other hand will be generated in LED package, initiation is a series of can
By sex chromosome mosaicism（Such as service life, color temperature change）.
So as LED power is higher and higher, the shortcomings that heat dissipation problem and packaging method of LED, also becomes increasingly conspicuous, such as
To solve heat dissipation problem, occur exempting from packaged type LED using the CSP of flip-chip at present, as shown in Figure 1, flip-chip 1B
Routing is not needed, the circuit of the electrode 1D and substrate 1A of tin sweat(ing) 1C connection chips are directly passed through.So the heat meeting that chip sheds
It is directly transmitted on substrate (shown in the arrow in Fig. 1) by the tin sweat(ing) of lower section, then is spread out of by substrate.
But since the power of this LED is all larger, the heat of chip bottom is higher, so if there are impurity in scolding tin
Or substrate heat conductivility is uneven, will easy to produce hot stack, hot stack meeting in the part of tin sweat(ing) connection electrode and substrate
Cause the heat of tin sweat(ing) part that can not shed, is more than its rated value so as to cause the temperature of LED chip, to burn chip.
Therefore, the existing technology needs to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, a kind of heat dissipation of present invention offer uniformly exempts from packaged LED structure, it is intended to solve
Existing packaged LED structure of exempting from easy tos produce hot stack in the part of tin sweat(ing) connection electrode and substrate, leads to the heat of tin sweat(ing) part
Amount can not uniformly, quickly shed, and easily lead to the problem of chip is burnt.
Technical scheme is as follows：
A kind of heat dissipation uniformly exempts from packaged LED structure, including substrate, upside-down mounting in the substrate chip and be arranged in base
The holder of plate periphery, wherein be provided on the substrate for two layers or more the staggered multi-panels to the chip cooling
Body structure.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein
The section of described two layers or more staggered polyhedral structures becomes longer spread successively from top to bottom.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein
In the staggered adjacent two layers polyhedral structure, the angular position lower surface of the last layer polyhedral structure
It is set to next layer polyhedral edge position upper surface.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein the chip is set to top layer's polyhedral structure
In the cavity of top surface.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein the substrate is disposed with the first multi-panel from top to bottom
Body structure, the second polyhedral structure and third polyhedral structure；
The angular position lower surface of first polyhedral structure is contacted with the edge position upper surface of the second polyhedral structure, described
The angular position lower surface of second polyhedral structure is contacted with the edge position upper surface of third polyhedral structure.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein the substrate is molded into one with the holder outside the substrate
Body structure.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein the into a single integrated structure cradle bottom surface of the injection molding exposes institute
State the bottom surface of lowest level polyhedral structure.
Packaged LED structure is uniformly exempted from the heat dissipation, wherein the polyhedral structure is hexahedron structure or octahedron
Structure.
A kind of LED light, wherein the LED light includes that any one of them heat dissipation uniformly exempts from packaged LED structure.
A kind of heat dissipation provided by the invention uniformly exempts from packaged LED structure, by intersecting setting table scalariform on substrate
Polyhedral structure so that the heat that LED chip generates can evenly and rapidly conduct, and avoid the hot stack of chip, reduce chip
Temperature, prevent chip from burning, to ensure that the reliability of LED product.
Description of the drawings
Fig. 1 is existing to exempt from packaged LED structure schematic diagram.
Fig. 2 is the schematic diagram that packaged LED structure (being free of holder) is uniformly exempted from present invention heat dissipation.
Fig. 3 is the schematic diagram that packaged LED structure is uniformly exempted from present invention heat dissipation.
Fig. 4 is the heat conduction schematic diagram that packaged LED structure is uniformly exempted from present invention heat dissipation.
Fig. 5 is that present invention heat dissipation uniformly exempts from packaged LED structure bottom schematic view.
Specific implementation mode
Below with reference to attached drawing, the specific implementation mode and embodiment of the present invention are described in detail, described tool
Body embodiment only to explain the present invention, is not intended to limit the specific implementation mode of the present invention.
As shown in Figures 2 and 3, heat dissipation provided by the invention uniformly exempts from packaged LED structure, including substrate 1, upside-down mounting in institute
It states the chip 2 of substrate 1 and the holder 3 in 1 periphery of substrate is set, wherein be provided on the substrate 1 for the chip
Two layers or more staggered polyhedral structures 10 of 2 heat dissipations.Polyhedral structure in the embodiment of the present invention can be hexahedron
Structure, it will be understood that in other embodiments of the invention, polyhedral structure can be pentahedron, and the corner angle such as octahedron are more
Structure.
The present invention is described in further details so that the polyhedral structure is hexahedron structure as an example below.
Since heat tends to the heat-conduction principle assembled in solid seamed edge edge junction in solid, in the embodiment of the present invention with
Staggered ladder-like two layers or more hexahedron solid structures, every layer of hexahedral corner bit architecture can make caused by chip
Angular position structure conduction of the heat into next layer of hexahedron structure forms the flowing of dynamic heat, takes away chip generation in time
Heat prevents burning for chip.
LED flip chip in the embodiment of the present invention is mounted on the printing of the inner cavity of substrate by way of tin sweat(ing) connection
On circuit board, substrate surface carries out the works such as the deposition, including insulating layer coating, copper facing, etched circuit, surface treatment of circuit layer
Skill, the substrate intracavity bottom finally made is exposed positive and negative electrode, then is welded using conventional backflow with LED flip chip or eutectic
Etc. equipment be welded and fixed, accordingly even when tin sweat(ing) has impurity in welding process, the heat that structure of the invention can also generate impurity
Quickly, it uniformly conducts.
In the present invention is implemented, the section of staggered multilayer hexahedron structure becomes longer spread successively from top to bottom, this
The heat transfer area of sample heat successively becomes larger, and the heat transferred out is bigger.Described two layers or more multi-panels are used in this preferred embodiment
Body solid structure is using three layers of hexahedron structure, as shown in Figure 2.
Specifically, in staggered adjacent two layers hexahedron structure, the angular position lower surface of last layer hexahedron structure
It is set to next layer hexahedral edge position upper surface.As shown in Fig. 2, polyhedral structure 10 described in the present embodiment includes three layers
Hexahedron structure, respectively the first hexahedron structure 12, the second hexahedron structure 13, third hexahedron structure 14, three layer of six face
Body structure is staggered, wherein the edge position of the lower surface of the angular position of the first hexahedron structure 12 and the second six sided structures 13
Upper surface contact, the upper surface of the lower surface of the angular position of the second hexahedron structure 13 and the edge position of third six sided structures 14
Contact.In this way, heat can be assembled at the angular position of each layer of hexahedron structure, and to next layer of corner bit flow, chip
The conduction of generated heat horizontal homogeneous between every layer of hexahedron, the quick heat flowing of stabilization on substrate, in time
The heat for effectively reducing chip generation, prevents burning for chip.
In embodiments of the present invention, as shown in Fig. 2, the chip 2 of upside-down mounting is arranged among 12 top surface of the first hexahedron structure
In the cavity 121 of position, most of heat that the chip of upside-down mounting generates can all be passed through the first hexahedron knot by the setting of cavity
Structure conducts, it will be understood that the depth and size of cavity can carry out adaptability design with the specific size of chip.
The specific flowing of heat caused by the chip 2 of upside-down mounting is as shown in figure 4, fixed flip-chip 2 on substrate 1
The heat of generation is conducted to the first hexahedron structure 12 by the cavity 121 of the first hexahedron structure 12 first, due in fixation
Heat tends to fixed corner junction, and heat is conducted to six angular positions of the first hexahedron structure 12, simultaneously because first
Hexahedron structure 12 and the second hexahedron binding structure 13 are staggeredly placed, and the sectional area of the second hexahedron structure 13 is more than the one or six
The sectional area of face body structure 12, then six just with the second hexahedron structure 13 of six angular positions of the first hexahedron structure 12
Side location contacts, heat are conducted in six angular positions of the first hexahedron structure 12 to the edge position of the second hexahedron structure 13
Afterwards, continue to conduct to the angular position of the second hexahedron structure 13, similarly, the heat of the angular position of the second hexahedron structure 13 continues
Conduction, until then conduction distributes, such heat exists to the angular position of third hexahedron structure 14 into air or other media
Dynamic, the heat stablized flowing are generated in three layers of hexahedron structure, and uniformly the heat of chip can be conducted, prevent chip
Burn.In the embodiment of the present invention, every layer of hexahedron structure is by being welded to connect.It is appreciated that the hexahedron structure on substrate
Two layers of setting or more, such as 5 layers, 6 layers can be needed according to actual production, to obtain better heat dissipation effect.
As an embodiment of the present invention, the thermal coefficient of every layer of the polyhedral structure becomes smaller successively from top to bottom.
The material of suitable substrate can be chosen, can be metal, silicon, ceramics etc., the material of every layer of hexahedron structure is respectively difference
Material, thermal coefficient becomes smaller successively from top to bottom so that the heat that chip generates in two layers or more different thermal coefficients six
It is quickly conducted in the body structure of face.
As shown in Figures 2 and 3, three layers of hexahedron structure choose three kinds of different materials, and thermal coefficient is from the one or six face
Body structure 12 is followed successively by W1, W2, W3, and W1 to third hexahedron structure 14>W2>W3, thermal coefficient is bigger, and heat-transfer capability is got over
By force, in this way, the heat that chip generates can generate quick level flowing in three layers of hexahedron structure, be conducive to the quick of chip
Heat dissipation.
In embodiments of the present invention, the substrate and outside the substrate holder injection molding it is into a single integrated structure, for wrap up and
The board structure of fixing internal, material used in the outside support includes phenylpropanolamine HC1 PPA, polyester material PCT and ring
The materials such as oxygen moulding compound EMC.
As a preferred embodiment of the present invention, as shown in figure 5,3 bottom surface of the holder dew that the injection molding is into a single integrated structure
Go out the bottom surface of the undermost third hexahedron structure 14, meanwhile, also expose the electrode 11 on substrate, in order to electrically connect
It connects.Since the heat-transfer capability of plastics is smaller, the bottom surface of undermost hexahedron structure is exposed to holder in injection moulding process
Bottom surface is conducive to the heat dissipation of chip.
The embodiment of the present invention also provides a kind of LED light（Overall structure is being not shown in figure）, including above-mentioned heat dissipation is uniform
Exempt from packaged LED structure, wherein as shown in figure 3, being also covered with fluorescent powder 21 on the surface of the chip 2 of upside-down mounting, the coating is glimmering
Light powder method can be carried out spraying method or by way of pasting fluorescent powder membrane, select different fluorescent powders that can obtain difference
The light of color.Structure design through the invention, heat caused by LED light flip-chip pass through substantially staggered
Polyhedral structure is uniform, quickly distributes, and prevents burning for chip, ensures the performance of LED light.
Heat dissipation provided by the invention uniformly exempts from packaged LED structure, and it is poly- to tend to solid corner intersection using solid heat transfer
Two layers or more polyhedral structures staggeredly are arranged on substrate in the principle of collection, while making the sectional area of polyhedral structure from upper
Successively increase under, and export coefficient and successively reduce so that the heat that chip generates forms dynamic stability in polyhedral structure
Heat flowing, the temperature of chip is controlled effectively, it is therefore prevented that chip is burnt, ensure that exempt from packaged LED structure can
By property, at the same the present invention to exempt from packaged LED structure similar to traditional LED surface structures, can be widely applied to LED industry.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (5)
1. a kind of heat dissipation uniformly exempts from packaged LED structure, including substrate, upside-down mounting in the substrate chip and be arranged in substrate
The holder of periphery, which is characterized in that be provided on the substrate staggered for two layers or more to the chip cooling
Polyhedral structure；
The section of two layers or more staggered polyhedral structures becomes longer spread successively from top to bottom；
In staggered adjacent two layers polyhedral structure, the angular position lower surface of last layer polyhedral structure is set to next layer
Polyhedral edge position upper surface；
The corner bit architecture of polyhedral structure makes corner bit architecture of the heat caused by chip into next layer of polyhedral structure
Conduction；
The chip is set in the cavity of top layer's polyhedral structure top surface；
The substrate is disposed with the first polyhedral structure, the second polyhedral structure and third polyhedral structure from top to bottom；
The angular position lower surface of first polyhedral structure is contacted with the edge position upper surface of the second polyhedral structure, and described second
The angular position lower surface of polyhedral structure is contacted with the edge position upper surface of third polyhedral structure；
The heat that the flip-chip being fixed on substrate generates is conducted to the one or six by the cavity of the first hexahedron structure first
Face body structure, heat are conducted to six angular positions of the first hexahedron structure, the first hexahedron structure and the second hexahedron binding
Structure is staggeredly placed, and the sectional area of the second hexahedron structure is more than the sectional area of the first hexahedron structure, then the first hexahedron knot
Six angular positions of structure just with six side location contacts of the second hexahedron structure, six in the first hexahedron structure of heat
After angular position is conducted to the edge position of the second hexahedron structure, continue to conduct to the angular position of the second hexahedron structure, the two or six
The heat of the angular position of face body structure continues to conduct, until conduction is to the angular position of third hexahedron structure, then to air or
It is distributed in other media；
The material of every layer of hexahedron structure is respectively different material, and thermal coefficient becomes smaller successively from top to bottom so that chip produces
Raw heat quickly conducts in the hexahedron structure of two layers or more different thermal coefficients.
2. heat dissipation according to claim 1 uniformly exempts from packaged LED structure, which is characterized in that the substrate and the base
Holder injection molding outside plate is into a single integrated structure.
3. heat dissipation according to claim 2 uniformly exempts from packaged LED structure, which is characterized in that be molded into a single integrated structure
Cradle bottom surface exposes the bottom surface of lowest level polyhedral structure.
4. heat dissipation according to claim 1 uniformly exempts from packaged LED structure, which is characterized in that polyhedral structure is six faces
Body structure or octahedral structure.
5. a kind of LED light, which is characterized in that the LED light includes that the heat dissipation of Claims 1-4 any one of them is uniformly exempted from
Packaged LED structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510584263.6A CN105118912B (en) | 2015-09-15 | 2015-09-15 | A kind of heat dissipation uniformly exempts from packaged LED structure and LED light |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510584263.6A CN105118912B (en) | 2015-09-15 | 2015-09-15 | A kind of heat dissipation uniformly exempts from packaged LED structure and LED light |
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| Publication Number | Publication Date |
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| CN105118912A CN105118912A (en) | 2015-12-02 |
| CN105118912B true CN105118912B (en) | 2018-09-25 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814569A (en) * | 2009-02-23 | 2010-08-25 | Lg伊诺特有限公司 | Light emitting device package |
| CN201607152U (en) * | 2009-10-15 | 2010-10-13 | 苏州中泽光电科技有限公司 | Perforated multi-facet radiator |
| CN102661589A (en) * | 2012-04-13 | 2012-09-12 | 安徽瑞煌光电科技有限公司 | Laminated radiator for LED light source |
-
2015
- 2015-09-15 CN CN201510584263.6A patent/CN105118912B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814569A (en) * | 2009-02-23 | 2010-08-25 | Lg伊诺特有限公司 | Light emitting device package |
| CN201607152U (en) * | 2009-10-15 | 2010-10-13 | 苏州中泽光电科技有限公司 | Perforated multi-facet radiator |
| CN102661589A (en) * | 2012-04-13 | 2012-09-12 | 安徽瑞煌光电科技有限公司 | Laminated radiator for LED light source |
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| CN105118912A (en) | 2015-12-02 |
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Effective date of registration: 20180815 Address after: 518000 A, sixth industrial area, Tian Liao community, Gongming street, Guangming New District, Shenzhen, Guangdong. Applicant after: Shenzhen SKYWORTH Optical Technology Co., Ltd. Address before: 518108 the two or three, four and the first floor of the R & D building of SKYWORTH science and Technology Industrial Park, Baoan District Road, Shiyan Road, Baoan District, Shenzhen. Applicant before: Skyworth LCD Modules (Shenzhen) Co., Ltd. |
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